JPH01224639A - Temperature cycle device - Google Patents

Abstract

PURPOSE:To improve the temperature distribution in a test chamber by providing dampers and arranging the damper which faces a 1st opening part in parallel to a direction connecting both openings of the test chamber at a 2nd position. CONSTITUTION:Plural dampers 6 are provided at the border between a low- temperature air conditioning chamber 3 and an air passage 2. Those dampers 6 are supported rotatably on a device frame so that they can rotate between a 1st position F where the air conditioning chamber 3 is closed and the 2nd position S where they open the air conditioning chamber 3 and are substantially in a direction A. For high-temperature exposure, the dampers 6 are set at a position F and the air conditioning chamber 3 is closed. For low-temperature exposure, on the other hand, the dampers 6 are all opened together at a position S, part of the air conditioning chamber 3 faces an air passage part 22, and the remaining part faces the opening part 11. Thus, the temperature distribution in the test chamber is improved.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides a method for exposing various materials, equipment, or their parts, etc. to different temperature atmospheres in a predetermined cycle, or applying thermal shock to these materials, etc. The present invention relates to a temperature cycle device used to test changes in properties against heat, durability, etc. of materials, or to perform screening.

[Conventional technology]

There are various types of temperature cycle devices of this type, but among them, one that does not require moving the sample etc. and is advantageous in terms of its simple structure is, for example, the one disclosed in Japanese Patent Publication No. 59-20096. There is a device as disclosed in the official gazette.

That is, first and second ventilation openings are provided at both ends of the test chamber, a ventilation path is formed that communicates the two openings with the outside of the test chamber, and a portion of the ventilation path facing the first opening is provided with a first and second ventilation opening. A low-temperature air conditioning room is provided adjacent to the air conditioning room, and a gas circulation device and a heater for guiding gas from the second opening to the first opening are provided in an upstream portion of the adjacent portion of the air conditioning room, and the air passage and the low-temperature air conditioning At the border with the chamber, two devices can be installed,
In the first position, the low-temperature air conditioning chamber is closed and the air passage gas is guided directly to the first opening, and in the second position, the low-temperature air conditioning chamber is opened and the air passage gas is guided through the air conditioning chamber to the first opening. 1st
This is a temperature cycle device equipped with a damper that leads to the opening.

[Problem to be solved by the invention]

However, with this type of temperature cycle device, when blowing gas at a predetermined temperature into the test chamber, the damper gets in the way and cannot supply sufficient air volume for the size of the test chamber, making it difficult to reach the predetermined temperature of the sample in the test chamber. This problem is particularly noticeable when low-temperature gas is supplied, and is particularly problematic when conducting thermal shock tests. In addition, the damper becomes a nuisance, making it difficult to obtain rectified or laminar flow within the test chamber, resulting in a disadvantage that the temperature distribution within the test chamber deteriorates accordingly.

Therefore, the present invention provides a temperature cycle device of the type described above, which can supply a desired air volume into the test chamber commensurate with the size of the test chamber, and also provides a temperature cycle device that can provide a better temperature distribution in the test chamber than the conventional device. The purpose is to provide equipment.

[Means to solve the problem]

In accordance with the above object, the present invention provides first and second
A ventilation opening is provided, a ventilation path is formed outside the test chamber that communicates both the openings, and a low-temperature air-conditioned room is provided adjacent to a portion of the ventilation path facing the first opening, and a low-temperature air-conditioned room is provided adjacent to the air-conditioned room. A gas circulation device and a heater for guiding gas from the second opening to the first opening are provided in an upstream portion of the installation portion, and two devices are provided at a boundary between the ventilation path and the low-temperature air conditioning room. In a first position, the low temperature air conditioning chamber is closed and the air passage gas is guided directly to the first opening, and in a second position, the low temperature air conditioning chamber is opened and the air passage gas is guided into the air conditioning chamber. In the temperature cycle device, a plurality of the dampers are provided, and at least one of the plurality of dampers facing the first opening is placed in the second position of the temperature cycle device. The present invention provides a temperature cycle device characterized in that the temperature cycle device is arranged parallel or substantially parallel to a direction connecting both the openings in the chamber.

Each of the dampers may be a flat plate-shaped damper having a vacuum hollow portion that exhibits a heat insulating effect, and may be formed thin to provide less resistance to airflow.

The low-temperature air-conditioned room is equipped with a fin-tube evaporator, and the fins of the evaporator are arranged parallel or substantially parallel to the direction connecting both openings in the test chamber to create a rectified or laminar flow within the test chamber. may be made easier to obtain.

Furthermore, if necessary, a subcooler may be provided to act on the test chamber.

[For production]

According to the temperature cycle device of the present invention, by switching the damper, the gas in the ventilation passage is supplied directly into the test chamber without passing through the low-temperature air-conditioning room, or through the low-temperature air-conditioning room, and when the gas is directly supplied, the gas in the passage is heated. A predetermined high temperature gas is
When passing through the low-temperature air conditioned room, a predetermined low-temperature gas is supplied.

Furthermore, when the subcooler is provided, this subcooler can be used to lower the temperature to a predetermined temperature when switching the test chamber from a high temperature atmosphere to a low temperature atmosphere, and can be used to lower the temperature to a predetermined temperature when switching from a low temperature atmosphere to a high temperature atmosphere. This can be used as a heat pump type heating source to increase the temperature.

〔Example〕 Embodiments of the present invention will be described below with reference to the drawings.

The temperature cycle apparatus shown in FIG. 1 includes a test chamber 1, a ventilation path 2 connected to the test chamber, and a low-temperature air-conditioned room 3 connected to the ventilation path.

The test chamber 1 can be opened and closed with a door 10, and has a first opening 11 at the right end in the figure and an opening 12 at the left end.

Both openings are opposite each other. A suitable protective member 111 such as a net, a perforated plate, a grid, etc. is stretched over the opening 11. The protective member may have a rectifying effect.゛The ventilation passage 2 extends from the opening 12 through the back of the test chamber 1 in the shape of an opening 11, and faces the portion 23 facing the opening 12, the rear portion 22 of the test chamber, and the opening 11. A portion 21 is provided.

A fan 4 for gas circulation is disposed in a portion 23 of the ventilation passage 2, and the fan sucks gas in the test room through the opening 12 and discharges it toward the opening 11 when driven by a motor (not shown). .

Further, an electric heater type heater 5 is disposed in a portion 22 of the ventilation path 2, and the heater heats the gas passing therethrough to a predetermined temperature when supplying high-temperature gas to the test chamber. Note that this heater may be one that can also be used to adjust the low temperature gas temperature.

The low-temperature air-conditioned room 3 is located adjacent to the portion 21 of the air passage 2, and includes a fin-tube evaporator 31 therein.

The evaporator opens from the opening 1 from a position facing the section 22 of the ventilation passage.
1, and the gas entering the low-temperature air conditioning room 3 from the portion 22 is pre-cooled in a portion of the evaporator. Note that the evaporator does not necessarily need to face the ventilation path portion 22.

The plate fins 311 of the evaporator are made of a copper plate and are all arranged substantially parallel to the direction A connecting both openings in the test chamber. Further, the fins are formed to have a thickness of about 0.6 to 2 Omm, or about 0.7n+n+ in this example, so that they can also serve as a cold storage material.

In addition, the fin material may be a copper plate, an aluminum plate, a stainless steel plate, etc. When these materials are used and they also serve as a cold storage material, a thickness of approximately 0.6
~2.0 mm is appropriate.

To prevent frost from forming on the fins and reducing ventilation, the fin pitch is approximately 3 to 6 mm, in this example approximately 3M.
It is said that

In the past, when the low-temperature air-conditioned room was on standby, gas was circulated within the air-conditioned room to store cold in a regenerator installed separately from the evaporator. , there is no need for this, and the structure can be simplified accordingly.

Furthermore, the fins 311 are fitted with a cooling refrigerant pipe 312 in a conventional manner, as well as a pipe 313 through which hot gas for temperature adjustment is passed.

Although this hot gas pipe 313 is not necessarily required, if it is provided here, it can be used to adjust the evaporator temperature when the low temperature air conditioned room is on standby.

Behind the evaporator 31, a distribution device 32 is provided for uniformly distributing gas to each part of the evaporator. As a result, the gas entering the low-temperature air-conditioned room from the air passage portion 22 is sufficiently cooled by the evaporator and uniformly blown out into the test chamber 1 from the entire opening 11.

In the device shown in FIG. 1, the distribution device is composed of parallel rectifier plates of successive lengths, but it may also be a suitable duct 33 as shown in FIG. An appropriate baffle plate 34 may be used.

Behind the part of the evaporator 31 facing the ventilation path part 22, as shown in FIG.
can be provided as necessary.

Now, returning to the device shown in FIG. 1, the device further includes:
A plurality of dampers 6 are provided at the boundary between the low temperature gas supply chamber 3 and the ventilation path 2.
is provided.

Each damper is formed into a flat plate shape that is thinner than dampers generally employed in conventional devices, and the inside thereof is a vacuum hollow portion with an appropriate degree of vacuum, and has a heat insulating effect.

By creating a vacuum hollow inside in this way, compared to the conventional case where glass wool or the like is used to provide a heat insulating effect,
Since the damper can be made thin and have the same level of heat insulation effect, it is convenient for obtaining smooth airflow.

Each damper 6 is attached to the device frame so that it can rotate between a first device F that closes the low-temperature air conditioning room 3 and a second device S that opens the low-temperature air conditioner 3 and assumes a posture substantially parallel to the direction A. It is rotatably supported, and although not shown, for example,
By fixing a pinion to the end of each damper shaft, meshing one rack with all the pinions, and reciprocating the rack using an air cylinder or other suitable drive device, the damper can be opened and closed simultaneously.

Although the damper 6 shown in FIG. 1 has a pivot point P at one end, a pivot point Q may be provided at the center or elsewhere as shown in FIG. 2.

A subcooler 7 is disposed within the test chamber 1 at a position facing the second opening 12.

The subcooler is composed of a fin-tube type evaporator, made of the same material as the evaporator 31 of the low-temperature air conditioner, and has a lighter structure than the evaporator 31. This lightweight structure is designed to prevent a large heat capacity load from occurring when the temperature rises or falls. Also, all of the fins are substantially parallel to the direction A.

The subcooler 7 is incorporated into a known refrigeration circuit (not shown) so that it can be used as a cooler or as a heat pump type heater.

Furthermore, the refrigerant in the subcooler can be extracted at any time by means of a pump down (out) operation means.

Note that the position of the subcooler is not necessarily limited to the illustrated position.

According to this temperature cycle device, the gas temperature within the test chamber 1 is controlled as follows. Note that the gas circulation fan 4 is operated in any case of temperature exposure.

The Todoroon Jonotan damper 6 is placed in the first device F shown by the solid line in FIG.
The low temperature air conditioned room 3 is closed. The heater 5 is operated, and thereby the heated gas is circulated sequentially through the section 21 of the air passage 2, the opening 11, the test chamber 1, the opening 12, the air passage section 23, and the air passage section 22.

In addition, the subcooler 7 is used as a heat pump type heater, and as shown in FIG. to obtain the predetermined temperature T2.

By using the subcooler in this way, it is possible to save energy, reduce the heater capacity of the heater, reduce the heat capacity load of the subcooler when the temperature rises, and improve the temperature rise performance.

When stopping the operation of the subcooler, it is desirable to extract the refrigerant inside to reduce the load.

The abrasive Lu1 is set, the heater 5 is stopped, and the subcooler 7 is operated as a cooler, and the gas is circulated in the same way as when exposed to high temperatures.
As a result, as shown in FIG. 5, a predetermined temperature t
The temperature is lowered to 1 (-room temperature, for example) using only the subcooler.

Thereafter, the damper 6 is moved to the second device S (shown in phantom lines in FIG. 1).
They open all at once in direction A) so that a part of the low-temperature air-conditioned room 3 faces the ventilation passage section 22 and the rest faces the opening 11.

In this way, the low temperature gas is circulated from the air conditioned room 3 to the air conditioned room 3 again via the air passage section 21, the opening 11, the test chamber 1, the opening 12, the air passage section 23, and the air passage section 22.

The low-temperature air-conditioned room continues to operate during the standby period prior to this low-temperature exposure.
Cool is stored in the evaporator fins 311 in advance, and the low temperature air conditioned room 3
When the temperature is opened, the temperature is rapidly lowered to a predetermined temperature TI using the cold storage effect.

Note that the operation of the subcooler 7 may be stopped at the same time as the use of the low-temperature air-conditioned room 3 starts, or it may be temporarily operated in combination depending on the capacity of the cooler.

Furthermore, when stopping the operation of the subcooler 7, it is desirable to extract the internal refrigerant so that it does not become a heat capacity load.

By using the sub-cooler 7 in this manner, the overall temperature can be rapidly lowered to the predetermined temperature T1.

By keeping the low-temperature air-conditioned room 3 closed with a damper 6 and using the sub-rough continuously or intermittently as a cooler or heat pump type heater, the test room is exposed to room temperature to medium temperature. be able to.

In this case, there is no need to open the test chamber or introduce outside air into the test chamber, so the cleanliness inside the test chamber can be maintained at a correspondingly high level. Furthermore, the environment at the location where the device is installed is not disturbed.

Each exposure operation is as explained above.
In order to prevent frost from forming on the cooler 7 during operation, dry gas may be supplied from an appropriate location such as the low-temperature air conditioning room 3, if necessary. As the drying gas supply means, a known chemical dryer, a dryer using a refrigeration circuit, or the like can be employed. In the case of a dryer using a refrigerating circuit, the refrigerating circuit including the evaporator 31 and the refrigerating circuit including the cooler 7 may be used as appropriate.

In the high-temperature exposure and medium-temperature exposure, gas at a predetermined temperature is supplied into the test chamber with a large air volume from the state in which the air passage portion 21 is filled or substantially filled, through the entire area of the opening 11, so that the temperature in the test room is lowered. can quickly reach a predetermined temperature.

Furthermore, the temperature distribution within the test chamber is also improved.

When the low-temperature air-conditioned room 3 is used for low-temperature exposure, the damper 6 is opened parallel to the direction A, and the low-temperature air-conditioned room 3 is opened wide with respect to the opening 11, so that the gas in the air-conditioned room is brought with a large air volume. Moreover, it flows into the test chamber in a laminar flow state, and the test chamber quickly reaches a predetermined temperature. Furthermore, the temperature distribution within the test chamber is also improved.

[Effects of the Invention] According to the present invention, first and second ventilation openings are provided at both ends of a test chamber, a ventilation path is formed that communicates both openings with the outside of the test chamber, and one of the ventilation paths is , a gas circulation device and a heater in which a low-temperature air conditioner is provided adjacent to a portion facing the first opening, and a gas is guided from the second opening to the first opening in an upstream portion of the portion adjacent to the air conditioner; may be provided, and two devices may be provided at the boundary between the ventilation path and the low-temperature air conditioned room, and in a first position, the low-temperature air-conditioned room is closed and the ventilation path gas is directly directed to the first opening. The temperature cycle device is equipped with a damper that opens the low-temperature air conditioning chamber at a second position and guides the air passage gas through the air conditioning chamber to the first opening, and enters the test chamber commensurate with its size. The present invention has the effect of providing a temperature cycle device that can supply a desired amount of air to quickly bring the temperature in the test chamber to a desired temperature, and can provide a better temperature distribution in the test chamber than conventional devices.

When each of the dampers is a flat plate-shaped damper having a vacuum hollow portion, the damper can be formed to be lightweight and thin so as to have less resistance to airflow, and to have a desired heat insulation effect. It has the advantage of being able to

When a subcooler is installed to serve the test chamber,
When changing the temperature, there is an advantage that the test chamber can quickly reach a predetermined temperature.

[Brief Description of the Drawings] The drawings show embodiments of the present invention. Fig. 1 is a schematic sectional view of one embodiment, Fig. 2 is a schematic sectional view of the vicinity of a low-temperature air conditioned room of another embodiment, and Fig. FIG. 3 is a schematic cross-sectional view of a low-temperature air-conditioned room according to another embodiment, FIG. 4 is a temperature rise graph when exposed to high temperatures, and FIG. 5 is a temperature drop graph when exposed to low temperatures. DESCRIPTION OF SYMBOLS 1... Test chamber, 11... 1st opening, 12... 2nd opening, 2... Ventilation path, 21-23... Part of ventilation path, 3... Low-temperature air conditioning Chamber, 31...Evaporator, 311...Fin, 4...Fan, 5...Heater, 6...Damper, 7...Subcooler. Applicant Tabai Espec Co., Ltd. Figure 1 Figure 5

Claims (3)

[Claims] (1) Provide first and second ventilation openings at both ends of the test chamber,
A ventilation path is formed outside the test chamber that communicates the two openings, and a low-temperature air conditioning chamber is provided adjacent to a portion of the ventilation path facing the first opening, and a portion upstream of the portion adjacent to the air conditioning chamber is provided. A gas circulation device and a heater may be provided for guiding gas from the second opening to the first opening, and two devices may be provided at the boundary between the ventilation path and the low-temperature air conditioning room, a first
At a position, the low temperature air conditioning chamber is closed and the air passage gas is guided directly to the first opening, and at a second position, the low temperature air conditioning chamber is opened and the air passage gas is guided through the air conditioning chamber to the first opening. In the temperature cycle apparatus, a plurality of the dampers are provided, and at least one of the plurality of dampers facing the first opening is placed in a second position of the damper that leads to the first opening 9 in the test chamber. A temperature cycle device characterized in that the temperature cycle device is arranged parallel or substantially parallel to a direction in which the two are connected. (2) The temperature cycle device according to claim 1, wherein each of the dampers is a flat plate damper having a vacuum hollow portion. (3) The temperature cycle device according to claim 1 or 2, further comprising a subcooler provided so as to act on the test chamber.