JPH01222861A - Surface polishing device - Google Patents

Abstract

PURPOSE:To ensure a cooling effect by forming a cooling chamber along a receiving groove for collecting an abrasive material, connecting the cooling chamber to a refrigerant source, and cooling the abrasive material while it is flowing in the receiving groove. CONSTITUTION:A slurry like abrasive material is fed to a rotating surface plate 11 by means of a nozzle 21 to polish a workpiece 17 which is pressed against the top of the surface plate 11. The abrasive material the temperature of which is raised by this polishing is collected from the periphery of the surface plate 11 into a receiving groove 26 linked to an abrasive-material tank 22 and circulated into the tank 22. A cooling chamber 27 is partitioned off on the lower portion of the receiving groove 26 along the receiving groove 26, the inlet 32 and outlet 34 of a refrigerant are connected to both sides of a partition wall partitioning the cooling chamber 27, and the refrigerant is circulated from a refrigerant tank 31 into the cooling chamber 27 by means of a pump 33. By this structure, the abrasive material is cooled while flowing in the receiving groove 26 and, together with the effect of the cooling pipe 35 in the abrasive- material tank 22, the cooling material can be sufficiently cooled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a surface polishing apparatus that polishes a workpiece by bringing it into pressure contact with a rotating surface plate.

[Prior Art] In general, a surface polishing device is configured to press a workpiece against a surface plate that rotates once, and polish the workpiece while supplying slurry-like abrasive. At this time, the abrasive is supplied from a tank. After being pumped up and supplied to the surface plate, it is collected back into the tank and reused, so it is used cyclically.

However, when polishing the work, heat is generated due to friction between the work and the surface plate, so the temperature of the supplied abrasive increases, and the range of temperature rise gradually increases as the polishing agent is repeatedly used. As a result, there is a problem in that the high-temperature abrasive accelerates thermal deformation of the workpiece and surface plate, reducing polishing accuracy.

Therefore, in the past, a coil-shaped cooling pipe was provided in the storage tank for the abrasive, and a refrigerant such as water was supplied into the cooling pipe to cool the abrasive, but it took a relatively long time to cool the abrasive. As a result, it is often pumped up and reused before it has cooled down sufficiently, and the actual situation is that the polishing accuracy has not been sufficiently improved.Especially in recent years, semiconductor wafer , extremely high polishing precision is now required when polishing vacuum equipment, etc.
In order to meet these demands, temperature control of the abrasive is extremely important.

[Problems to be Solved by the Invention] An object of the present invention is to provide a flat surface polishing apparatus that can reliably cool a polishing agent whose temperature has increased due to use in polishing.

[Means for Solving the Problems] In order to solve the above problems, the present invention is configured to press a workpiece against a rotating surface plate and polish the workpiece while circulating a slurry-like polishing agent. The present invention is characterized in that a cooling chamber for cooling the supplied abrasive is formed along a receiving groove for recovering the abrasive, and the cooling chamber is connected to a coolant source.

[Function] The polishing agent supplied to the surface plate during polishing of a workpiece is collected by flowing into the receiving groove, pumped up again, and used cyclically.

On the other hand, the cooling chamber formed along the receiving groove is supplied with a coolant from a coolant source, and when the abrasive whose temperature has increased due to being used for polishing flows into the receiving groove, it is absorbed into the receiving groove. It is cooled while flowing through the groove, and the lowered temperature is collected in a tank. In this case, since the flow rate of the abrasive in the receiving groove is not so large, the abrasive is cooled very efficiently.

[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.

In FIG. 1, 10 is the body of a flat surface polishing apparatus,
All are integrally fixed to the surface plate support 12 which is rotatably supported by the body 10 with a bearing 13, and the surface plate support!
The second rotating shaft 12a is connected to a drive source (not shown).

Further, above the surface plate 11, a pressure plate 15 is supported so as to be movable up and down by an air cylinder 14 fixed to the body 1o, and a mounting block 18 is detachably attached to the lower surface of the pressure plate 15. A workpiece 17 attached to the mounting block 16 is pressed against the surface plate 11 by the cylinder 14 and polished.

The cylinder 14 is connected to a compressed air source 18 via an air pressure regulating valve 18 that raises and lowers a pressure plate 15 and controls machining pressure.

In the machine body 10, a nozzle 21 for supplying slurry-like abrasive to the upper surface of the surface plate 11 is installed vertically above the center of the surface plate 11, and the nozzle 21 and the abrasive tank 22 are connected via a pump 23. They are connected by an abrasive supply pipe 24, and on the other hand,
Around the surface plate 11 of the machine body 10, an annular receiving groove 2B is formed to surround the surface plate 11 and collect the abrasive flowing out from the surface plate I+ and collect it in the abrasive tank 22. The abrasive tank 22 is connected to the abrasive tank 22 by an abrasive recovery pipe 25. Part II! A cooling chamber 27 is partitioned along the receiver 11112B in the lower part of the cooling chamber 2B, and as is clear from FIG. A refrigerant inlet 29 and an outlet 30 are formed on both sides, and the inlet 29 is connected to a refrigerant tank 31 which is a source of refrigerant such as water via a pump 33 by a refrigerant supply pipe 32.
The outlet 30 is connected to the refrigerant tank 31 by a refrigerant recovery pipe 34.
The refrigerant tank 31 is connected to the refrigerant tank 31 so that the refrigerant in the refrigerant tank 31 is used cyclically. Furthermore, a cooling pipe 35 is provided within the abrasive tank 22 .

In the illustrated embodiment, the bottom surface of the receiving groove 2B is formed in a V-shape, but it goes without saying that it may be in other shapes such as a flat shape or a U-shape.

Next, the operation of the surface polishing apparatus having the above configuration will be explained.

The workpiece 17 attached to the mounting block 16 on the lower surface of the pressure plate 15 is pressed against the upper surface of the surface plate 11 which rotates once with a constant pressure by the cylinder 14, and is polished by the surface plate 11. At this time, constant f! 11
An abrasive pumped up from an abrasive tank 22 is supplied to the upper surface of the surface plate 1 through a nozzle 21, and this abrasive flows into the receiving groove 2B from the outer periphery of the surface plate 11 and then flows into the abrasive recovery pipe 25. is collected into the abrasive tank 22 by
It is pumped up again and sent to the nozzle 21, and is used cyclically.

On the other hand, a cooling chamber 27 formed along the receiving groove 26 is supplied with a refrigerant from a refrigerant tank 31 through a refrigerant supply pipe 32, and the polishing agent whose temperature has increased due to being used for polishing is transferred to the surface plate 11. When the abrasive flows into the receiving groove 2B from the outer circumference of the abrasive, the abrasive is cooled by the refrigerant while flowing through the receiving groove 26 and flowing out to the refrigerant recovery pipe 34, and is recovered in the abrasive tank 22. Then, it is cooled again by the cooling pipe 35 in the abrasive tank 22, and after being cooled to a predetermined temperature, it is pumped up and reused.

In this case, since the flow rate of the abrasive in the receiving groove 2B is not so large, its cooling efficiency is very good, and by controlling the flow rate and temperature of the refrigerant flowing through the cooling chamber 27, it can be cooled to almost the allowable temperature. You can also do that. f, if cooling by this cooling chamber 27 is sufficient, there is no need to provide the cooling pipe 35 in the abrasive tank 22.

Although not shown, the above surface plate! A cooling chamber may be provided inside the polishing chamber 1, and a coolant such as cooling water may be supplied into the cooling chamber to prevent the surface plate 11 and the workpiece 17 from being thermally deformed due to heat generated during polishing. can.

[Effect of the invention] Thus, according to the surface polishing apparatus of the present invention.

A cooling chamber is formed along the receiving groove for collecting the abrasive supplied to the surface plate, and the collected abrasive is cooled while flowing through the premises, so it is more efficient than when it is in a tank. By intensively cooling the abrasive in a small flow rate, the cooling can be performed reliably and efficiently.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a main part of an embodiment of the present invention, and FIG. 2 is a cross-sectional plan view of a receiving groove. 11・φ Surface plate, 17@・Workpiece, 28・Installing groove, 27・Cooling room, 31—Cold tofu tank.

Claims (1)

[Claims] 1. In a device in which a workpiece is pressed against a rotating surface plate and the workpiece is polished while being cyclically supplied with a slurry-like abrasive agent, along a receiving groove for collecting the supplied abrasive agent. forming a cooling chamber for cooling the abrasive;
A surface polishing apparatus characterized in that the cooling chamber is connected to a refrigerant source.