JPH01218794A - Brazing filler metal for insulation-coated copper wire and joining method thereof - Google Patents
Brazing filler metal for insulation-coated copper wire and joining method thereofInfo
- Publication number
- JPH01218794A JPH01218794A JP4437888A JP4437888A JPH01218794A JP H01218794 A JPH01218794 A JP H01218794A JP 4437888 A JP4437888 A JP 4437888A JP 4437888 A JP4437888 A JP 4437888A JP H01218794 A JPH01218794 A JP H01218794A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- brazing filler
- joining
- copper wire
- carbide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 28
- 239000000945 filler Substances 0.000 title claims abstract description 26
- 238000005304 joining Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 11
- 238000009413 insulation Methods 0.000 title abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 8
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 7
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052745 lead Inorganic materials 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 23
- 239000000126 substance Substances 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 101150033765 BAG1 gene Proteins 0.000 claims description 2
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000005416 organic matter Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 150000001721 carbon Chemical class 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明３１表面力゛有機物９°よりて絶竺被覆さオ゛た
エナメル銅線の接合用ろう材及びその接合方法に係り、
特に銅線の表面が有機物によって絶縁被覆された状態で
接合するのに好適な接合用ろう材及びその接合方法に関
する。[Detailed Description of the Invention] [Industrial Application Field] The present invention 31 relates to a brazing material for joining enamelled copper wires coated with an organic material with a surface strength of 9° and a method for joining the same,
In particular, the present invention relates to a brazing material for bonding suitable for bonding copper wires whose surfaces are insulated with an organic substance, and a method for bonding the same.
従来、電気絶縁用に有機物が被覆されたエナメル銅線等
の接合法として、エナメル質を機械的、または、化学的
に除去後、軟ろう、硬ろう、または、抵抗溶接法等によ
り他の部材と接合している。Traditionally, enamelled copper wires coated with organic materials for electrical insulation have been joined together by mechanically or chemically removing the enamel, and then being bonded to other parts using soft soldering, hard soldering, or resistance welding. It is joined with.
このため、除去工程に時間がかかり、能率的に接合する
ことが不可能であった。また、有機物を除去せずに接合
する方法として、特公昭５０−１８９４０号、及び、特
公昭５０−１８９４０号公報に開示されるように銅線を
予め形成した導体端子のＵ字溝に入れ、両端子間を加圧
し娩がら漏電加熱する方法が提案されている。For this reason, the removal process took time and it was impossible to join efficiently. In addition, as a method of bonding without removing organic substances, as disclosed in Japanese Patent Publication No. 50-18940 and Japanese Patent Publication No. 50-18940, a copper wire is inserted into a U-shaped groove of a pre-formed conductor terminal. A method has been proposed that applies pressure between both terminals and generates electrical leakage heating during calving.
つまり、抵抗加熱であるため、通電時間も短く、完全な
金属接合はできていない。In other words, since resistance heating is used, the current application time is short, and perfect metal bonding cannot be achieved.
しかし、この従来方法では絶縁被覆された有機物が炭化
し、接合部に残り信頼性の高い接合部が得られないとい
う問題があった。However, this conventional method has the problem that the organic substance coated with the insulation is carbonized and remains in the joint, making it impossible to obtain a highly reliable joint.
すなわち、カーボンは金属とのぬれ性が悪く、接合強度
を下げる。That is, carbon has poor wettability with metal and reduces bonding strength.
上記従来技術は銅線等に有機物材が被覆された状態で能
率的に信頼性の高い接合部を得る点が考慮されておらず
、接合方法に問題があった。The above-mentioned conventional technology does not take into consideration the point of efficiently obtaining a highly reliable joint in a state where a copper wire or the like is coated with an organic material, and there is a problem in the joining method.
本発明の目的は、この従来技術の問題点を解決すること
にある。An object of the present invention is to solve the problems of the prior art.
上記目的は銅線の表面に絶縁被覆された有機物が接合時
の加熱によって炭化し、炭素と反応して炭化物を形成す
る元素をろう材、または、接合部のいずれか一方に添加
することにより達成される。The above purpose is achieved by adding an element that reacts with carbon to form carbide when the organic substance insulatingly coated on the surface of the copper wire is carbonized by heating during bonding, and is added to either the brazing material or the bonding part. be done.
すなわち、有機物が熱分解して接合部、または、ろう材
中に残した炭素をろう材中、または、接合部に添加した
炭化物形成元素と反応させて炭化〒とすることにより達
成される。That is, carbonization is achieved by causing the carbon left in the joint or the brazing material by thermal decomposition of the organic matter to react with a carbide-forming element added to the brazing material or the joint to form carbonization.
銅線の表面に絶縁被覆された有機物は、接合時の加熱に
よって熱分解して炭素となる。この炭素はろう材中に添
加した炭化物形成元素と反応して炭化物を形成する。The organic substance coated on the surface of the copper wire is thermally decomposed into carbon by heating during bonding. This carbon reacts with carbide-forming elements added to the brazing material to form carbides.
従って、有機物が炭化した炭素は銅線の表面及びろう材
中に炭素の状態で残らず炭化物の状態でろう材中、また
は、接合部に混入する。更に、炭化物とした後、接合部
を加圧することにより排出することもできる。このため
、銅線の表面とろう材との接□触状態が改善され、銅線
とろう材との良好な金属的接合が達成される。Therefore, the carbon obtained by carbonizing the organic matter does not remain in the carbon state on the surface of the copper wire or in the brazing material, but instead enters the brazing material or the joint in the form of carbide. Furthermore, after being made into a carbide, it can be discharged by pressurizing the joint. Therefore, the contact condition between the surface of the copper wire and the brazing material is improved, and a good metallic bond between the copper wire and the brazing material is achieved.
また、炭化物はろう材中に極端に多く混入しないかぎり
、強度劣化が生じないことも確認できた。It was also confirmed that strength deterioration does not occur unless carbide is mixed into the brazing filler metal in an extremely large amount.
本発明を達成するためのろう材はＡｇとＣｕとを主成分
とするＪＩＳ規格ＢＡｇ−１〜Ｂ ”Ａ ｇ −８に相
当する銀ろう、ＣｕとＰを主成分とし、−部Ａ’ｇを含
むＪＩＳ規格ＢＣｕＰ−１〜ＢＣｕＰ−５に相当する燐
銅ろう、ＣｕとＺｎを主成分とするＪＩＳ規格Ｂ Ｃｕ
’Ｚ ｎ −０”Ｂ Ｃ”’ｕ Ｚ’ｎ −７に相当
する黄銅ろう、ＡｕとＣｕを主成分とするＪＩＳ規格Ｂ
Ａｕ−１−ＢＡｕ−１２に相当する金ろう、ＳｎとＰｂ
を主成分とするはんだ材が望ましい。The brazing material for achieving the present invention is a silver solder corresponding to JIS standard BAg-1 to BAg-8 which contains Ag and Cu as main components, and a - part A'g which contains Cu and P as main components. Phosphorous copper solder corresponding to JIS standard BCuP-1 to BCuP-5 including JIS standard B Cu whose main components are Cu and Zn.
'Z n -0''B C'''u Brass solder equivalent to Z'n -7, JIS standard B whose main components are Au and Cu
Gold wax corresponding to Au-1-BAu-12, Sn and Pb
A solder material whose main component is
これらろう材中に添加する炭化物形成元素はＴｉ、Ｚｒ
、Ｈｆ、Ｖ、Ｃｒ、Ｍｎ、Ｆｅ、Ｎｂ。The carbide-forming elements added to these brazing filler metals are Ti and Zr.
, Hf, V, Cr, Mn, Fe, Nb.
Ｍｏ’、Ｆｅ、Ｔａが望ましい。Mo', Fe, and Ta are preferable.
ろう材のいずれか一種に、炭化物形成元素の中から選ば
れる元素の合計が０．１〜１０ｗ’ｔ％になるように添
加することが望ましい。It is desirable that the total amount of elements selected from carbide-forming elements be 0.1 to 10 wt % to any type of brazing filler metal.
特に、ＣｕとＡｇを主成分とする銀ろう中にＴ］および
／またはＺｒを０ 、１〜１０ ｗ ｔ％添加したろう
材が望ましい。 □なお、０．１ｗｔ％以下
では本発明の効果がなく、１０ｗｔ％以上ではろう材、
または、接゛合部が脆化するため望ましくない。またろ
う材中への炭化元素の添加方法は、ろう材を製造時に合
金として添加する他にろう材の表面、または、銅線の表
面に炭化物形成元素を物理的、化学的方法によってコー
テイジグしてもよい。また、ろう材が粉末の場合は、炭
化元素も粉末にしてろう材と混合し、銅線の接合部に配
置してもよい。Particularly desirable is a brazing material in which 0.1 to 10 wt% of T] and/or Zr are added to a silver solder whose main components are Cu and Ag. □Note that below 0.1 wt%, the present invention has no effect, and above 10 wt%, the brazing filler metal,
Otherwise, the joint becomes brittle, which is undesirable. In addition to adding carbide elements to the brazing filler metal as an alloy during production, the carbide-forming elements are coated on the surface of the brazing filler metal or the surface of the copper wire by physical or chemical methods. Good too. Further, when the brazing material is a powder, the carbide element may also be powdered and mixed with the brazing material, and then placed at the joint of the copper wires.
炭化物形成元素が添加混合、または、コーティングされ
たろう材を有機物によって被覆された銅線の接合部に配
置してろう材の融点以上に加熱して接合する。加熱は大
気中でも良いが、特に、非酸化性雰囲気中が望ましい。A brazing filler metal mixed with or coated with a carbide-forming element is placed on a joint of copper wires coated with an organic substance, and the brazing filler metal is heated to a temperature higher than the melting point of the brazing filler metal to join them. Heating may be carried out in the air, but it is particularly desirable to heat in a non-oxidizing atmosphere.
加熱によって有機物は炭化する。この炭素とろう材中の
炭化物形成元素は瞬時に反応し、炭化物となってろう材
中に混在する。Organic matter is carbonized by heating. This carbon reacts with carbide-forming elements in the brazing filler metal instantaneously to form carbides that are mixed in the brazing filler metal.
〈実施例Ｉ〉
ポリイミド樹脂により表面が絶縁被覆された直径３ ｍ
ｍのエナメル銅線をモータの端子に接合するに際し、７
２ｗｔ％Ａ ｇ −２８ｗ ｔ％Ｃｕの銀ろう中に３
ｗ ｔ％のＴｉを添加した粉末状のろう材を用いた。こ
のろう材をエナメル銅線と端子との間に配置しポリイミ
ド樹脂を除去せずに７８０℃以上に加熱して接合した。<Example I> Diameter 3 m with surface insulating coated with polyimide resin
When joining m enameled copper wire to the motor terminal, 7
3 in silver solder of 2wt%A g -28wt%Cu
A powdered brazing filler metal to which wt% of Ti was added was used. This brazing material was placed between the enamelled copper wire and the terminal, and the wires were heated to 780° C. or higher to join without removing the polyimide resin.
接合部の断面を観察した結果、有機物は接合時の加熱に
より分解し、ろう材中のＴ１と反応して炭化物（ＴｊＣ
）となって接合部にみられた。接合部の強度は２０ ｋ
ｇｆ ／ ｍｍ２以上であった。As a result of observing the cross section of the joint, organic matter decomposes due to heating during joining, reacts with T1 in the brazing filler metal, and forms carbide (TjC).
) was observed at the joint. The strength of the joint is 20k
gf/mm2 or more.
〈実施例■〉
ポリエステル樹脂により表面が絶縁被覆された直径１１
１Ｂのエナメル銅線とモータの端子とを抵抗加熱によっ
て接合する際、４−５ ｗ ｔ％Ａ ｇ −１，５ｗｔ
％Ｃｕ −１５ｗ ｔ％Ｚｎ−２５ｗｔ％Ｃｄからなる
銀ろう中に１ｗｔ％のＴｉを添加した厚さ］−００μｍ
の箔状のろう材を用いた。このろう材をエナメル銅線の
周りに配置し、１ ｋｇｆ ／ ｍｍ２の加圧をしなが
ら１０００アンペア電流を流して抵抗加熱により瞬時に
接合した。銅線の表面に被覆されたポリエステル樹脂は
接合時の加熱により炭化し、ろう椙のＴ１と反応して炭
化物（Ｔ ｉ Ｃ）となって接合部に見られた。<Example ■> Diameter 11 whose surface is insulated with polyester resin
When joining 1B enamelled copper wire and motor terminals by resistance heating, 4-5 wt%A g -1.5wt
%Cu -15w t%Zn - Thickness of 1wt% Ti added to silver solder consisting of 25wt%Cd] -00 μm
A foil-shaped brazing material was used. This brazing material was placed around the enamelled copper wire, and a current of 1,000 amperes was passed while applying a pressure of 1 kgf/mm2 to instantly bond the wires by resistance heating. The polyester resin coated on the surface of the copper wire was carbonized by heating during bonding, reacted with T1 of the wax, and turned into carbide (T i C), which was observed at the bonded portion.
この接合部の強度は２０ ｋｇｆ ／ ｍｍ ２であっ
た。The strength of this joint was 20 kgf/mm2.
〈実施例■〉
ポリアミド樹脂により表面が絶縁被覆された直径５ ｍ
ｍのエナメル銅線を電機部品の端子との接合に際して、
９５ｗｔ％Ｐｂ−３，５ｗｔ％５ｎ−１，５ｗｔ％Ａｇ
からなるはんだ中にＴｉとＺｒとの合計が２ｗｔ％にな
るよう添加した厚さ］００μｍのはんだ材により接合し
た。このはんだ材をエナメル銅線の周りに配置し、抵抗
加熱により接合した。<Example ■> Diameter 5 m with surface insulating coated with polyamide resin
When joining m enameled copper wire to terminals of electrical equipment,
95wt%Pb-3,5wt%5n-1,5wt%Ag
They were joined using a solder material with a thickness of 00 μm in which Ti and Zr were added to the solder so that the total amount was 2 wt %. This solder material was placed around the enamelled copper wire and bonded by resistance heating.
エナメル銅線の表面に被覆されたポリアミド樹脂は接合
時の加熱により炭化し、ろう材のＴｉ及びＺｒと反応し
てＴｊ、Ｃ，ＺｒＣ等の炭化物となって接合部に見られ
た。The polyamide resin coated on the surface of the enamelled copper wire was carbonized by heating during bonding and reacted with Ti and Zr of the brazing filler metal to form carbides of Tj, C, ZrC, etc., which were observed at the bonded portion.
本発明によれば、有機物によって絶縁被覆された銅線の
接合を有機物が被覆された状態で効率的に接合すること
ができる。According to the present invention, it is possible to efficiently join copper wires coated with an organic substance in a state where the copper wires are coated with an organic substance.
Claims (1)
ろう材において、 前記接合用ろう材中に炭素と反応して炭化物を形成する
元素が添加されていることを特徴とする絶縁被覆銅線の
接合用ろう材。 ２、表面が有機物によつて絶縁被覆された銅線の接合方
法において、 ろう材中および／または接合部に炭素と反応して炭化物
を形成する元素を添加することを特徴とする絶縁被覆銅
線の接合方法。 ３、特許請求の範囲第１項に記載のろう材は銀と銅を主
成分とする銀ろう（ＪＩＳ規格ＢＡｇ−１，ＢＡｇ−８
相当），ＣｕとＰを主成分とし、一部Ａｇを含むりん銅
ろう（ＪＩＳ規格 ＢＣｕＰ−１〜ＢＣｕＰ−５相当），ＣｕとＺｎを主成
分とする黄銅ろう（ＪＩＳ規格 ＢＣｕＺｎ−Ｏ〜ＢＣｕＺｎ−７相当），ＡｕとＣｕを
主成分とする金ろう（ＪＩＳ規格 ＢＡｕ−１〜ＢＡｕ−１２相当），ＳｎとＰｂを主成分
とするはんだのうちのいずれか一種にＴｉ，Ｚｒ，Ｈｆ
，Ｃｒ，Ｖ，Ｎｂ，Ｍｎ，Ｆｅ，Ｍｏ，Ｔａの中から選
ばれる少なくとも一種の元素の合計が０．１〜１０ｗｔ
％添加されていることを特徴とする絶縁被覆銅線の接合
用ろう材。 ４、特許請求の範囲第１項または第２項に記載のろう材
はＣｕとＡｇを主成分とする銀ろう中にＴｉおよびまた
はＺｒの元素を０．１〜１０ｗｔ％添加されていること
を特徴とする絶縁被覆銅線の接合用ろう材。 ５、特許請求の範囲第２項記載の前記炭化物形成元素は
Ｔｉ，Ｚｒ，Ｈｆ，Ｔａ，Ｃｒ，Ｎｂ，Ｖ，Ｍｎ，Ｆｅ
の中から選ばれる少なくとも一種以上であることを特徴
とする絶縁被覆銅線の接合方法。[Scope of Claims] 1. In a brazing material for joining copper wires whose surfaces are insulated with an organic substance, an element that reacts with carbon to form a carbide is added to the brazing material for joining. A brazing filler metal for joining insulated copper wires. 2. A method for joining copper wires whose surfaces are insulated with an organic substance, characterized in that an element that reacts with carbon to form a carbide is added to the brazing material and/or the joint part. joining method. 3. The brazing filler metal described in claim 1 is a silver brazing filler metal whose main components are silver and copper (JIS standard BAg-1, BAg-8).
equivalent), phosphorous solder mainly composed of Cu and P and partly containing Ag (equivalent to JIS standard BCuP-1 to BCuP-5), brass solder mainly composed of Cu and Zn (JIS standard BCuZn-O to BCuZn) -7 equivalent), gold solder whose main components are Au and Cu (equivalent to JIS standard BAu-1 to BAu-12), solder whose main components are Sn and Pb, and Ti, Zr, Hf.
, Cr, V, Nb, Mn, Fe, Mo, Ta, the total amount of at least one element selected from 0.1 to 10 wt.
A brazing filler metal for joining insulated copper wires, characterized by the addition of %. 4. The brazing filler metal according to claim 1 or 2 has 0.1 to 10 wt% of Ti and/or Zr elements added to the silver solder whose main components are Cu and Ag. A brazing filler metal for joining insulated copper wires. 5. The carbide-forming elements according to claim 2 are Ti, Zr, Hf, Ta, Cr, Nb, V, Mn, Fe.
A method for joining insulated copper wires, characterized by at least one type selected from the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4437888A JPH01218794A (en) | 1988-02-29 | 1988-02-29 | Brazing filler metal for insulation-coated copper wire and joining method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4437888A JPH01218794A (en) | 1988-02-29 | 1988-02-29 | Brazing filler metal for insulation-coated copper wire and joining method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01218794A true JPH01218794A (en) | 1989-08-31 |
Family
ID=12689841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4437888A Pending JPH01218794A (en) | 1988-02-29 | 1988-02-29 | Brazing filler metal for insulation-coated copper wire and joining method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01218794A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002068146A1 (en) * | 2001-02-27 | 2002-09-06 | Sumida Corporation | Unleaded solder alloy and electronic components using it |
| JP2017155257A (en) * | 2016-02-29 | 2017-09-07 | 日本碍子株式会社 | Copper alloy and manufacturing method therefor |
| CN108296671A (en) * | 2018-01-28 | 2018-07-20 | 温州宏丰电工合金股份有限公司 | A kind of compound silver solder paste and preparation method thereof |
-
1988
- 1988-02-29 JP JP4437888A patent/JPH01218794A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002068146A1 (en) * | 2001-02-27 | 2002-09-06 | Sumida Corporation | Unleaded solder alloy and electronic components using it |
| JP2017155257A (en) * | 2016-02-29 | 2017-09-07 | 日本碍子株式会社 | Copper alloy and manufacturing method therefor |
| CN108296671A (en) * | 2018-01-28 | 2018-07-20 | 温州宏丰电工合金股份有限公司 | A kind of compound silver solder paste and preparation method thereof |
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