JPH01214094A - Method of soldering flat pack parts - Google Patents
Method of soldering flat pack partsInfo
- Publication number
- JPH01214094A JPH01214094A JP3747788A JP3747788A JPH01214094A JP H01214094 A JPH01214094 A JP H01214094A JP 3747788 A JP3747788 A JP 3747788A JP 3747788 A JP3747788 A JP 3747788A JP H01214094 A JPH01214094 A JP H01214094A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flat pack
- soldering
- leads
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 47
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000006071 cream Substances 0.000 claims abstract description 22
- 229910052742 iron Inorganic materials 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 230000004907 flux Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000003960 organic solvent Substances 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 235000010585 Ammi visnaga Nutrition 0.000 description 1
- 244000153158 Ammi visnaga Species 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔概 要〕
通信機、電子計算装置等の電子回路に用いられるフラッ
トパック部品の半田付方法に関し、小量生産でも作業性
が良いことを目的とし、多数のリードを有するフラット
パック部品を、該フラットパック部品を搭載するプリン
ト基板の上に載置し、そのリードの上からクリーム半田
を塗布した後、半田ごて等の工具を用いて加熱し、該ク
リーム半田を溶融することによりプリント基板にフラッ
トパック部品を半田付するように構成する。[Detailed Description of the Invention] [Summary] Regarding the soldering method of flat pack components used in electronic circuits of communication devices, electronic computing devices, etc., a large number of leads have been developed with the aim of achieving good workability even in small-scale production. Place the flat pack component on the printed circuit board on which the flat pack component is mounted, apply cream solder over the leads, and then heat the cream solder using a tool such as a soldering iron. The flat pack component is configured to be soldered to a printed circuit board by melting.
本発明は通信機、電子計算装置等の電子回路に用いられ
るフラットパック部品の半田付方法に関する。The present invention relates to a method for soldering flat pack components used in electronic circuits such as communication devices and electronic computing devices.
第２図に示す様な多数のリードｌが密に配列されたＩＣ
，ＬＳＩ等のフラットパック部品２をプリント基板３等
に半田付する場合、通常の部品の半田付で使用している
フロー半田付（溶融した半田に部品を入れ半田付する方
法）は、リード間に半田ブリッジが多発したり、部品が
半田の溶融温度に耐えられない等のために使用できない
。そのため従来は次の（ａ）〜（Ｃ）の様な半田付方法
が採用されている。An IC with a large number of leads arranged closely as shown in Figure 2.
, When soldering a flat pack component 2 such as an LSI to a printed circuit board 3, etc., flow soldering (a method in which the component is placed in molten solder and soldered), which is used for soldering normal components, is used to solder the parts between the leads. It cannot be used because solder bridges occur frequently or the parts cannot withstand the melting temperature of the solder. Therefore, conventionally, the following soldering methods (a) to (C) have been adopted.
（ａ） クリーム半田をスクリーン印刷等で半田付す
る基板上に塗布し、部品をのせ赤外線炉又は蒸気半田炉
（ペーパーフユーズソルダリング）で加熱し半田付する
方法。(a) A method in which cream solder is applied to the board to be soldered by screen printing or the like, parts are placed on the board, and the parts are heated and soldered in an infrared furnace or steam soldering furnace (paper fuse soldering).
（ｂ） 取付ける基板側とフラットパック部品のリー
ドに予備半田を施しておき、加熱した専用の加熱治具を
押付ける（ホントスタンプ法）かレーザ等で加熱する方
法。(b) Preliminary solder is applied to the board side to be mounted and the leads of the flat pack component, and then a heated dedicated heating jig is pressed (honstamp method) or heated with a laser, etc.
（ｃ） フラックス入りの細い糸半田を用いて手作業
で半田付する方法。(c) Manual soldering using flux-cored thin thread solder.
上記従来のフランドパツク部品の半田付方法において、
（ａ）は半田付ラインが専用のラインになるため他の表
面実装部品が多い場合は有効であるが表面実装部品が少
ない場合はコストアップとなる。In the above conventional soldering method for Flandpack parts,
In (a), the soldering line is a dedicated line, which is effective when there are many other surface-mounted parts, but costs increase when there are few surface-mounted parts.
また（ｂ）では専用の加熱治具が必要となり、さらにレ
ーザ加熱では装置が高価で少量生産には適しない。さら
に（Ｃ）では手作業のため作業性が悪く、又半田量のコ
ントロールが難しく半田ブリッジが発生し易い０等の欠
点があった。In addition, (b) requires a dedicated heating jig, and laser heating requires expensive equipment and is not suitable for small-scale production. Furthermore, (C) has disadvantages such as poor workability due to manual work, and difficulty in controlling the amount of solder, which tends to cause solder bridges.
本発明は上記問題点に鑑み、少量生産でも作業性が良い
フラットパック部品の半田付方法を提供することを目的
とするものである。SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a method for soldering flat pack components that is easy to work with even in small-volume production.
〔課題を解決するための手段］
上記目的は、多数のり−ド１０を有するフラットパック
部品１１を、該フラットパック部品を搭載するプリント
基板の上に載置し、そのリード１０の上からクリーム半
田１３を塗布した後、半田ごて等の工具を用いて加熱し
、該クリーム半田１３を溶融することによりプリント基
板にフラットパック部品１１を半田付することを特徴と
するフラットパック部品の半田付方法によって達成され
る。[Means for Solving the Problem] The above object is to place a flat pack component 11 having a large number of leads 10 on a printed circuit board on which the flat pack component is mounted, and apply cream solder over the leads 10. A method for soldering flat pack components, which comprises applying heat using a tool such as a soldering iron to melt the cream solder 13, thereby soldering the flat pack component 11 to a printed circuit board. achieved by
クリーム半田はペースト状のため塗布する量をコントロ
ールしやす（、またクリーム半田は多量のフラックスが
含まれているため半田ごてで加熱した際、半田が各リー
ドにすいよせられるため作業性が良く、且つ半田ブリッ
ジも発生しにく（なる。Cream solder is paste-like, so it is easy to control the amount applied (also, since cream solder contains a large amount of flux, when heated with a soldering iron, the solder flows onto each lead, making it easier to work with. , and solder bridges are less likely to occur.
第１図は本発明の詳細な説明するための図であり、ａ
−ｄはその工程を示す図である。FIG. 1 is a diagram for explaining the present invention in detail, and a
-d is a diagram showing the process.
本実施例は先ずａ図に示すように、多数のり−ド１０を
有するＩＣ，ＬＳＩ等のフラットパック部品１１をプリ
ント板に載置し、そのパッドにリード１０を位置合わせ
した後、相互に離れた２個所以上のリードを仮止め１２
するため小量のクリーム半田を用いるか、予備半田で半
田付けする。In this embodiment, first, as shown in Fig. a, a flat pack component 11 such as an IC or LSI having a large number of leads 10 is mounted on a printed board, and after aligning the leads 10 with the pads, they are separated from each other. Temporarily fasten the leads in two or more places12
To do this, use a small amount of cream solder or solder with pre-solder.
次にｂ図に示すようにツー１１０群の上に該リード群を
半田付けするに足る量のクリーム半田１３をツマヨウジ
、注射器等で塗布するか、デイスペンサで自動供給する
。Next, as shown in Figure b, cream solder 13 in an amount sufficient to solder the lead group on the tool 110 group is applied with a toothpick, a syringe, etc., or is automatically supplied with a dispenser.
次に０図に示すように加熱炉、熱板又は半田ごて等の加
熱工具を用いてクリーム半田１３を溶融しり一ド１０を
パッドに半田付けする。Next, as shown in FIG. 0, the cream solder 13 is melted using a heating tool such as a heating furnace, a hot plate, or a soldering iron, and the solder pad 10 is soldered to the pad.
なお、好ましくは半田ごてを用い、半田ごてを移動する
ことにより溶融した半田をリードＩＯの方に引き寄せ、
半田ボールの発生を防ぎながらパッドとリードの半田付
けを確実にすることができる。Preferably, a soldering iron is used, and the molten solder is drawn toward the lead IO by moving the soldering iron.
It is possible to securely solder pads and leads while preventing the generation of solder balls.
最後に水、有機溶剤等で洗浄し、フラックス１４及び半
田ポール１５を除去しｄ図の如く半田付けを完了するの
である。なおこの洗浄はフラックスが除去しなくとも良
い性質のものである場合には洗浄を省略しても良い。Finally, the flux 14 and solder pole 15 are removed by cleaning with water, organic solvent, etc., and the soldering is completed as shown in Figure d. Note that this cleaning may be omitted if the flux does not need to be removed.
以上の本実施例方法によれば、次の（ａ）〜（ｄ）の様
な利点がある。According to the method of this embodiment described above, there are the following advantages (a) to (d).
（ａ） クリーム半田には多量のフラックスが含まれ
ているため半田ごてにより加熱した際、半田が各リード
にすいよせられ易く、フラックスの働きにより半田ブリ
ッジが生じにくい。(a) Cream solder contains a large amount of flux, so when it is heated with a soldering iron, the solder tends to flow to each lead, and the action of flux makes it difficult for solder bridges to occur.
（６） クリーム半田はペースト状であるため、塗布す
る量をコントロールし易い。(6) Since cream solder is in paste form, it is easy to control the amount applied.
（Ｃ） 半田ごてはリードの上からクリーム半田をと
かすために使用するので、リードのピッチに合わせた細
いこて先を使う必要がなく、作業性が良好である。(C) Since the soldering iron is used to melt the cream solder from above the leads, there is no need to use a thin iron tip that matches the pitch of the leads, resulting in good workability.
（ｄ） 専用の半田付治具を必要としないので小量生
産に好適である。(d) Since no special soldering jig is required, it is suitable for small-scale production.
〔発明の効果］
以上説明した様に本発明によれば、プリント＋ｉ上に載
置したフラットパック部品のリードの上からクリーム半
田を塗布し、半田ごて等の加熱工具で溶融することによ
り、作業性が良く、且つ半田ブリッジの生じにくいフラ
ットパック部品の半田付方法を提供することができる。[Effects of the Invention] As explained above, according to the present invention, cream solder is applied onto the leads of the flat pack component placed on Print+i and melted with a heating tool such as a soldering iron. It is possible to provide a method for soldering flat pack components that has good workability and is less likely to cause solder bridges.
第１図は本発明の詳細な説明するための図、第２図は従
来のフラットパック部品を示す図である。
図において、
１０はリード、
１１はフランドパツク部品、
１２は仮止め、
１３はクリーム半田、
１４はフラックス、
１５は半田ボール
を示す。FIG. 1 is a diagram for explaining the present invention in detail, and FIG. 2 is a diagram showing a conventional flat pack component. In the figure, 10 is a lead, 11 is a fland pack component, 12 is a temporary fixing, 13 is a cream solder, 14 is a flux, and 15 is a solder ball.
Claims (1)
（１１）を、該フラットパック部品を搭載するプリント
基板の上に載置し、そのリード（１０）の上からクリー
ム半田（１３）を塗布した後、半田ごて等の工具を用い
て加熱し、該クリーム半田（１３）を溶融することによ
りプリント基板にフラットパック部品（１１）を半田付
することを 特徴とするフラットパック部品の半田付方法。1. A flat pack component (11) having a large number of leads (10) is placed on a printed circuit board on which the flat pack component is mounted, and cream solder (13) is applied over the leads (10). A method for soldering flat pack components, which comprises soldering the flat pack component (11) to a printed circuit board by heating and melting the cream solder (13) using a tool such as a soldering iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3747788A JPH01214094A (en) | 1988-02-22 | 1988-02-22 | Method of soldering flat pack parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3747788A JPH01214094A (en) | 1988-02-22 | 1988-02-22 | Method of soldering flat pack parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01214094A true JPH01214094A (en) | 1989-08-28 |
Family
ID=12498601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3747788A Pending JPH01214094A (en) | 1988-02-22 | 1988-02-22 | Method of soldering flat pack parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01214094A (en) |
-
1988
- 1988-02-22 JP JP3747788A patent/JPH01214094A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01214094A (en) | Method of soldering flat pack parts | |
| JPH04242943A (en) | Method for supplying solder to bump electrode | |
| JPH0955565A (en) | Printed wiring board | |
| JPS58169993A (en) | Part mounting method | |
| JPH05190599A (en) | Method of assembling semiconductor device | |
| JPH02192792A (en) | Method of soldering electronic component with low thermal resistance | |
| JP3150068B2 (en) | Manufacturing method of printed wiring board | |
| JPS63299855A (en) | Soldering method | |
| JPH05259631A (en) | Surface mounting of printed wiring board | |
| JPH03194994A (en) | Solder-connecting method for surface mounting ic package | |
| JPH0575247A (en) | Method of mounting chip | |
| JPH03178190A (en) | Method for mounting surface mount parts | |
| JPH01178366A (en) | Film for feeding solder and presoldering method | |
| JPH08236921A (en) | Method for soldering electronic parts | |
| JPH0399791A (en) | Cream solder | |
| JPH0217695A (en) | Fitting method to printed wiring board of surface mounting type electronic part | |
| JPH03180093A (en) | Construction of hybrid integrated circuit board | |
| JPS61263191A (en) | Mounting of electronic component | |
| JPS63284892A (en) | Mounting method for flat package type electronic part | |
| JPH01297889A (en) | Attachment of electronic component | |
| JPH0718475U (en) | Printed wiring board | |
| JPH03208346A (en) | Removal of void from solder bump | |
| JPH07273438A (en) | Manufacture of printed wiring board | |
| JPH07307562A (en) | Method of forming bump | |
| JPH0613744A (en) | Bonding of electronic component |