JPH01214033A - Electric circuit device - Google Patents

Abstract

PURPOSE:To obtain a new electric circuit device whose density and reliability are high and whose cost is low by providing at least an electric connection member, an electric circuit component, another electric circuit component, a plate and a sealing material whose material is different from that of the plate, which are specified individually. CONSTITUTION:At least the following are provided: an electric connection member 125 which contains retention bodies 111 composed of an insulating material and two or more conductive members 107 filled into them and where both ends of the conductive members 107 are exposed on both faces of the retention bodies 111 individually; one or more each of electric circuit components 101, 104 which contain one or more each of connection parts 102, 105 and to which one end or the other end of one or more each out of the conductive members 107 exposed on individual faces of the retention bodies 111 is connected in the connection parts 102, 105; a plate 151 which is arranged near at least one or more side faces of the electric circuit components 101, 104 and/or near the face opposite to the electric connection member 125; sealing materials 170 where at least one part of the electric circuit components 101, 104 and/or the plate 151 is filled and sealed and whose material is different from that of the plate 151.

Description

[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD The present invention relates to an electric circuit device.

[Prior Art] Conventionally, an electric circuit is made by sealing an electric circuit member that is constructed by electrically connecting TL circuit components to each other! As a technique related to S22, the technique described below is known.

■Wire bonding method Figures 13 and 14 show typical examples of semiconductor devices connected and sealed by the wire bonding method.The wire bonding method will be explained below based on Figures 130 and 14. do.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using %Ag paste 3 or the like, and then one of the semiconductor elements 4 is
This is a method of electrically connecting the connecting portion 5 and a desired connecting portion 6 of the lead frame 1 using an ultrafine metal wire 7 such as gold.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed using a thermosetting resin 8 such as epoxy resin by a method such as transfer molding, and then the leads extending outward from the resin-sealed parts are sealed. Unnecessary parts of the frame 1 are cut and bent into a desired shape to form a semiconductor 9.

■T A B (Tape Automated Ba
nding) method (for example, Japanese Patent Application Laid-Open No. 139636-1983)
15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead portion 17 of the carrier film substrate 16 and the connection i5 of the semiconductor element 4 are connected by thermocompression bonding. It's a method. After the connection, the semiconductor device 219 is sealed with resin 20 and resin 21 which are thermosetting resins such as epoxy resin.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
No. 6, Japanese Unexamined Patent Publication No. 60-57944+U) No. 16IA shows a typical example of a semiconductor connected and sealed by the CCB method. This method will be explained based on FIG. 16. The one-line method is also called the flip-chip bonding method.

Solder bumps 31 are provided in advance on the connection portion 5 of the semiconductor element 4,
A semiconductor element 4 provided with solder bumps 31 is mounted on a circuit board 3.
2) 5a.

Thereafter, the circuit board 32 and the semiconductor element 4 are bonded to each other by heating and melting the solder, and after cleaning with flux, the semiconductor device 9 is sealed.

(2) The method shown in FIGS. 17 and 18, that is, an insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connecting portion 5, and! A-to-gun Division 5 is Au! A metal material 70 made of:g is provided, and then exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, the 1a continuation fi5 of the second semiconductor element 4''
Absolute Fil made of polyimide etc. for myself other than °! 271
', and a metal material 70 made of Au etc. is formed at the connecting part 5°.
1°, then metal material 70° and insulation gI71°
Flatten the exposed surfaces 73° and 72°.

Thereafter, as shown in FIG. 18, the ml semiconductor element 4 and the second semiconductor element 4 degrees are positioned.

After positioning, the first semiconductor element 4 is bonded by thermocompression.
The connecting portion 5 of the second semiconductor element 4 and the connecting portion 5° of the second semiconductor element 4 are connected via a metal material 70.70°.

[Phase] The method shown in FIG. 19, that is, the lth circuit substrate 75 and the second circuit substrate 75'
An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit base material 75 and the second circuit base material 75.
After positioning the circuit board at 75°, apply pressure or
By applying pressure and heating, the connection portion 76 of the first circuit substrate 75 and the second
This is a method of connecting the tSbc portion 76° of the circuit board 75°.

■The method shown in FIG. 20, that is, the first circuit substrate 75 and the second circuit substrate 75°
An elastic connector 83 made of an insulating material 81 is interposed between them, and a metal wire 82 made of Fe or Cukg is arranged in a certain direction.

After positioning the first circuit board 75 and the second circuit board 75', pressure is applied, and the connecting part 76 of the circuit board 75 of :fsl and the connecting part 76 of the second circuit board 75' This is the way to connect.

[Problems to be solved by Isuzu 1] By the way, the conventional bonding method described above has the following problems.

■Wire bonding method■ When designing the connecting part 5 of the semiconductor element 4 to be placed inside the semiconductor element 4, the ultra-fine metal wire 7 has an extremely small wire diameter, so the outer peripheral edge 10 of the semiconductor element 4 or the lead This makes it easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the frame l. The ultra-fine metal wire 7 is attached to these outer peripheral edges 10 to 11.
It will short circuit if it comes into contact with. Furthermore, the length of the ultra-fine gold Tg& wire 7 has to be increased, and if the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connections aIS5 of the semiconductor element 4 must be distributed around the semiconductor device 4, and are subject to limitations in one circuit design.

[Phase] In the wire bonding method, in order to avoid contact between the fine metal wires 7 that cause FAIR, the pitch dimension of the connecting parts 5 on the semiconductor element 4 (distance between the centers of adjacent connecting parts) must be adjusted to a certain degree. I have no choice but to take the same station,
Therefore, once the size of the semiconductor element 4 is determined, the maximum number of connection portions 5 is necessarily determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting parts 5 must be reduced.

Ultra-fine gold 111 measured from the ta-type part 5 on the O semiconductor element 4
7(F) Height h is usually 0.2 to 0.4 mm, but 0
．． FM! It is not possible to achieve dualization.

■Wire bonding takes time. In particular, when the number of connection points increases, the bonding time increases, which improves production efficiency.

(2) If the transfer mold condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, νJ may be broken.

Further, in the connection portion 5 on the semiconductor element 4.

Since the human parts that are not alloyed with the ultra-fine gold FA wire 7 are exposed, Ai corrosion is likely to occur, resulting in a decrease in reliability.

ΦWhen resin 8 is injected under high pressure, it becomes an ultra-fine metal! Deformation of a7,
Because cutting occurs, thermoplastic resins that must be injected at high pressure cannot be used, and the resin is limited.

■As the thickness of the semiconductor device becomes thinner, warping occurs, making it difficult to mount the semiconductor device. In addition, when the warpage is corrected, stress is applied, deterioration of characteristics occurs, and eventually cracks occur, resulting in a problem of impairing reliability.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length of the inner lead part 17 of the carrier film substrate 16 becomes longer, so that the inner lead part 17 is easily deformed. Otherwise, the inner lead portion may not be able to be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5.

To avoid this, connect the semiconductor element 4! ! 15 needs to be brought to the periphery of the semiconductor element 4, which is subject to design limitations.

■ In the TAB method as well, the pitch dimension of the connection parts on the semiconductor element 4 must be set to 0.09 to 0.15 mm degrees, and therefore, as mentioned in the problem (■) of the wire bonding method, the number of connections is increased. Things become difficult.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with parts other than the connection portions 5 of the semiconductor element 4, a connection shape of the inner lead portions 17 is required for this purpose, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, gold bumps must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■The coefficient of thermal expansion of the semiconductor element 4 is 84, fat 20, or resin 2.
Since the coefficient of thermal expansion is different from that of 1, when heat is applied to the semiconductor device 219, thermal stress is generated and the characteristics of the semiconductor element 4 are deteriorated. Furthermore, cracks occur in the semiconductor element 4 or the resin RF 120 or the resin 21.

Equipment reliability decreases. Such a phenomenon becomes wJ when the size of the semiconductor λ element 4 is large.

(2) CCB Method 0 Since solder bumps 31 must be formed on the connecting portions 5 of the semiconductor element 4, the cost increases.

■If the amount of solder on the bump is large, a bridge will occur between adjacent solder bumps (a phenomenon in which adjacent solder bumps come into contact with each other), and conversely, if the amount of solder on the bump is small, the connection between the connection part 5 of the semiconductor element 4 and the board 32 will occur. The portion 33 is no longer connected and electrical continuity is no longer established. In other words! The reliability of the B sequel will be lower. Furthermore, the amount of solder and the shape of the solder will affect the reliability of the connection ('Geometric Optimiza
tion of ControlledColla
pse fterconnectiani-,L,!
J. Goldman.

IBII J, RES, [1EVELOP, 19
69MAY, pp251-265゜'Re1iabity of Controlled Co11aps
eInterconnections”, K, C,
Norris.

A.H.Landzberg, IBM J.
RES, DEVELOP.

1969,) IAY, pp2GG-271, Technical data of the Brazing Technology Research Group, No. 017- "84% Published by the Brazing Technology Research Group)".

As described above, since the amount of solder bumps affects the reliability of 1abc, it is necessary to control the amount of solder bumps 31 (7).

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■The heat dissipation properties of semiconductor devices are confusing (Reference material: Electr
onic Packaging Technology
1987.1 (Vol, 3. No, l) P, 66
~71. NIKKEI)IIcRODEVIcEs
19B June. May, P, 97-108), a great deal of effort is required to improve the heat dissipation characteristics.

■Technique shown in FIGS. 17 and 18 ■Exposed surface 72 of insulating film 71. Exposed surface 73 of metal material 70 or insulation 1) 771° mist exit surface 72° and metal material 70°
It is necessary to make the exposed surface 73 degrees mole, which requires more effort and increases costs.

■Insulation! Exposed surface 72 of 271 and exposed surface 73 of metal material 70
Alternatively, if there are irregularities on the exposed surface 72° of the insulating film 71° and the spray surface 73° of the metal material 70°, the metal material 70 and the metal material 70'
connection will be lost, and reliability will decrease.

■Technology shown in Fig. 19■ After positioning, when connecting by pressurizing the connecting portion 76° of the ta-gun part 76, it is difficult to apply a constant pressure, which causes variations in the connection state, and as a result, at the connecting portion The variation in contact resistance value increases. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for cases where a large amount of current needs to flow.

(2) If the pitch between adjacent connecting parts (the distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

■Because the resistance value changes due to variations in the protrusion ihl of the circuit board 75.75° and Ia continuation fi 76.76°,
It is necessary to accurately control the amount of ht variation.

■Additionally, an anisotropic conductive film is applied to semiconductor elements and circuit substrates.
Furthermore, when used to connect the first semiconductor element and the second semiconductor element, in addition to the disadvantages mentioned above, bumps must be provided at the connection part of the semiconductor element, which increases the cost. There is a drawback.

■Technology shown in Figure 20 ■Pressure is required, and a pressure jig is required.

■Elastic connector 83 gold II! line 82 and the first
The connection portion 76 of the circuit substrate 75, and the second circuit substrate 7
The contact resistance between the 5° and the 76° connections varies depending on the pressing force and surface condition, resulting in poor connection reliability.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
First circuit substrate 75. There is a high possibility that the surface of the second circuit board 75° will be damaged, and if the pressing force is small, the reliability of the connection will be poor.

■In addition, 1 circuit base material 75, 75° connection part 76.76°
The protrusion lh2 of the elastic connector 83 and the protrusion 1ih3 of the metal wire 82 and their variations are the resistance v1.
Since it affects change and damage, it is necessary to devise ways to reduce variations.

(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (1) to (2) occur.

The present invention solves all of the above problems and proposes a new electric circuit device that is high density, highly reliable, and low cost, and replaces the conventional connection method and sealing method. Of course, it is possible to obtain high-density multi-point connections and improve thermal and other properties.

[Means for Solving the Problems 1] The first aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, an electrically conductive member, one end of which is exposed on one side of the holder, and the other end of the electrically conductive member is exposed on the other side of the holder: at least one and at least one end of at least one of the electrically conductive members exposed on one surface of the holder is connected to Jtc at the connecting portion. Air circuit components: have at least one or more connection parts, and in the connection parts,
and at least one other electrical circuit component to which the other end of at least one of the electrically conductive members discharging on the other side of the holder is connected: The electric circuit component connected to the electrical connection member and the vicinity of any one or more sides of the electric circuit component connected to the electrical connection member on the other side of the holder and/or the electrical connection member. a plate disposed near the opposite surface; and a sealing material made of a material different from the chain plate, which embeds and seals at least a portion of the electric circuit component and/or the chain plate; This is an electric circuit type characterized by having.

A second aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; and at least one or more electrical circuit components to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected: , in the connection part,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made through a connection body formed by metallizing and/or alloying the connection part and the other end with at least one other electric circuit component: One of the holding bodies The electrical circuit component connected to the electrical connection member on one side and the other side of the holder '
tt with a plate disposed near one or more sides of the electrical circuit component connected to the electrical connection member and/or near the surface opposite to the electrical connection member; the electrical circuit component and/or or a sealing material made of a material different from that of the chain plate, which embeds and seals at least a portion of the chain plate;

The third gist of Wood G and S1 is a holder made of an electrically insulating material, and a holder embedded in the holder. S[number of fr1 electrically conducting 'tt members, and the electrically conducting 1! an electrical connection member in which one end of the member is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder; The electrical conductor has a connecting portion and is exposed on one side of the holder at the connecting portion. l! One end of at least one of the members is VC-connected, and the VT-connection is made through a connection body formed by metallizing and/or alloying the connection portion and the other end. At least one or more ML electric circuit components; having at least one or more connection portions, in which the connection portions include:
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made through a connection body formed by metallizing and/or alloying the connection part and the other end with at least one other electric circuit component: of the holder. f connected to the electrical connection member on one surface: near one or more side surfaces of the electrical circuit component and the electrical circuit component connected to the electrical 1m connection member on the other surface of the holder; / or a plate disposed near the surface opposite to the electrical connection member: made of a material different from that of the plate, in which at least a portion of the electrical circuit component and/or chain plate is embedded and sealed; An electric circuit device comprising at least a sealing material and:

The requirements for forming the UI of the present invention will be individually explained below.

(Electrical Circuit Components) Examples of electrical circuit components in the present invention include semiconductor elements, resin circuit boards, ceramic substrates, gold 1! Examples include circuit boards such as substrates (hereinafter sometimes simply referred to as circuit boards), lead frames, and the like.

It should be noted that only one electrical circuit component or a plurality of electrical circuit components connected to the electrical connection member may be present on one surface of the holder.

? l! The object of the present invention is a component having a contact bA portion as an air circuit component. Although the number of connections does not matter, the greater the number of four-layer connections, the greater the effect of ungenerated 1 becomes 'lA':A.

Further, although the location of the connection portion does not vary, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

Note that the connection portion is an M1 electrically conductive member.

(Electrical Connection Member) The electrical connection member according to the present invention has a plurality of electrically conductive members embedded in a holder made of an electrically insulating material.

The buried conductive members are electrically insulated from each other.

One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

(Electrically Conductive Member) The electrically conductive member may be any material as long as it exhibits electrical conductivity. Metal materials are generally used, but materials other than metal materials that exhibit superconductivity may also be used.

As the material for the metal member, gold is preferable, but any metal or alloy other than gold may be used. For example, Ag, Be, Ca, Mg.

Mo, Nl, W, Fe, Ti, In, Ta.

Examples include metals or alloys such as Zn, Cu, Ai, Sn, and Pb-5n.

Furthermore, the metal member and the alloy member may be the same type of metal or different types of metal in the same electrical connection member.

One of the metal members and alloy members of the electrical connection member may be made of the same kind of metal or alloy or different kinds of metal or alloy, and even if it is made of a material other than metal or alloy, if it exhibits conductivity. For example, the material may be a metal material containing one or both of an organic material and an inorganic material, or a combination of an inorganic material and an organic material as long as it exhibits conductivity. can be circular, square, or any other shape.

Further, the thickness of the electrically conductive member is not particularly limited, and may be, for example, 207L, taking into consideration the pitch of the connection portion of the electrical circuit member.
It may be greater than mφ or less than 2O4 mφ.

The exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on only one side or on both sides. may be made into a bump shape.

Further, the distance between the electrically conductive members may be the same as the distance between the connecting portions of the electric circuit components.

The spacing may be narrower than that, and if the spacing is narrower, it is 1ttJ! It becomes possible to connect the electric circuit component and the electrical connection member without requiring positioning of the A circuit component and the electrical connection member.

Further, the electrically conductive member does not need to be arranged vertically in the holder, but may be obliquely arranged from one surface of the holder to the other surface of the holder.

(Holding body) The holder consists of a 'r11 gas insulating material.

Any electrically insulating material will do.

Examples of electrically insulating materials include organic materials and inorganic materials. It may also be a metal material that has been treated so that the electrically conductive members are electrically insulated from each other.Furthermore, powders, fibers, or materials of a desired shape made of inorganic or metal materials may be used in the organic material. Furthermore, one or more types of powders, m-fibers, and materials having a desired shape may be dispersed in the inorganic material. In addition, powders made of inorganic or organic materials, fibers, or one to eight materials having a desired shape may be contained in the total bending material.
[Several types may be dispersed and held; however, if the holding body is made of a fully flexible material, 1, for example, electrically conductive? An electrically insulating material such as a resin cap may be provided between the member No. 11 and the holder.

Here, as the organic material, 1, for example, an insulating resin may be used; if a resin is used, the type of resin does not matter; 8, any of curable resin, ultraviolet curable resin, and thermoplastic resin may be used; 0, for example , polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polysulfone resin, fluororesin.

Polycarine-11 resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin , methacris resin, vinylidene chloride resin, alkyd resin, silicone resin, and other resins can be used.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin.
If you select a resin that has the same or similar coefficient of thermal expansion as a circuit board, and if there is at least one hole or multiple holes in the organic material, it will be possible to , it becomes possible to further prevent a decrease in reliability of the device.

As the inorganic material and the metal scrap material, the materials described below may be used.

(Vt type: Connection by metallization and/or alloying) The following three configurations can be considered for the connection between the end of the electrical connection member and the 11 connections of the electrical circuit component.

Note that one or more electric circuit components may be connected to one electrical connection member, but at least one of the connected electric circuit components may be connected by the following configuration. It is sufficient if this is done.

■One end of a plurality of electrically conductive members sprayed out on one side of the holder and a plurality of connection parts of one electric circuit component are also exposed on the other side of the holder. A configuration in which the other end of the electrically conductive member and the plurality of la joints of the other electric circuit component are connected by a method other than metallization and/or alloying described in first-order (1) and (2).

■It is formed by metallizing and/or alloying one end of a plurality of electrically conductive members exposed on one surface of the holder and at least one of the plurality of TA joints of one electric circuit component. The other end of the multi-hole electrically conductive member exposed on the other side of the holding body and the plurality of connection parts of the other electric circuit component are connected via the metalized connection body. and/or configurations that are combined by methods other than alloying.

■One end of multiple electrically conductive members exposed on one side of the holder and one of the electrical circuit components? A plurality of electrically conductive members connected via a connecting body formed by metallizing and/or alloying with at least one of the U number of connecting parts, while being exposed on the other side of the holder. A configuration in which the other end and at least one of the plurality of connection parts of the other electric circuit component are connected via a connection body formed by metallizing and/or alloying.

Next, the above connection body will be described.

When the electrically conductive member to be connected and the connecting portion are made of the same type of pure metal, the connecting body formed by metallization has the same type of crystal structure as the electrically conductive member or the connecting portion. Note that the metallization method is as follows: 1. For example, after bringing an end of an electrically conductive member into contact with a connecting portion corresponding to the end,
Heating may be performed to an appropriate temperature.Heating causes diffusion of atoms in the vicinity of the contact portion, and the diffusion portion becomes a gold B state, forming a JB continuum.

When the electrically conductive transistor, member, and connection part to be connected are made of different types of pure metals, the connecting body to be formed is an alloy of both metals. After contacting the end of the la contact with the corresponding la connection part, it is sufficient to heat it to an appropriate temperature.Heating causes diffusion of atoms in the vicinity of the contact part, and a solid solution or an intermetallic compound is formed in the vicinity of the contact part. A layer is formed and this layer becomes the connection.

In addition, if Au is used for the metal member of the electrical connection member and Au is used for the VT connection part of the electric circuit component, the
A heating temperature of ~350°C is preferred.

1a When one of the electrically conductive member to be resisted and the connecting portion is made of a pure metal and the other is made of an alloy, or when both are made of the same or different alloys, the connecting body is made of an alloy.

Regarding a plurality of electrically conductive members in one electrical connection member, if each electrically conductive member is made of the same kind of metal or alloy, or if each is made of different kinds of metal or alloy, #i number There may be other cases in which some of the electrically conductive members are of the same kind and some of them are of different kinds of metals or alloys, but in any of these cases, the metallization or alloying described above may not be carried out. It will be done. The same applies to the connection portion.

Note that the electrically conductive member or the connecting portion may be made of metal or an alloy at the contact portion between the two, and the other portion may be a mixture of metal, glass metal, and resin, for example.

In addition, in order to increase the connection strength, it is preferable to reduce the surface roughness of the parts to be connected (particularly preferably 0.3 μm or less), and to make the surface roughness of the parts to be connected smaller than metals or alloys that are easy to alloy. A plating layer may be provided.

To make connections other than metallization or alloying as described above,
For example, the electric circuit component and the electrically conductive member of the electrical connection member may be suppressed to form a vc connection.

(Encapsulant) In Kiwade 1, electrical circuit components are embedded and sealed using a sealant.

The stabbing may be performed on only one electrical circuit component, or may be performed on a plurality of electrical circuit components.

(Material of Sealing Material) In the present invention, thermoplastic resin can be used as the material of the 1M sealing material. Examples of thermoplastic resins include polyimide resin, polyphenylene sulfide resin, and polyether sulfone resin.

Polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin, methacrylic ugly methyl resin, and other resins may be used. Can be done.

Further, the 1M retaining material may be the above-mentioned resin, or may be one in which one or one of 1!1 trk of 8 powders or fibers among metals, alloys, and inorganic materials is dispersed in the above-mentioned thermoplastic resin. Of course, all you have to do is add powder or fiber to the resin and stir the resin.

The powder or particles may be dispersed in the resin by any other method other than this method.

Examples of the metal or alloy include Ag.

Cu, Au, AJL, Be, Ca, Mg, Mo.

Examples include metals or alloys such as Fe, N'i, Si, Co, Mn, and W.

Examples of inorganic materials include SiO21B203. A
lzO3, Na2O, 20°CaO, Zoo, BaO
,PbO,5b203.

Ag2O3, La2O5, ZrO2, Bad.

P 20 s * T t 021 M g O-S
i C, B e O*BP, BN, AiN, B4C, T
aC.

TiB2. CrB2, TiN, Six Ns *Ta
Examples include ceramics such as 205, diamond, glass, carbon, poron, and other inorganic materials.

The size and shape of the powder and fibers to be dispersed, as well as the dispersion order and quantity in the insulator, should be determined in such a way that gold members embedded in the insulator may come into contact or short circuit due to the powder or fibers. It is optional as long as it is within the range. However, it is preferable that the size of the powder and fibers be smaller than the distance between adjacent metal members.In other words, it is preferable that electrically conductive members do not come into contact with each other even through the powder or fibers. The 1m fibers may or may not be exposed to the outside of the insulator, and the powder and M&M may or may not be in contact with each other.

(J4 sealing method) In addition, as a method for sealing with the sealing material, an electric circuit member (a member consisting of an electrical contact member and an electric circuit component connected to it) is placed in the cavity of the mold, and injection is performed. The TL electric circuit member may be sealed by inserting a sealing material into the cavity using a mold, or by any other method such as injection molding, extrusion molding, medium molding, blow molding, or the like.

(Plate) According to the present invention, at least one plate or a combination of plates is disposed near the surface of the electric circuit component opposite to the electrical connection member, or near the side surface thereof. It is not necessary to arrange it in the vicinity of all electric circuit components; it is sufficient to arrange it in at least one electric circuit component.

The plate may be made of any material as long as it is different from the material of the sealing material.

The plate thickness is 1, for example, in the case of a stainless steel plate.

0.05#0.5mm is preferable.

The joining method is not particularly limited; for example, it may be pasted using adhesive, or other methods may be used.
Any structure that allows the board to hold electrical circuit equipment may be used.

[Function] In unreleased rJ1, using the electrical connection member described above,
Since the electrical circuit components are connected to other electrical circuit components, it is not possible to place the connecting parts of the electrical circuit components inside.
Therefore, the number of connection parts can be increased, and as a result, the IQ can be increased to higher density.

Also,? 11. It is possible to make the electrical connection member thinner, and from this point of view, it is also possible to make the electric circuit member thinner.

Furthermore, since the amount of metal members used for electrical connection members is small, cost reduction is essential even if expensive gold is used as the metal member.

In the present invention, since the electrically conductive member is embedded in the holder to form the MIi electrical connection member, it is not affected by the sealing pressure, sealing speed, etc. when the sealing material is injected. Any sealing method can be used because of the low In other words, it has become possible to inject materials such as thermoplastic resins that require extremely high pressure injection, which was previously impossible.

1. In the present invention, if a material with good thermal conductivity is used as the insulator of the electrically conductive member, and if powder or am with good thermal conductivity is dispersed in the sealing material, heat will be generated from the electric circuit components. The generated heat escapes to the outside world more quickly, resulting in an electrical circuit with good heat dissipation. In addition, if the insulator of the electrically conductive member is made of a material with a coefficient of thermal expansion close to that of the electric circuit component, one or both of powders and fibers having a coefficient of thermal expansion close to that of the electric circuit component may be dispersed in the sealing material. If the thermal expansion coefficient is close to that of the electrical circuit components, cracks in the sealing material, electrical circuit components, or changes in the characteristics of the electrical circuit components may occur when heat is applied to the electrical circuit components. This phenomenon that impairs reliability can be prevented, and a highly reliable electric circuit 5ti7I can be obtained.

In the present invention, when one of the electrical circuit components is connected by a connecting body formed by metallization and/or alloying through the electrical connection member, the electrical circuit components are strong (strong in terms of strength). In addition, since the connection is reliable, it is possible to obtain an electrical circuit device that has a small connection resistance value, small variations in connection resistance, is mechanically strong, and has an extremely low defective rate.

Furthermore, if the electrical circuit components are connected via the electrical connecting member by a connecting body formed by metallization and/or alloying, it may be difficult to make the electrical circuit device during the production process or during the production process. f&
In this case, there is no need to use a jig or the like to hold the electric circuit components, and the electric circuit device can be easily created and managed after it is created.

Furthermore, if electrical circuit components are connected by a connecting body formed by metallization and/or alloying through an electrical connection member, the contact resistance between the electrical circuit components will increase when only one electrical circuit component It becomes smaller compared to the case of ta series.

On the other hand, if one or the other electric circuit component is connected by a connection other than metallization and/or alloying, deterioration of the electric circuit component due to heat that occurs during metallization and/or alloying can be prevented.

Additionally, depending on the application, there may be cases where it is desired to make the electrical circuit components as described above, and in such cases, if the electrical circuit components are metallized and/or alloyed with a connection other than TM connection, such a request can be met. It will be impossible.

In addition, since a plate or an assembly of plates is disposed near or on the side surface of at least one electrical connection member of the electric circuit component, internal stress may occur in the mounting. When stress is applied from the outside, stress concentration can be alleviated, and cracks and the like that may occur due to stress concentration can be prevented. Furthermore, this plate has a long path from the outside world to the electric circuit components, making it difficult for water etc. from the outside to invade the electric circuit components. Accordingly, the reliability of the equipment can be increased.

In addition, if the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc., the heat generated from the electric circuit components can be quickly radiated to the outside world, so the heat radiation characteristics An excellent electrical circuit device can be obtained. Furthermore, if the material of the plate is metal,
Noise from the outside world and electrical noise generated from electrical circuit components can be blocked, and electrical circuit waves with good characteristics in this respect can be obtained.

[Example] (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.

This embodiment has a holder 111 made of an organic material and a metal member 107 that is an electrically conductive member embedded in the holder 111, and one end of the metal member 107 is connected to the holder itt.
is exposed on one side of the gold f! Part 1
an electrical connection member 125 whose other end is exposed on the other side of the holder; Member 107
One semiconductor element 101 is alloyed with one end of the semiconductor element 101 and has a connection part 105 at the connection part 105.

One circuit board 104 which is alloyed and connected to the other end of the metal member 107 which is sprayed on the other side of the holder 1.11; and: a semiconductor element 101. The circuit board 104 and the plate 151 are embedded and sealed. The sealing material 170 is made of a material different from that of the plate 151.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), a gold 11 wire 121 made of a metal such as gold or an alloy and having a diameter of 20 ILm is attached to a rod 122 with a width of 40ILm.

After wrapping, the above gold EK is wrapped in resin 123 such as polyimide.
i! 1121 is embedded, and after embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. The vk is sliced at the order of the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIGS. 2(b) and 2(c).

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107 4R, and the resin 123
But the holding body (insulator) 111 is 41! to be accomplished.

In this electrical 1mbA member 125, the metal members (total gold) 7:1i121 are wood 1ji123niJ:su7
It is insulated in terms of ttjiC. Further, one end of the metal wire 121 is exposed to the semiconductor element 101 side, and the other end is exposed to the circuit board 1 side.
It is exposed on the 04 side. The fogging parts are the semiconductor element 101, the circuit board 104, and the VT control ff1, respectively.
It becomes 108,109.

Next, as shown in FIG. 1(a), a semiconductor element 101,
An electrical connection member 125 and a circuit board 104 are prepared. The semiconductor element 101° circuit board 104 used in this example has a large number of connection parts 102 and 105 inside thereof.

Note that the connection portion 102 of the semiconductor element 101 is connected to one circuit board 1.
Metal is exposed at positions corresponding to the connection portion 105 of 04 and the connection portions 108 and 109 of the electrical connection member 125.

Connection part 102 of semiconductor element lot and electrical connection member 1
25 connection parts 10B, or one circuit board 104 la
Zokugunbu 105? fE pneumatic and nuclear connection member 125 connection part 109
After 1 positioning, the A pattern of the JIiii joint part 102 of the semiconductor element 101 and the Au of the connection part 108 of the electrical connection member 125 are further connected to the circuit board 1.
Au of connection part 105 of 04 and TL4A approximately 4A member 125
One side of the connecting portion 109 of the wafer is connected to Au by metal and/or alloying (FIG. 1(b)).

Here, the semiconductor element 1G! There are three methods for connecting the electrical connection member 125 and the circuit board 104 using metal and/or alloying.

Either method may be used.

■ After positioning the semiconductor element 101 and the electrical connection member 125° circuit board 104,
02- and the connection part 108 of the electrical connection member 125, and the connection part 105 of the circuit board 1G4 and the electrical connection member 12.
A method of simultaneously metallizing and/or alloying the connecting portion 109 of No. 5 and connecting.

■Semiconductor Seiko 101. Position the electrical connection member 125 and connect the semiconductor element 101! After alloying and connecting 02 and the connecting portion 10g of the electrical connecting member 125', 1
Circuit board! Position 04 and electrical connection member! A method of connecting the connection 611109 of No. 25 and the connection portion 105 of the circuit board 104 by metallizing and/or alloying.

■Circuit board 104 and electrical! Connecting member 125 is positioned, and connecting portion 105 of circuit board 104 and electrical connecting member 1 are positioned.
After metallizing and/or alloying and connecting the 25 VC connection parts 109, the semiconductor device lot is positioned and electrically connected.
A method of metallizing and/or alloying the connection portion 10g of the R connection member 125 and the connection portion 102 of the semiconductor element 101 to connect them for 1 m.

Next, components created as described in step 1 or above (electric circuit components)
A plate made of stainless steel with a thickness Q is placed near the semiconductor element 101 of
', a 1 mm plate 151 is arranged.

Next, the semiconductor element 101. Circuit board 104 and board 1
In this example, both the semiconductor element 101 and the circuit board 104 were sealed. A thermoplastic resin was used as the sealing material, and an injection molding method was used as the sealing method.

When the connectivity of the connection portions of the electrical circuit device produced as described above was examined, it was found that the connections were highly reliable.

Furthermore, the reliability of various characteristics was also excellent.

(Second example) FIG. 3 shows a second embodiment.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

In this example, as the electrical 1a connection member 125, a holder made of an organic material with 5i02 powder (not shown) dispersed therein was used.

Further, in this example, the connection portion 54 of the electrical connection member and the connection portion 52 of the circuit board 51 are connected by metallization and/or alloying, while the connection portion 54 of the electrical connection member 125 and the semiconductor element 4 are connected by metallization and/or alloying. The VC connections of the TA connections were made using connection methods other than metallization and/or alloying. That is, the semiconductor element 4 was pressed against the electrical connection member 125, and sealing was performed from above.

Note that as the electrical connection member 125, one having dimensions corresponding to the semiconductor element 4 was used.

In this example, a lead frame 55 is connected to the lower surface of the circuit board 51.

In this example, the sealing material used to seal the semiconductor element 4 and the plate 151 was a thermoplastic material in which powder of 5i02 was dispersed in 84m.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of each of the eight characteristics was also excellent.

(Third example) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

After connection, place the lead frame 1 on the top surface of the circuit board 51.
controlled.

Next, a plate assembly 151 as shown in FIG. 4(aL)
Also, inside the mold cavity? The It94 circuit member was set, and the injector was injected to form the sealing material 63.

In addition, as a modified example, as shown in FIG. 4(b), a sealing material 63 was formed by setting the mold together with two plates 151 in the cavity of a mold and performing injection stacking. In this modification, the top surfaces of the two plates 151 are exposed to the outside.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of each of the eight characteristics was also excellent.

(Fourth example) FIG. 5 shows a fourth embodiment.

In this example, the first electric circuit component is a semiconductor element of 4°,
This is an example in which the second electric circuit component is the semiconductor element 4. In this example, a member with dimensions corresponding to the semiconductor element 4 is used as the electrical connection member, and the lead frame 1 is connected to the Mll air vent connection member 125. IabA is attached to the metal member exposed on the 4° side of the semiconductor element.

In this example, two plates 15 are placed on the 4° side surface of the first semiconductor element.
The plate 151 was placed so that the number 1 was facing upward, and the plate 151 was sealed with a sealing material 170. In addition, FIG. 5(a) shows an example in which the entire board 151 is embedded and sealed, and an example in which another board material is embedded and sealed so that the lower surface of the board is sprayed out. Figure 5Cb').

This shows an example in which the upper surface of the plate 151 is sealed to be exposed to the outside.

Note that as the insulator of the electrical connection member 125, an organic material in which one or both of fully curved powder and/or fibers was dispersed was used.

FIG. 5(b) shows an example in which each of the 4Bs is connected by a connection method other than metallization and/or alloying. The sealing in this case is the same as in the third embodiment except that the semiconductor elements 4 and 4° are pressed and sealed.

In this example as well, the JB control department was controlled by 1a with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Fifth example) FIG. 6 shows a fifth embodiment.

In the fifth embodiment, a circuit board 101 is used as a first electric circuit component and a second electric circuit component, and the portions other than the connecting portions are covered with insulating films 103 and 106.

This is an example in which 104 is used.

Further, as an electrical connection member, one shown in FIG. 7 was used. That is, the electrical 1m connection member 12 shown in FIG.
5, the exposed portion of the metal member 107 protrudes from the surface of the holder (resin insulator) 111. The electrical connection member 125 may be created by, for example, the following method.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
Prepare the electrical connection member shown in (C) 6. Next, coat both sides of this electrical connection member with gold I! Etching may be performed until the line 121 protrudes from the polyimide resin 123 by about loILm.

Note that in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 μm, but any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protrusion is connected to the electrical VT connection member 25 by the metal wire 12.
Place it in a mold with a recess at position 1.

Bumps 150 as shown in FIG. 8 may be formed by crushing the protrusions 126 of the gold [11121. In this case, the metal wires 121 will be difficult to fall off from the insulator ill.

Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the LA branch was connected with high reliability.

Moreover, each! The reliability of the l characteristic was also excellent.

(6th example) : Figure A9 shows the sixth embodiment.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame 1 is used as the second electrical component.

The connection part 6 of the lead frame l has Ag on the surface of the 42 alloy.
For the AVC continuation using plated materials, a heat pressure method combined with ultrasonic waves was used.

Furthermore, in this example, a bent plate 1 with a hole 152 is placed near the semiconductor element 4 which is an electric circuit component.
51 was used.

Further, in this example, the plate 151 is bonded only to the semiconductor element 4, which is an electric circuit component of the electric cylinder 1.

Furthermore, the entire plate 151 is sealed.

Other points are similar to the fifth embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Seventh Example) FIG. 10 shows a seventh embodiment.

In this example, the electrical connection member 125 is different from the electrical contact bA member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example.

The pitch between the metal members is narrower than that shown in the fifth embodiment. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the ta parts of the first circuit board.

That is, in the fifth embodiment, the first circuit board 101 and the second
An electrical connection member 125 is located at the connection position with the circuit board 104.
Because we have placed the connection position of.

Although it was necessary to determine the position of the electrical control member 25,
In this example, a first circuit board 101 and a second circuit board 10
4 is necessary, but the electrical connection member 125
There is no need for positioning with. Therefore, the connection dimensions (dll, F
il) and the connection dimensions of the electrical connection member (d12.PI3)
It is also possible to connect without positioning by selecting an appropriate value for .

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Eighth Example) FIG. 11 shows an electrical connection member used in the eighth example.

Figure 11 (L) is electrical! a Perspective view of the continuation member.

FIG. 11(b) is a cross-sectional view of the above-mentioned Tt and the electrical connection member.

An example of making such an electrical connection member will be described below.

First, the electrical connection member 12 is manufactured using the manufacturing method shown in the first embodiment.
Prepare three pieces of 8, 129, and 130.

1 piece 1289 gold Ei511217) The position is m row and n column, displaced from the center by ma and na.

The position of the metal wire 121 of the two-sheet slot 129 is m at row m and column n.
It is displaced from the center by a c and m b c.

The position of the metal 19121 of the 3-piece slot 130 is m rows and n columns.
It is displaced from the center by a d and n b d. a
.

The values of b, c, and d are such that the upper and lower metals 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. Three electrical connection members are positioned and laminated using a method such as thermocompression bonding to create an electrical #jc connection member 125.

In addition, in this example, the position of the gold E of the electrical connection member was selected according to the rules such as m rows and n columns, but the upper and lower metals are conductive, and the left and right sides are not electrically conductive to each other. It can be random if you set it to .

In addition, although this example describes the case where 3 layers are stacked, 2 layers are stacked.
I mentioned that you can use any number of layers as long as you have more than one layer, and that they are laminated using a thermocompression bonding method, but it is not suitable for compression.

A method such as adhesion may be used.Furthermore, the electrical connection member of this example may be processed to provide protrusions as shown in FIG. 7, or bumps 150 may be provided as shown in FIG. You can.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Ninth Example) FIG. 12 shows an electrical connection member used in the ninth example.

FIG. 12C is a cross-sectional view of the electrical connection member in the middle of manufacturing, FIG. 12B is a perspective view of the electrical JR connection member, and FIG.
Figure (c) is the above sectional view.

In advance, 20
A hole 142 with a diameter larger than ILmφ is made. A metal wire 121 of 2O4mφ made of a metal or alloy such as Au is passed through the hole 142, and a resin 123 is inserted between the holder 122 and the metal wire 121. 12.Cure 3.

The hardened resin 123 becomes an inclusion. After that, gold f! The wire 121 is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this manner is shown in FIGS. 12(b) and 12(e).

Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 7, or a bump 150 as shown in FIG. 8.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

! , a highly reliable connection can be obtained when connecting a semiconductor element to an electric circuit component such as a circuit board or a lead frame. Therefore, the conventionally used wire bonding method, T
It becomes possible to replace the AB method and the CCB method.

2. According to this JArJ], since the Ia part of the electric circuit component can be placed in any position (especially inside), it is possible to connect more points than the wire bonding method or TAB method, making it suitable for connections with a large number of pins. The method is as follows. Furthermore, since an insulating material exists between adjacent metals of the electrical connection member, electrical conduction between adjacent metals does not occur even if the adjacent pitch is narrowed, making it possible to connect more points than the CCB method. .

3. Since the amount of metal members used in the electrical connection member is small compared to the conventional one, even if expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

4. A high-density electric circuit device such as semiconductor W21 can be obtained.

5. In the first gist and the gist 277', since one or the other electric circuit components are connected by a connection other than metallization and/or alloying, the electric circuit components generated during metallization and/or alloying Deterioration due to heat can be prevented. Additionally, depending on the application, there may be cases where it is desired to make electrical circuit components removable, and in such cases, it is possible to meet such requests by using connection rods other than connections made by metallization and/or alloying of the TL electrical circuit components. becomes.

Also, in the third gist, one of the electric circuit components.

Since the electrical circuit components are connected via the VT connector formed by metallization and/or alloying through the electrical connection member, the electrical circuit components are firmly (strong in terms of strength) and reliably connected to each other. An electrical circuit device that is mechanically strong and has an extremely low defect rate can be obtained.

6. The holder of the electrical connection member is made by dispersing powder or fiber made of one or more of metal materials and inorganic materials with good heat conductivity in an insulator, or by making it electrically conductive. When the components are made of metal or inorganic materials that have been treated to insulate, heat generated from the cardiac circuit components can be radiated to the outside through the electrical circuit components and other electrical circuit components. , 8. An electric circuit device with good dissipation properties can be obtained.

In addition, when one or more powders of metals, alloys, ceramics, or mji are dispersed in the sealing material, the heat generated in the electrical circuit components is quickly conducted to the outside world, resulting in electrical circuits with good heat dissipation properties. A circuit device is obtained.

7. Dispersing one or more powders or fibers of one or more kinds of metal materials and solid materials having a coefficient of thermal expansion relatively close to that of the electric circuit components into the insulator of the electrical connection member. Furthermore, when one or both of the metal alloy 1 alloy, one or more types of ceramic powder, or m-fiber is dispersed in the encapsulant, the thermal expansion coefficient of the encapsulant becomes higher than that of the electric circuit component. 8 expansion coefficient, so there is little thermal stress even when heat is applied, making it a highly reliable electrical circuit device.
As a result, a semiconductor device is obtained.

8. Since the sealing material can be injected at high pressure, it is possible to seal not only thermosetting resins for constant pressure transfer, but also thermoplastic resins that need to be injected at high pressure.

9. When at least one or both of powder and fiber of a metal material is included in the insulator and the sealing material of the electrical connection member, an electric circuit device with a high shielding effect can be obtained.

10. Since a plate or an assembly of plates is placed near the electric circuit components, stress concentration can be alleviated when internal stress is generated in the device or stress is applied from the outside.
Cracks that may occur due to stress concentration can be prevented. Furthermore, this plate has a long path from the outside world to the electric circuit components, making it difficult for water etc. from the outside to invade the electric circuit components. Therefore, the reliability of the device can be improved.

11. By embedding or laminating other materials in the holder of the electrical connection member, an electrical circuit or circuit device with good heat dissipation, low stress, and good shielding efficiency can be obtained.

12. When the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc., the heat generated from the electric circuit components can be quickly radiated to the outside world, so the heat radiation characteristics An excellent electric circuit device can be obtained. Furthermore, if the material of the plate is metal,
Noise from the outside world and electromagnetic noise generated from electric circuit components can be blocked, and an electric circuit device with good characteristics in this respect can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the first embodiment, and FIG. 1(a)
1(b) shows the state after connection, FIG. 1(C) shows the state after the blade is exposed, and FIG. 2 shows an example of a manufacturing method of the electrical connection member used in the first embodiment. This is a diagram for explaining
Figure 2 (JL) is a cross-sectional view, Figure 52 (b) is a visual view, and Figure 2 (C) is a cross-sectional view. Fig. 3 shows a second embodiment, Fig. 3 (51) is a perspective view, and Fig. 3 (b) is a sectional view. FIG. 4 is a sectional view showing the third embodiment. Figure 5 is i4
It is a sectional view showing an example. FIG. 6 shows a fifth embodiment, in which FIG. 6(a) is a sectional view showing the state before connection, and FIG. 6(b) is a sectional view showing the state after connection. Figure 57 and Figure 8 also show the Example 55, Figure 57 (L) and Figure 8 (a) are perspective views, and Figure 7 (b) and Figure 8 Cb) are cross-sectional views. FIG. 9 shows the sixth embodiment, FIG. 9(a) is a perspective view showing the state before connection, and FIG. 9(b) is a sectional view showing the state after connection. Figure 10 is a sectional view showing the 0'S7 embodiment, Figure 1O (&) is before connection, Figure 1θ (b)
Figure 11 shows the state after connection, Figure t511 shows the electrical connection member according to the eighth embodiment, Figure 11 (&) is a perspective view, and Figure 11 (b) is a sectional view. FIG. 12 shows an example of manufacturing an M1 electrical connection member according to the ninth embodiment, where FIGS. 12(a) and 12(c) are cross-sectional views, and FIG. 12(b) is a perspective view. 13 to 20 show conventional examples. 14 is a cross-sectional view, except for FIG. 14, which is a plan perspective view. l...Lead frame, 2...Element tower a portion of lead frame, 3...Silver paste), 4.4'...Pah conductor element, 5.5°...#B of semiconductor element Headquarters, 6...
Connection part of lead frame, 7... Ultrafine metal wire, 8...
·resin. 9... Semiconductor device, 10... Outer peripheral edge of semiconductor element. 11... Outer peripheral edge of element MSS group of lead frame. t S-...Carrier film substrate, 17... Inner lead portion of carrier film substrate, 20... Resin. 21... Resin% 31... Solder bump, 32-... Board. 33... Connection portion of the board, 51... Circuit board, 52...
... connection part of circuit board, 54 - connection part of electrical connection member, 55 - lead frame, 63 - sealing material,
70.70"--Metal material, 71.71'--Insulating film. 72, 72"--Exposed surface of absolute Q film, 73,73°--Exposed surface of metal material, 75.75 °...Circuit base material. 76.76°... Connection portion of circuit board, 77... Insulating material of anisotropic conductive film, 78... Anisotropic conductive'; 1 as a film,
79... Conductive particles, 81-... Insulator fi of elastic connector, 82-... Gold l1Xi of elastic connector, 83... Elastic connector, 101...
...Electrical circuit parts (semiconductor element 1 circuit board)% 102
---1a Department. 103... Insulating film, 106-... Insulating film, 104...
Electric circuit parts (circuit board), 105-... Connection part, 10
7... Metal member, t Oa-... Connection part, 109-...
・Connection part, 111...Holding body (absolute 1.i body), 121
-...Metal wire, 122-...Bar, 123-...Resin, 1
24--Dotted line, 125--Electrical connection member, 126
...Protrusion, 12B, 129, 130--Electrical connection member, 131.132--Metal wire guide plate, 150--
・Banbu, 151-・Plate, 152-・Hole, 1 foot 0・
... Sealing material. Fig. 1(a) Fig. 1(C) Fig. 2vA(a) Fig. 2vA(b) Fig. 2J1(c) Fig. 3(0) Fig. 3(b) Fig. 4(a) Fig. 5(a) ) Figure 4 (b) Figure 6 (a) Figure 6 (b) Figure 7 (a) Figure 7 (b) Figure 8 (a) Figure 8 (b) Figure 9 (0) Figure 9 (b) Go to 1 Figure 10 (a) Figure 10 (b) Figure 11vA (a) Figure 11 (b) Figure 12 (0) Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 19 Figure 20

Claims (5)

[Claims] (1) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; In the department,
at least one other electrical circuit component to which the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected; Near any one or more sides of the electrical circuit component connected to the electrical connection member and/or opposite the electrical connection member on the other side of the holder At least a plate disposed near the side surface; and a sealing material made of a material different from the plate, embedding and sealing at least a part of the electric circuit component and/or the plate; An electric circuit device characterized by: (2) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; In the department,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made with at least one other electrical circuit component via a connection body formed by metallizing and/or alloying the connection part and the other end; one of the holders; Near one or more sides of the electrical circuit component connected to the electrical connection member on the other side of the holder and the electrical circuit component connected to the electrical connection member on the other side of the holder and/or a plate disposed near the surface opposite to the connecting member; and a sealing material made of a material different from that of the plate, embedding and sealing at least a portion of the electric circuit component and/or the plate; An electric circuit device comprising at least the following. (3) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
The connection is made through a connection body formed by metallizing and/or alloying the connection portion and the other end; and at least one or more electric circuit component; having, in the connection part,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made with at least one other electrical circuit component via a connection body formed by metallizing and/or alloying the connection part and the other end; one of the holders; Near one or more sides of the electrical circuit component connected to the electrical connection member on the other side of the holder and the electrical circuit component connected to the electrical connection member on the other side of the holder and/or a plate disposed near the surface opposite to the connecting member; and a sealing material made of a material different from that of the plate, embedding and sealing at least a portion of the electric circuit component and/or the plate; An electric circuit device comprising at least the following. (4) The electric circuit device according to any one of claims 1 to 3, wherein the electric circuit component is a semiconductor element, a circuit board, or a lead frame. (5) The sealing material is a thermoplastic resin or a thermoplastic resin in which one or more of powders or fibers made of one or more of metals, alloys, and inorganic materials are dispersed. The electric circuit device according to any one of items 1 to 4.