JPH01202835A - Positioning device - Google Patents

Abstract

PURPOSE:To decrease the number of sensors, and to shorten a stroke at a time when a wafer is pushed against a pushing pin by detecting the detection of the orientation flat of the wafer and the confirmation of a contact with the pushing pin of the wafer by the same sensor. CONSTITUTION:A photoelectric sensor 26 is installed at an angle to some extent inclined from a state vertical to the surface of a wafer to a base 23 to which a pushing pin 4a is fitted, and the base 23 is moved vertically by an actuator 25. The base 23 to which the pushing pin 4a and the photoelectric sensor 26 are mounted is lowered, an orientation flat is detected under the state in which the wafer 2 is not brought into contact with the pushing pin 4a, and the base 23 is elevated and the wafer is pushed against the pushing pin. The optical path 27 of the photoelectric sensor 26 reaches to the position of the detection of the orientation flat of the wafer 2 when the base 23 is brought down and the optical path 27 of the photoelectric sensor 26 reaches to the position of the confirmation of a contact with the pushing pin 4a of the wafer when the base 23 is lifted. Accordingly, the sensors are decreased, and a stroke at a time when the wafer is pushed against the pushing pin is shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a positioning device using a wafer orientation flat for semiconductor manufacturing equipment and the like.

(Prior Art) Conventionally, as shown in FIGS. 9 and 10, a photoelectric sensor 5 for detecting an orientation flat detects the orientation flat, and a separate photoelectric sensor 6 detects the pressing bin 4a. .

It is confirmed whether the wafer 2 is in contact with the wafer 4b.

The wafer 2 is placed on the rotating shaft 1. The photoelectric sensors 5 and 6 are fixed to the base 3. Further, the photoelectric sensor 5 forms a sensor optical path 7 that can receive light from a light source 9 provided on the base 11, and the photoelectric sensor 6 forms a sensor optical path 8 that can receive light from a light source 10. .

This sensor optical path 7 is used to detect the orientation flat of the wafer 2, and the sensor optical path 8 is used to detect the orientation flat of the wafer 2.
This is to confirm whether or not the pins are in contact with the pressing pins 4a and 4b. At this time, the wafer 2 is guided by wafer guide pins 4C.

(Problems to be Solved by the Invention) As described above, the conventional apparatus requires a photoelectric sensor for detecting orientation flat and a photoelectric sensor for confirming that the wafer is in contact with the pressing pin. Also,
These photoelectric sensors require a long distance between the photoelectric sensors (the part indicated by the symbol t in Figure 10) to avoid mutual interference, and the disadvantage is that the stroke when pressing the wafer against the pressing pin becomes long. was there.

This invention aims to eliminate these drawbacks.

[Structure of the invention]

(Means for Solving the Problems) This invention uses the same photoelectric sensor to detect the flat orientation of a wafer and to confirm whether the wafer is reliably in contact with the pressing pins when the wafer is pressed against the pressing pins. I'm planning on going.

Therefore, a photoelectric sensor is installed on the base to which the pressing pin is attached so that it is tilted to some extent from a state perpendicular to the wafer surface, and the base can be moved up and down by an actuator.

(Function) The positioning device configured in this way lowers the base on which the push pin and photoelectric sensor are attached, detects orientation flat without the Ueno rod touching the push pin, and then raises the base to press the Ueno rod against the push pin. Pushing and pressing requires a short stroke.

Also, when the base is down, the optical path of the photoelectric sensor is at the wafer orientation flat detection position, and when the base is up, the optical path of the photoelectric sensor is at the position to check whether the wafer is in contact with the pressing pin. One pair of sensors is sufficient.

(Example) FIGS. 1 and 2 are diagrams for explaining a positioning device using a first orientation flat according to the present invention, with FIG. 1 being a side view and FIG. 2 being a top view. Although the wafer pressing pin 4a is fixed, the actuator 25 moves the photoelectric sensor 26, which is mounted at an angle with respect to the perpendicular line of the wafer 2, up and down. and press pin 4a
.

Check whether it is in contact with 4b. That is, base 2
3, the light from the light source 29 is transmitted to the actuator 2.
A sensor optical path 27 is formed obliquely with respect to the movement of the wafer 2 and the pressing pin 4a, and when detecting the orientation flat, the sensor optical path 27 is located at a position where the base 3 is lowered.

The contact confirmation with the base 4b is performed by raising the base 3 by an actuator 25 at the position of the senna optical path 28. FIG. 3 is a side view showing another embodiment according to the present invention. In this orientation flat positioning device, wafer pressing pins 4a and 4b are fixed to a base 11,
The base 23 to which the photoelectric sensor 26 is attached is moved in a direction parallel to the surface of the wafer 2 to perform each detection. FIG. 4 is a side view showing still another embodiment of the present invention. In this orientation flat positioning device, the Ueno 1 pressing bins 4a and 4b are either fixed or pivoted around the base 23 on which the photoelectric sensor 26 is attached. 30
The optical axes 27 and 28 are rotated and moved around the center to change the positions of the optical axes 27 and 28 to perform respective detections. FIG. 5 is a diagram showing still another embodiment of the present invention, in which a wafer pressing pin 4a and a photoelectric sensor 26 tilted with respect to the perpendicular line of the wafer are installed on the same base 23. The base 23 is moved up and down by seven cutter units 25.

When the base 23 is down, the wafer pressing pin 4
Since the point a is below the surface of the wafer 2, the flat orientation of the wafer 2 can be detected at a position close to the pressing pin 4a, so that the stroke when pressing the wafer against the pressing pin 4a later can be shortened. Further, when the base 23 is on the upper side, the wafer 2 is pressed against the pressing pins 4a so that the orientation is flat. At this time, the optical path 27 is directed from the orientation flat detection position 41 to the wafer 2
By moving the sensor to the position 42 where it is confirmed whether it is in contact with the pressing pins 4a, 4b and forming the sensor optical path 28, it becomes possible to detect both with the same sensor 26.

In addition, as shown in FIGS. 6 and 7, two senna 3
By using 5.36, it is also possible to confirm in which direction Unino-2 is tilted.

Furthermore, as shown in FIG. 8, as another embodiment of the present invention, a pin 4 is used to press the wafer on the upper side of the U-shaped base 23.
By providing this, when the base 23 is moved upward, the orientation flat is detected and the base 2
When you move 3 down, you can confirm the contact with Unino 2.

〔Effect of the invention〕

As explained above, according to the present invention, the number of parts can be reduced because the same sensor can detect the orientation flat of the unicorn and confirm whether the unicorn is in contact with the pressing pin. Furthermore, compared to the case where the above-mentioned detection is performed using separate sensors, since there is no influence due to sensor interference, it is possible to detect the orientation flat in the immediate vicinity of the pressing pin.

In addition, when the pin is lowered, there is no need to worry about the pressing pin hitting the pin, so the orientation flat can be detected very close to the pressing pin, the stroke when pressing against the pressing pin can be shortened, and the pressing error is can be made smaller.

[Brief explanation of the drawing]

Fig. 1 is a side view showing a positioning device using an orientation flat according to an embodiment of the present invention, Fig. 2 is a plan view illustrating the operation of the embodiment shown in Fig. 1, and Figs. 6 and 7 are plan views explaining the operation of the embodiment shown in FIG. 5, and FIG. 8 is a side view showing another embodiment of the invention. , No. 9
The figure is a side view illustrating the prior art, and FIG. 10 is a side view illustrating the operation of the prior art shown in FIG. 9. 2... Wafer, 4a, 4b... Pressing pin, 23.
...Base, 25...Actuator, 26...Sensor, 27.28...Sensor optical path, 29...Light source. Agent Patent Attorney Ken Yudo Chika Mitsuyuki Matsuyama Figure 2 Figure 4 Figure 6 Figure 7 Figure 8

Claims (2)

[Claims] (1) In a device that detects and positions the orientation flat of a wafer using a photoelectric sensor, a sensor is provided to detect the orientation flat and to confirm that the wafer is definitely in contact with the pressing pin when the wafer is pressed against the pin. A positioning device characterized by comprising a base and means for moving the base. (2) The positioning device according to claim 1, wherein the detection sensor is installed on the base so that the optical axis of the detection sensor is tilted to some extent from a state perpendicular to the wafer surface.