JPH01200208A - Optical semiconductor module - Google Patents
Optical semiconductor moduleInfo
- Publication number
- JPH01200208A JPH01200208A JP63024452A JP2445288A JPH01200208A JP H01200208 A JPH01200208 A JP H01200208A JP 63024452 A JP63024452 A JP 63024452A JP 2445288 A JP2445288 A JP 2445288A JP H01200208 A JPH01200208 A JP H01200208A
- Authority
- JP
- Japan
- Prior art keywords
- holding member
- holding
- fixed
- optical
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000003860 storage Methods 0.000 claims abstract description 16
- 239000013307 optical fiber Substances 0.000 claims abstract description 9
- 238000010168 coupling process Methods 0.000 claims abstract description 7
- 238000005859 coupling reaction Methods 0.000 claims abstract description 7
- 230000008878 coupling Effects 0.000 claims abstract description 6
- 239000000696 magnetic material Substances 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 5
- 230000005294 ferromagnetic effect Effects 0.000 abstract 2
- 239000003302 ferromagnetic material Substances 0.000 description 8
- 239000000835 fiber Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000272201 Columbiformes Species 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は元手4体モジエールに関し、@に元ファイバと
光結合する光半導体モジュールに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a four-body module, and more particularly to an optical semiconductor module optically coupled to a source fiber.
この種の光半導体モジュールにおいては1元ファイバへ
の最適な光結合をするために1元ファイバと適用光学系
との相対位置を正確に保つ必要がある。In this type of optical semiconductor module, it is necessary to accurately maintain the relative position between the primary fiber and the applied optical system in order to achieve optimal optical coupling to the primary fiber.
従来1元ファイバを固定する端末部材と発受光素子1元
結合用のレンズ等を収納する格納部材との接合手段なら
びに発受光素子を固定する第1の保持部材および光結合
用のレンズを固定する第2の保持部材と格納部材の内部
との接合手段はエポキシ系接着剤、半田あるいはヤグ(
YAG)レーザ等による浴接を使用していた。しかし、
エポキシ系接着剤や半田による固定の手段では接合強度
。Conventional means for joining a terminal member for fixing a single-element fiber and a housing member for housing a lens for single-coupling light emitting/receiving elements, and a first holding member for fixing a light emitting/receiving element and a lens for optical coupling. The means for joining the second holding member and the inside of the storage member is epoxy adhesive, solder, or Yag (
YAG) laser bathing was used. but,
Bonding strength for fixing methods such as epoxy adhesive or solder.
耐熱性1作業性に問題があることから、最近はレーザ溶
接手段の導入が盛んである。Since there are problems with heat resistance 1 and workability, recently laser welding means have been widely introduced.
ところで、レーザ溶接手段を適用した場合、光フアイバ
固定用の端末部材、レンズ等の保持部材のような比較的
小さい部品は、照射−浴融時に溶融固定位置がずれてし
まい、正確な位置に配備できないという問題がある。By the way, when laser welding is applied, the melting and fixing positions of relatively small parts such as end members for fixing optical fibers and holding members for lenses etc. shift during irradiation and bath melting, making it difficult to place them in the correct position. The problem is that it can't be done.
この浴融部の位置ずれを防ぐ方法として、保持部材等を
治具としてのυ4型手段によって力学的な力で保持ある
いは支持するという方法が従来実施されてきた。しかし
、この方法にも問題があるため保持部材等の構成上の見
直しが必要である。As a method for preventing this displacement of the bath melting part, a method has been conventionally practiced in which a holding member or the like is held or supported by dynamic force using a υ4 type means as a jig. However, this method also has problems, so it is necessary to review the structure of the holding member and the like.
次に、上述したレーザ溶接手段を過用した従来の光半導
体モジーールについて問題点を記述する。Next, problems with conventional optical semiconductor modules that overuse the above-mentioned laser welding means will be described.
5I41の問題点は照射溶融固定時に位置ずれが生じ部
品の正確な配置ができないこと、第20問題点は調整手
段等の力学的手段に基づく支持あるいは保持では光半導
体モジー−ルを小型にできないことである。The problem with 5I41 is that positional deviation occurs during irradiation melting and fixation, making it impossible to accurately place the parts.The 20th problem is that the optical semiconductor module cannot be made smaller by supporting or holding it using mechanical means such as adjustment means. It is.
第1の問題点にレーザ浴接手段自身が持つ特異性に起因
する。レーザ浴接は直径0.5a+i度のスポット径に
紋った元ビームを部材に照射して両部材を局部的に浴接
する方法である。元ビームの照射時は、ステンレス鋼等
でf′i部材の照射領域が局部的に1,200〜1.5
00°C程度の温度に達し。The first problem is caused by the uniqueness of the laser bath contacting means itself. Laser bath contact is a method of irradiating a member with an original beam having a spot diameter of 0.5a+i degrees to locally bath contact both members. When irradiating with the original beam, the irradiation area of the f′i member is locally 1,200 to 1.5
The temperature reached around 00°C.
溶融状態にある。次に照射を停止すると局部的に急冷さ
れ、結晶化過程が急速に進行する。この結晶化isは極
短時間で、しかも原子間の結合力が非常に大きく、凝縮
力によって金属材料さえもひび割れ現象を引き起す程で
ある。位置ずれはこの結晶化過程で生じる。りまり、光
半導体モジーールを構成する場合、俵数1h所を同時に
溶融固定する方法が一般的であシ1分割した元ビームの
強度のばらつき、照射焦点位置の違いによるエネルギー
密度のばらつき1両溶接部材間の隙間の違い等が原因で
凝縮力の不均衡が生じ1位置ずれする。It is in a molten state. Next, when the irradiation is stopped, localized quenching occurs and the crystallization process progresses rapidly. This crystallization takes place in an extremely short period of time, and the bonding force between atoms is so great that even metal materials can crack due to the condensation force. Misalignment occurs during this crystallization process. When constructing an optical semiconductor module, it is common to melt and fix several bales at the same time.There are variations in the intensity of the divided original beam, and variations in energy density due to differences in the irradiation focus position. Due to differences in gaps between members, etc., an imbalance in condensing force occurs, resulting in a one-position shift.
変位量は数μmから30μmもあり、厳しい精度を要す
る部分、すなわち1発光系子とレンズ、レンズと元ファ
イバとの配置が特に問題になる。The amount of displacement ranges from several μm to 30 μm, which poses a particular problem in parts that require strict precision, that is, the arrangement of one light-emitting system and a lens, and the lens and the original fiber.
第2の問題点は、H!接部材の保持と複数軸のC4整手
段を強固に保つ必要とに起因する。調整手段は、前述し
た位置ずれの原因となる結晶化過程での凝縮力の不均衡
の影響を受けない保持ろるいは支持構成としなければな
らない0位置ずれを防止するためVCは通常数lO権程
の保持力を喪することから、眺■手段の各部構成要素の
肉厚を厚く。The second problem is H! This is due to the need to firmly maintain the contact member and the C4 alignment means of multiple axes. The adjustment means must be of a holding or supporting structure that is not affected by the imbalance of condensing forces during the crystallization process that causes the above-mentioned misalignment.To prevent zero misalignment, the VC usually has a power of several liters. In order to avoid the loss of holding power, the thickness of each component of the viewing means is increased.
あるいは材料強腿の鳩いものを使用しなければならない
。ぼた、この材料を用いて複数軸の調整機構を構成する
ことから調歪手段が大型でかつ複雑になり、微細な間隔
の制御が出来なくなる。従って、上述の調整手段で製作
した光半導体モジュールは大きなものになってしまうと
いう欠点を有する。Or you must use the material of strong pigeons. However, since this material is used to construct a multi-axis adjustment mechanism, the strain adjustment means becomes large and complicated, making it impossible to control minute intervals. Therefore, the optical semiconductor module manufactured by the above-mentioned adjustment means has the disadvantage that it becomes large.
以上、従来例について問題点を記したが、いずれにして
も1元手部品の正確な配置ができないこと、光半導体モ
ジュールが大きくなってしまうといった問題を招いてい
る。The problems with the conventional example have been described above, but in any case, problems such as the inability to accurately arrange the single-source components and the increase in the size of the optical semiconductor module arise.
本発明の光半導体モジュールは、光ファイバと。 The optical semiconductor module of the present invention includes an optical fiber.
この元ファイバの端fIl全固定する端末部材と1発覚
元素子と、この発受光素子を支持する第1の保持部材と
、前記発受光素子を前記元ファイバに光結合するレンズ
と、このレンズを固定する第2の保持部材と、格納部材
とを有し、高出力レーザの光ビームで前記端末部材、前
記第1の保持部材及びIOI記第2の保持部材を別記格
納部材に溶融固定する元手得体モジュールにおいて、前
8c端末部材。A terminal member for completely fixing the end fl of this original fiber, a detection element, a first holding member for supporting this light emitting/receiving element, a lens for optically coupling the light emitting/receiving element to the original fiber, and this lens. A source having a second holding member to be fixed and a storage member, and melting and fixing the terminal member, the first holding member and the second holding member described in IOI to the storage member separately described with a light beam of a high-power laser. In the hand module, the front 8c terminal member.
前記第1の保持部材及び前記第2の保持部材のそれぞれ
の底面に強磁性体を固着している。A ferromagnetic material is fixed to the bottom surface of each of the first holding member and the second holding member.
次に1本発明について図面を参照して説明する。 Next, one embodiment of the present invention will be explained with reference to the drawings.
第1図は本発明の第1の実施例の断面図である。FIG. 1 is a sectional view of a first embodiment of the invention.
石英あるいは多成分系を素材とする光ファイバ101は
、端末部材103の中心部に設けた貫通孔102に挿入
され、エポキシ系接着剤104で固定されている。端末
部材103は、格納部材105との整合を良くするため
に、端末部材端面113を十分平担にし、YA(]レー
ザ等の尚出力レーザからの光ビームの照射を容易にする
ために鍔を設けである。また、端末部材端面113の底
面vCf′i接着剤で固定したドーナツ形の永久磁石1
11を設けている。格納部材105の内部には、半導体
レーザ、発光ダイオード等の発光源あるいはシリコン系
、ゲルマニウム系等の光検出器からなる発受光素子10
6を支持する第1の保持部材108と、元ファイバ10
1への光結合を最適化するためのレンズ107を固定し
た第2の保持部材109とが設置しである。なお2本実
施例では。An optical fiber 101 made of quartz or a multi-component material is inserted into a through hole 102 provided at the center of an end member 103 and fixed with an epoxy adhesive 104. The terminal member 103 has an end face 113 sufficiently flat in order to improve alignment with the housing member 105, and a flange to facilitate irradiation with a light beam from an output laser such as a YA(] laser. In addition, the donut-shaped permanent magnet 1 fixed with adhesive is attached to the bottom surface vCf'i of the end surface 113 of the terminal member.
11 are provided. Inside the housing member 105, there is a light emitting/receiving element 10 consisting of a light emitting source such as a semiconductor laser or a light emitting diode, or a photodetector such as a silicon-based or germanium-based photodetector.
6 and the original fiber 10
A second holding member 109 to which a lens 107 is fixed for optimizing optical coupling to the lens 1 is installed. In addition, in the present example.
レンズ107を中心部の屈折率の大きな屈折率分布型と
している。mlの保持部材108.第2の保持部材10
9は、端末部材103と同様に、格納部材105との振
合部が十分平担な保持部材端面114を有する鍔が設け
てあシ、保持部材端面114底面に接着剤で固定した板
形の永久磁石112を設けている。端末部材103.第
1の保持部材108及び第2の保持部材109の鍔の厚
さは、格納部材105との高出力レーザ光による浴融接
合を容易にするために、200μmから500μm程度
の肉厚としている。The lens 107 is of a refractive index distribution type with a large refractive index at the center. ml holding member 108. Second holding member 10
Similar to the terminal member 103, 9 is a plate-shaped plate having a flange having a sufficiently flat holding member end surface 114 at the swinging portion with the storage member 105, and fixed to the bottom surface of the holding member end surface 114 with adhesive. A permanent magnet 112 is provided. Terminal member 103. The thickness of the brim of the first holding member 108 and the second holding member 109 is approximately 200 μm to 500 μm in order to facilitate bath fusion bonding with the storage member 105 using a high-power laser beam.
格納部材105は、鉄あるいはニッケル等を含有する強
磁性体、すなわち、鉄54.488%、二。The storage member 105 is made of a ferromagnetic material containing iron or nickel, that is, 54.488% iron.
ケル29チ、コバルト16%、マンガン0.3チ。Kel 29chi, cobalt 16%, manganese 0.3chi.
シリコン0.2%、炭素0.01優、硫黄0.002%
から成るコバ(Kovar)材、あるいは、フェライト
系、マルテンブイト析出硬化糸ステンレス鋼としている
。Silicon 0.2%, carbon 0.01%, sulfur 0.002%
It is made of Kovar material, or ferritic, martenbutite precipitation hardened thread stainless steel.
端末1fil材103 、第1の保持部材ios、第2
の4#:片部材109と格納部材105とは、各々調整
手段によシ所定の光学的相対位置に配置さjL。Terminal 1fil material 103, first holding member ios, second
4#: The piece member 109 and the storage member 105 are respectively arranged at predetermined optical relative positions by adjusting means.
各部材に取υ付けた永久磁石111筺たは112により
互に吸引固定する。この状態で、端末部材103では第
1図の水平方向からbFAlの保持部組08及び第2の
保持部材109では垂直方向から−、シ
尚出レーザの元ビームを照射して、格納部材105との
両部材内に溶融接合部110を形成する。They are mutually attracted and fixed by permanent magnets 111 or 112 attached to each member. In this state, the terminal member 103 is irradiated with the original beam of the outgoing laser from the horizontal direction in FIG. A fused joint 110 is formed in both members.
以上の説明により明らかなように、第1図に示す実施例
によれば、端末部材103.第1の保持部材108.第
2の保持部材109の底面に設けた永久磁石111及び
112が強磁性体からなる格納部材105に強力な吸引
力で吸着している。As is clear from the above description, according to the embodiment shown in FIG. 1, the terminal member 103. First holding member 108. Permanent magnets 111 and 112 provided on the bottom surface of the second holding member 109 are attracted to the storage member 105 made of ferromagnetic material with a strong attractive force.
この吸引が強力なことから、元ビーム照射停止直後の急
冷時に生じるf471 itb所の凝縮力の不均衡に基
づく位置ずれを最小限に食い止めることができる。Since this suction is strong, it is possible to minimize the positional shift caused by an imbalance in the condensing force at the f471 itb location, which occurs during rapid cooling immediately after the original beam irradiation is stopped.
また1本実施例の保持部材を用いれば1部材の保持を強
磁性体のみで出来ることから、調整手段に従来のごとく
凝縮力に打ち勝つ補強材等の使用を必要とせず、簡略・
小型な調整手段が可能となシ、モジー−ルの小型化が計
れる。Furthermore, if the holding member of this embodiment is used, one member can be held using only a ferromagnetic material, so there is no need to use a reinforcing material to overcome the condensation force as in the conventional adjustment means, and it is simple and easy to use.
Since a small adjustment means is possible, the module can be made smaller.
第2図は本発明の042の実施例の端末部材103近傍
の部分拡大断面図である。FIG. 2 is a partially enlarged sectional view of the vicinity of the terminal member 103 of the 042 embodiment of the present invention.
第2図に示す実施例は格納部材201をオーステナイト
系ステンレス鋼5O8304等の非磁性体とし、肉厚の
薄いものとしている。他の構成部品は第1図に示す実施
例と同じである。In the embodiment shown in FIG. 2, the storage member 201 is made of a non-magnetic material such as austenitic stainless steel 5O8304 and has a small wall thickness. The other components are the same as the embodiment shown in FIG.
第2図に示す実施例において、格納部材201に端末部
材103を配置する際、鉄めるいは永久磁石等の治具用
強磁性体202を端末部材103の背面に位置させ、端
末部材103の底面に接着した永久磁石Illとの間で
吸引固定させる。この位置出し保持状態で元ビームを照
射して溶接を行う。第1の保持部材108.第2の保持
部材109も同様に、治具用強磁性体を用いて浴接を行
う。In the embodiment shown in FIG. 2, when placing the terminal member 103 in the storage member 201, the jig ferromagnetic material 202, such as iron or permanent magnet, is positioned on the back side of the terminal member 103. It is fixed by suction between the permanent magnet Ill adhered to the bottom surface. In this positioning and holding state, the original beam is irradiated to perform welding. First holding member 108. Similarly, the second holding member 109 is also bath-welded using a ferromagnetic material for a jig.
上述の説明から明らかなように、第2図に示す実施例に
よれば、格納部材201が非磁性体の場合でも、格納部
材201の肉厚を薄くシ1位置合わせ時に補助の治具用
強磁性体を使用することにより強力な吸引力が保たれ、
第1図に示す実施例におけると同様な効果が得られる。As is clear from the above description, according to the embodiment shown in FIG. Strong attraction is maintained by using magnetic material,
The same effect as in the embodiment shown in FIG. 1 can be obtained.
以上説明したように本発明は1位置設定・保持用の強磁
性体を使用することにより、光学部品の配置が正確にで
き、小型な光半導体モジー−ルが得られる効果がある。As explained above, the present invention has the advantage that by using a ferromagnetic material for setting and holding one position, it is possible to accurately arrange optical components and to obtain a compact optical semiconductor module.
第1図は本発明による5PJ1の実施例のl!r曲図、
第2図は本発明の第2の実施例の端末部材103近傍の
部材拡大断面図である。
101・・・・・・光ファイバ、102・・・・・・貫
通孔。
103・・・・・・端末部材、104・・・・・・エポ
キシ系接着剤、105・・・・・・格納部材、106・
・・・・・発受光素子。
107・・・・・・レンズ、108・・・・・・第1の
保持部材。
109・・・・・・第2の保持部材、110・・・・・
・溶融接合部、111・・・・・・水久硯石、1工2・
・・・・・永久磁石。
113・・・・・・端末部材端面、114・・・・−・
保持部材端面、201・・・・−・非磁性体の格納部材
、202・・・・・・治具用強磁性体。
代理人 弁理士 内 原 晋
/θl : イC174八° /ρ〆
: 〕イヂIσフイ勺(1イ1矛4519髪to2 :
$J!3L /l)Y:
−p2ts#J!t−f;;¥;’fKπ3:
端本もV杯 lIθ: 改菊d龜惨部L4: エ
ボAシト濾Aな) ///: 索Xρ1后/ρS
: 格坊各ト材 //2: 永久磁石106
: 売ぐH身 /13: 端十部冴甫囮lθ7
: レンr //4: 庫甲渚臼膿希面茅
f 凹FIG. 1 shows an embodiment of 5PJ1 according to the present invention. r song diagram,
FIG. 2 is an enlarged cross-sectional view of the vicinity of the terminal member 103 of the second embodiment of the present invention. 101...Optical fiber, 102...Through hole. 103... Terminal member, 104... Epoxy adhesive, 105... Storage member, 106.
... Light emitting/receiving element. 107... Lens, 108... First holding member. 109... Second holding member, 110...
・Fused joint, 111...Mizuku inkstone, 1st work 2・
·····permanent magnet. 113...Terminal member end face, 114...---
Holding member end face, 201...-Nonmagnetic material storage member, 202... Ferromagnetic material for jig. Agent Patent Attorney Susumu Uchihara / θl: 1C1748° / ρ〆: ]
$J! 3L/l)Y:
-p2ts#J! t-f;;\;'fKπ3:
The original version is also V-cup lIθ: Kaikikud Kuzanbu L4: Evo A Shitoro Ana) ///: So Xρ1 rear/ρS
: Each piece of material //2: Permanent magnet 106
: Selling H body /13: End Jube Saeho decoy lθ7
: Ren r // 4: Koko Nagisa Usuki Menka f Concave
Claims (1)
部材と、発受光素子と、この発受光素子を支持する第1
の保持部材と、前記発受光素子を前記光ファイバに光結
合するレンズと、このレンズを固定する第2の保持部材
と、格納部材とを有し、高出力レーザの光ビームで前記
端末部材、前記第1の保持部材及び前記第2の保持部材
を前記格納部材に溶融固定する光半導体モジュールにお
いて、前記端末部材、前記第1の保持部材及び、前記第
2の保持部材のそれぞれの底面に強磁性体を固着したこ
とを特徴とする光半導体モジュール。An optical fiber, a terminal member that fixes the end of the optical fiber, a light emitting/receiving element, and a first light emitting/receiving element that supports the light emitting/receiving element.
a holding member, a lens for optically coupling the light emitting/receiving element to the optical fiber, a second holding member for fixing this lens, and a storage member, and the terminal member, In the optical semiconductor module in which the first holding member and the second holding member are melted and fixed to the storage member, a strong member is provided on the bottom surface of each of the terminal member, the first holding member, and the second holding member. An optical semiconductor module characterized by having a magnetic material fixed thereto.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63024452A JPH01200208A (en) | 1988-02-03 | 1988-02-03 | Optical semiconductor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63024452A JPH01200208A (en) | 1988-02-03 | 1988-02-03 | Optical semiconductor module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01200208A true JPH01200208A (en) | 1989-08-11 |
Family
ID=12138550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63024452A Pending JPH01200208A (en) | 1988-02-03 | 1988-02-03 | Optical semiconductor module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01200208A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6086052A (en) * | 1983-09-23 | 1985-05-15 | シーメンス、アクチエンゲゼルシヤフト | Device for making constricted portion on optical fiber and manufacture |
JPS6170516A (en) * | 1984-09-14 | 1986-04-11 | Hitachi Ltd | Semiconductor laser module with optical isolator |
JPS61138219A (en) * | 1984-12-10 | 1986-06-25 | Matsushita Electric Ind Co Ltd | Semiconductor laser device |
JPS61241715A (en) * | 1985-04-19 | 1986-10-28 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor laser-optical fiber coupling device with optical isolator |
JPH0157706B2 (en) * | 1980-04-04 | 1989-12-07 | Pola Kasei Kogyo Kk |
-
1988
- 1988-02-03 JP JP63024452A patent/JPH01200208A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0157706B2 (en) * | 1980-04-04 | 1989-12-07 | Pola Kasei Kogyo Kk | |
JPS6086052A (en) * | 1983-09-23 | 1985-05-15 | シーメンス、アクチエンゲゼルシヤフト | Device for making constricted portion on optical fiber and manufacture |
JPS6170516A (en) * | 1984-09-14 | 1986-04-11 | Hitachi Ltd | Semiconductor laser module with optical isolator |
JPS61138219A (en) * | 1984-12-10 | 1986-06-25 | Matsushita Electric Ind Co Ltd | Semiconductor laser device |
JPS61241715A (en) * | 1985-04-19 | 1986-10-28 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor laser-optical fiber coupling device with optical isolator |
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