JPH01195611A - Flat cable - Google Patents
Flat cableInfo
- Publication number
- JPH01195611A JPH01195611A JP2026688A JP2026688A JPH01195611A JP H01195611 A JPH01195611 A JP H01195611A JP 2026688 A JP2026688 A JP 2026688A JP 2026688 A JP2026688 A JP 2026688A JP H01195611 A JPH01195611 A JP H01195611A
- Authority
- JP
- Japan
- Prior art keywords
- shield layer
- conductive paint
- insulated core
- flat cable
- plastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003973 paint Substances 0.000 claims abstract description 42
- 239000002985 plastic film Substances 0.000 claims abstract description 21
- 229920006255 plastic film Polymers 0.000 claims abstract description 21
- 239000011247 coating layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 14
- 239000004020 conductor Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 31
- 239000011347 resin Substances 0.000 description 31
- 239000000203 mixture Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 6
- 239000013522 chelant Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 150000004671 saturated fatty acids Chemical class 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 6
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229940096992 potassium oleate Drugs 0.000 description 5
- MLICVSDCCDDWMD-KVVVOXFISA-M potassium;(z)-octadec-9-enoate Chemical compound [K+].CCCCCCCC\C=C/CCCCCCCC([O-])=O MLICVSDCCDDWMD-KVVVOXFISA-M 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 235000013922 glutamic acid Nutrition 0.000 description 3
- 239000004220 glutamic acid Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000011134 resol-type phenolic resin Substances 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005405 multipole Effects 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ＯＡ機器、ＦＡ機器に用いられる半田付は可
能なシールド付きフラットケーブルであって、導体とシ
ールド層の端末処理が容易なフラットケーブルに関する
。Detailed Description of the Invention (Field of Industrial Application) The present invention is a shielded flat cable that can be soldered and is used in OA equipment and FA equipment, and is a flat cable that allows easy terminal processing of conductors and shield layers. Regarding cables.
（従来技術）
ＯＡ機器、ＦＡ機器に用いられるフラットケーブルは、
その端部に一括接続の多極プラグが装着される。この多
極プラグは櫛型の電極に絶縁被覆を剥離することなく、
そのまま押込んで圧着させるもので、フラットケーブル
の接続では所謂この圧着型プラグが主流となっている。(Prior art) Flat cables used for OA equipment and FA equipment are
A multi-pole plug for collective connection is attached to the end. This multi-pole plug has comb-shaped electrodes without peeling off the insulation coating.
This so-called crimp-type plug is the mainstream for connecting flat cables, as it is simply pushed in and crimped.
しかし、接地線を有するシールド付きフラットケーブル
では、各絶縁心線に添わした接地線とをシールド材で筒
形に縦添え成型して幅寄せすると、絶縁心線間隔は等間
隔になるが、接地線間隔は等間隔にならないため、プラ
グ（又はコネクター）に接続する場合、接地線間隔の不
揃いが問題となる。However, in a shielded flat cable with a ground wire, if the ground wire attached to each insulated core wire is molded vertically into a cylindrical shape with shielding material and aligned, the distance between the insulated core wires becomes equal, but the ground wire Since the wire spacing is not equal, uneven ground wire spacing poses a problem when connecting to a plug (or connector).
一方、フラットケーブルが電磁波による干渉゛を受ける
と、機器機能が狂い、誤動作を招く結果になる。このよ
うなことからフラットケーブルにシールド層を設けて電
磁波障害を防止するようにされているが、シールド付き
フラットケーブルの端末に、前記圧着型プラグを装着さ
せるには、予め外被とシールド層を除去しておかないと
装着することができない。このため、プラスチックテー
プ上に銅箔又はアルミ箔を所定間隔毎に間隔をあけて貼
り付けたプラスチックテープを絶縁心線に縦添え成形す
るフラットケーブルの製造方法が特公昭６２−４７３２
８号に提案されている。On the other hand, if a flat cable receives interference from electromagnetic waves, equipment functions will be disrupted, resulting in malfunction. For this reason, a shield layer is provided on the flat cable to prevent electromagnetic interference, but in order to attach the crimp type plug to the terminal of the shielded flat cable, the jacket and shield layer must be removed in advance. It cannot be installed unless it is removed. For this reason, a method for manufacturing a flat cable was developed in Japanese Patent Publication No. 62-4732, in which plastic tape is pasted with copper foil or aluminum foil at predetermined intervals on the plastic tape, and then formed by longitudinally attaching it to the insulated core wire.
It is proposed in No. 8.
°゛１１１、
しかし、このフラットケーブルの製造には、金属箔とし
て銅箔又はアルミ箔を所定間隔毎に間隔をあけて貼り付
けする工程が必要であり、貼り付けを精度よく、しかも
経済的に連続作業ラットケーブルのシールド層端末の全
周に半田付けして圧着型プラグの装着を容易にし、且つ
生産性の良好なシールド付きフラットケーブルを提供す
ることを目的とするものである。°゛111 However, manufacturing this flat cable requires a process of pasting copper foil or aluminum foil as metal foil at predetermined intervals, which allows for accurate and economical pasting. It is an object of the present invention to provide a shielded flat cable which is soldered around the entire circumference of the terminal of the shield layer of a continuous working rat cable to facilitate attachment of a crimp type plug and which has good productivity.
（問題点を解決するための手段）
本発明は、上記の目的を達成するためになされたもので
、その構成は複数の絶縁心線を並列にし、並列にした絶
縁心線の長さ方向に対して、一定長毎に半田付は可能な
導電塗料を塗布してない部分を設け塗布した半田付は可
能な導電塗料によるシールド層を有するプラスチックフ
ィルムを添わせ、前記プラスチックフィルムを絶縁心線
数に応じて切断した前記プラスチックフィルムを各絶縁
心線上に筒状に縦添え成形し、その外周に外被を施して
フラットケーブルとするものである。(Means for Solving the Problems) The present invention has been made to achieve the above object, and has a structure in which a plurality of insulated core wires are arranged in parallel, and the parallel insulated core wires are arranged in parallel. On the other hand, a plastic film with a shielding layer made of conductive paint that can be soldered is provided at every fixed length, and the plastic film has a number of insulated cores. The above-mentioned plastic film cut according to the above is formed by vertically attaching it onto each insulated core wire in a cylindrical shape, and an outer sheath is applied to the outer periphery to form a flat cable.
本発明の構成において使用する半田付可能な導電塗料と
しては、本発明者らが先に出願した半田付可能な導電塗
料（昭和６１年特願第７５３０２号、昭和６１年特願第
７５３０３号、昭和６１年特願第９５８０９号、昭和６
１年特願第１１３１９７号、昭和６１年特願第１１３１
９８号、昭和６１年特願第２２８７０４号）の如きもの
を挙げることができる。The solderable conductive paint used in the configuration of the present invention includes solderable conductive paints previously filed by the present inventors (Japanese Patent Application No. 75302 of 1985, Japanese Patent Application No. 75303 of 1988, Patent Application No. 95809 of 1988, Showa 6
1986 patent application No. 113197, 1986 patent application No. 1131
No. 98, Japanese Patent Application No. 228704 of 1988).
〔その１：昭和６１年特願第７５３０２号〕（ｉ）金属
銅粉、（ｉｉ ）樹脂混和物（ｐ−ｔｅｒｔ−ブチルフ
ェノール樹脂と金属表面活性化樹脂および熱硬化性樹脂
とからなる樹脂混和物）、（ｉｉｉ ）飽和脂肪酸又は
不飽和脂肪酸の金属塩および（ｉｖ）金属キレート形成
剤とから成る半田付可能な導電塗料。[Part 1: Patent Application No. 75302 of 1985] (i) Metallic copper powder, (ii) Resin mixture (resin mixture consisting of p-tert-butylphenol resin, metal surface activated resin, and thermosetting resin) ), (iii) a metal salt of a saturated or unsaturated fatty acid, and (iv) a metal chelate forming agent.
〔その２：昭和６１年特願第７５３０３号〕（ｉ）金属
銅粉、（ｉｉ ）熱硬化性樹脂、（ｉｉｉ）飽和脂肪酸
又は不飽和脂肪酸の金属塩、（ｉｖ ）金属キレート形
成剤、（Ｖ）半田付促進剤とから成る半田付可能な導電
塗料。[Part 2: Patent Application No. 75303 of 1985] (i) Metallic copper powder, (ii) Thermosetting resin, (iii) Metal salt of saturated fatty acid or unsaturated fatty acid, (iv) Metal chelate forming agent, ( V) a solderable conductive paint comprising a soldering accelerator.
〔その３：昭和６１年特願第９５８０９号〕（ｉ）金属
銅粉、（ｉｉ）樹脂混和物（金属表面活性化樹脂と熱硬
化性樹脂とからなる樹脂混和物）、（ｉｉｉ）飽和脂肪
酸又は不飽和脂肪酸若しくはそれらの金属塩、（ｉｖ
）金属キレート形成剤および（ｖ）半田付促進剤とから
成る半田付可能な導電塗料。[Part 3: Patent Application No. 95809 of 1985] (i) Metallic copper powder, (ii) Resin mixture (resin mixture consisting of metal surface activated resin and thermosetting resin), (iii) Saturated fatty acid or unsaturated fatty acids or their metal salts, (iv
A solderable conductive paint comprising:) a metal chelate former and (v) a soldering promoter.
〔その４：昭和６１年特願第１１３１９７号〕（ｉ）金
属銅粉、（ｉｉ ）樹脂混和物（金属表面活性化樹脂と
熱硬化性樹脂とからなる樹脂混和物）、（ｉｉｉ ）飽
和脂肪酸又は不飽和脂肪酸若しくはそれらの金属塩、お
よび（ｉｖ）金属キレート形成剤とから成る半田付可能
な導電塗料。[Part 4: Patent Application No. 113197 of 1985] (i) Metallic copper powder, (ii) Resin mixture (resin mixture consisting of metal surface activated resin and thermosetting resin), (iii) Saturated fatty acid or an unsaturated fatty acid or a metal salt thereof, and (iv) a metal chelate forming agent.
〔その５：昭和６１年特願第１１３１９８号〕（ｉ）金
属銅粉、（ｉｉ）樹脂混和物（金属表面活性化樹脂と粒
状フェノール樹脂および熱硬化性樹脂とからなる樹脂混
和物）、（ｉｉｉ）飽和脂肪酸又は不飽和脂肪酸若しく
はそれらの金属塩、（ｉｖ）金属キレート形成剤および
（ｖ）半田付促進剤とから成る半田付可能な導電塗料。[Part 5: Patent Application No. 113198 of 1985] (i) Metallic copper powder, (ii) Resin mixture (resin mixture consisting of metal surface activated resin, granular phenolic resin, and thermosetting resin), ( A solderable conductive paint comprising iii) a saturated or unsaturated fatty acid or a metal salt thereof, (iv) a metal chelate forming agent, and (v) a soldering promoter.
〔その６：昭和６１年特願第２２８７０４号〕（ｉ）金
属銅粉、（ｉｉ ）樹脂混和物（アクリル樹脂とアミノ
樹脂とからなる樹脂混和物）、（ｉｉｉ）飽和脂肪酸又
は不飽和脂肪酸若しくはそれらの金属塩、および（ｉｖ
）金属キレート形成剤とから成る半田付可能な導電塗料
。[Part 6: Patent Application No. 228704 of 1985] (i) Metallic copper powder, (ii) Resin mixture (resin mixture consisting of acrylic resin and amino resin), (iii) Saturated fatty acid or unsaturated fatty acid or metal salts thereof, and (iv
) A solderable conductive paint consisting of a metal chelate forming agent.
〔その７〕 上記以外の金属粉を含む半田付可能な導電塗料。[Part 7] Solderable conductive paint containing metal powder other than those listed above.
又、本発明の構成において使用するプラスチックフィル
ムとしては、ポリエチレン、ポリエステル、ポリイミド
、ポリアミドなどのフィルムを使用することができ、特
に導電塗料の硬化工程での加熱温度とその加熱時間に耐
えるものが望ましく、上記硬化条件に耐えるものであれ
ば他のプラスチックフィルムであってもよく、特に限定
されるものでない。Furthermore, as the plastic film used in the structure of the present invention, films such as polyethylene, polyester, polyimide, polyamide, etc. can be used, and it is particularly desirable that the film can withstand the heating temperature and heating time in the curing process of the conductive paint. However, other plastic films may be used as long as they can withstand the above-mentioned curing conditions, and are not particularly limited.
（作 用）
第５図に示す如く、接地線を有するシールド付きフラッ
トケーブルでは、各絶縁心線に添わした接地線とをシー
ルド材で筒形に縦添え成型して幅寄せすると、絶縁心線
間隔は等間隔になるが、接地線間隔は等間隔とならない
場合が多いため圧着型プラグ（又はコネクター）に接続
する場合、接地線間隔の不揃いが問題となるが、上記の
如く構成する本発明では、プラスチックフィルム上に半
田付は可能な導電塗料を用いて印刷法によって一定長毎
に塗布してない部分を設けながら、塗布した半田付可能
な導電塗料を硬化させたシールド層を有するプラスチッ
クフィルムを精度よ（連続生産できるものを使用するの
で、経済性があり、前記シールド層を有するプラスチッ
クフィルムを使用して製作されたフラットケーブルは、
半田付は可能な導電塗料が塗布してない部分でフラット
ケーブルを切断すればシールド層がなく、コネクター接
続に必要な外被を剥離してシールド層を露出させて、そ
のまま又は、シールド層端部にフラックスをつけ、半田
浴槽中に浸漬し、引上げてフラットケーブルのシールド
層端部の全周に半田付け（第４図参照）すれば、シール
ド付き各絶縁心線は共通の半田導体で被覆されるので、
絶縁被覆を剥離することなく、圧着型コネクターで容易
に、しかも簡単に導体とシールド層の接地接続ができる
ものとなる。(Function) As shown in Figure 5, in a shielded flat cable with a ground wire, if the ground wire attached to each insulated core wire is formed vertically into a cylindrical shape with shielding material and aligned, the insulated core wires Although the spacing is equal, the ground wire spacing is often not equal, so when connecting to a crimp type plug (or connector), uneven ground wire spacing poses a problem. However, the present invention configured as described above Here, we created a plastic film with a shielding layer made by using a solderable conductive paint on a plastic film, creating uncoated parts at fixed lengths using a printing method, and then curing the solderable conductive paint. The flat cable manufactured using the plastic film with the shielding layer is
Soldering is possible.If you cut the flat cable at the part where conductive paint is not applied, there is no shield layer.You can peel off the outer sheath required for connector connection to expose the shield layer and solder it as it is or at the end of the shield layer. Apply flux to the flat cable, dip it into a solder bath, pull it up, and solder the entire circumference of the end of the shield layer of the flat cable (see Figure 4), so that each shielded insulated core wire is covered with a common solder conductor. Because
It becomes possible to easily and easily connect the conductor and the shield layer to ground using a crimp-type connector without peeling off the insulation coating.
（実施例） 次に、本発明の実施例を図面と共に説明する。(Example) Next, embodiments of the present invention will be described with reference to the drawings.
本発明は、導体（１）上に絶縁被覆（２）を施した絶縁
心＆’！（３）を複数本並列にし、その外周に一定長毎
に半田付は可能な導電塗料（４）を塗布してない部分（
５）を設けながら塗布した半田付は可能な導電塗料（４
）を硬化させたシールド付きプラスチックフィルム（６
）を切断して縦添えし筒状に成形し、該並列にしたシー
ルド付き絶縁心ｆｌｉ （７）を幅寄せして、その上に
外被（８）を施してフラットケーブルとするものである
。The present invention provides an insulated core with an insulating coating (2) on a conductor (1). (3) are arranged in parallel, and the parts (4) that are not coated with conductive paint (4), which can be soldered at regular lengths on the outer periphery (
Conductive paint (4) that can be used for soldering while applying 5)
) cured plastic film with shield (6
) is cut and formed into a cylindrical shape by vertically lining them, the parallel shielded insulated cores fli (7) are brought together widthwise, and a jacket (8) is applied thereon to form a flat cable. .
次に、導電塗料を用いて印刷法によって一定長毎に半田
付は可能な導電塗料を塗布してない部分を設け塗布した
半田付は可能な導電塗料によるシールド層を有するプラ
スチックフィルム（６）の作製とフラットケーブルの製
造について以下に詳記する。Next, a plastic film (6) having a shielding layer of conductive paint, which can be soldered, is prepared by printing a conductive paint to provide a part of the plastic film (6) that is not coated with a conductive paint that can be soldered. The fabrication and manufacturing of the flat cable will be detailed below.
先づ、ｐ−ｔｅｒｔ−ブチルフェノール樹脂とマレイン
化ロジンとレゾール型フェノールとを１０：１０：８０
重量％の割合に配合して３軸ロールで混練りして樹脂混
和物を調整する。次いで、粒径５〜１０μｍの樹枝状金
属銅粉９５重量部、樹脂混和物５重量部、オレイン酸カ
リウム４重量部、トリエタノールアミン２０重量部を配
合し、溶剤として若干のブチルセルソルブアセテートを
加えて、２０分間３軸ロールで混練して適当な粘度にし
た半田付可能な導電塗料（４）〔そのｌ〕を調整する。First, p-tert-butylphenol resin, maleated rosin, and resol type phenol were mixed in a ratio of 10:10:80.
A resin mixture is prepared by blending the resin mixture in a proportion of % by weight and kneading it with a 3-axis roll. Next, 95 parts by weight of dendritic metal copper powder with a particle size of 5 to 10 μm, 5 parts by weight of a resin mixture, 4 parts by weight of potassium oleate, and 20 parts by weight of triethanolamine were blended, and some butyl cellosolve acetate was added as a solvent. In addition, solderable conductive paint (4) [Part 1] is prepared by kneading it with a triaxial roll for 20 minutes to give it an appropriate viscosity.
かくして調整した前記導電塗料（４）を練りロール（９
）に供給し、均質化された半田付可能な導電塗料（４）
は中間ロール群（１０）によって塗料厚さが最終３０μ
ｍになるように均等に延され、次いで外周面に一部切込
みを設け表面にエツチングが施された印刷ロール（１１
）に、該導電塗料（４）を転移させる。転移した半田付
可能な導電塗料（４）は、印刷ロール（１１）の周速に
同調し、且つバックアップロール（１２）によって押し
当てながら走行するポリエステルフィルム（６゛）表面
に転写される。半田付可能な導電塗料（４）が転写され
たポリエステルフィルム（６）は、次いで１３０〜１８
０℃、１０〜６０分間の硬化条件で加熱ゾーンを通過さ
せてシールド付きポリエステルフィルム（６）とする。The conductive paint (4) prepared in this way is rolled on a kneading roll (9).
) and homogenized solderable conductive paint (4)
The final paint thickness is 30μ by the intermediate roll group (10).
A printing roll (11
), the conductive paint (4) is transferred to the surface. The transferred solderable conductive paint (4) is transferred onto the surface of a polyester film (6') which is running in synchronization with the circumferential speed of the printing roll (11) and being pressed against it by a backup roll (12). The polyester film (6) to which the solderable conductive paint (4) has been transferred is then 130-18
The film is passed through a heating zone under curing conditions of 0° C. for 10 to 60 minutes to obtain a shielded polyester film (6).
上記により得たシールド付きポリエステルフィルム（６
）を並列走行する複数の絶縁心線（３）に同調して繰り
出し、スリッターにより各絶縁心線上に筒状に縦添え成
形できる幅に裁断し、各絶縁心線上に成形ダイスにより
縦添え成形させる。このように成形されたシールド付き
絶縁心線（７）の相互間隔は幅寄せされ、その上に外被
（８）を施してフラットケーブルとする。The shielded polyester film obtained above (6
) is fed out in synchronization with multiple insulated core wires (3) running in parallel, cut to a width that can be vertically spliced onto each insulated core wire using a slitter, and vertically spliced onto each insulated core wire using a forming die. . The mutual spacing between the thus formed shielded insulated core wires (7) is made closer, and a jacket (8) is applied thereon to form a flat cable.
か（して得たフラットケーブルの各シールド層全周に半
田付けをする場合は、第４図に示すように半田付は可能
な導電塗料が塗布してない部分（５）の中央部で切断し
、コネクター接続に必要な外被（８）を剥離してシール
ド層を露出させ、そのまま又は、シールド層端部にフラ
フクスをつけ、半田浴槽中に浸漬し、引上げて半田付は
可能なシールド層端部の全周に半田付け（１３）する。(When soldering the entire circumference of each shield layer of the flat cable obtained by doing this, cut at the center of the part (5) where conductive paint is not applied, where soldering is possible, as shown in Figure 4. The shield layer can be soldered by peeling off the outer sheath (8) necessary for connector connection and exposing the shield layer, or by applying fluff to the end of the shield layer, immersing it in a solder bath, and pulling it up. Solder the entire circumference of the end (13).
かかる場合、シールド付き絶縁心線（７）は共通の半田
導体（１３）で被覆されるので、絶縁被覆を剥離するこ
となく、圧着型コネクターで容易に、簡単に導体とシー
ルド層全部の接地接続ができる（図示せず）。In such a case, since the shielded insulated core wire (7) is covered with a common solder conductor (13), the conductor and all the shield layers can be easily grounded using a crimp type connector without peeling off the insulation coating. (not shown).
次に、本発明で使用する他の半田付は可能な導電塗料の
調整を参考まで以下に記述する。Next, other soldering methods used in the present invention will be described below for reference regarding the adjustment of the conductive paint.
〔その２：導電塗料〕
粒径５〜１０μｍの樹脂状金属銅粉９３重量部、レゾー
ル型フェノール樹脂７重量部、オレイン酸カリウム４重
量部、トリエタノールアミン２０重量部、グルタミン酸
１重世部を配合し、溶剤として若干のブチルセルソルブ
アセテートを加えて、２０分間３軸ロールで混練して適
当な粘度に調整する。[Part 2: Conductive paint] 93 parts by weight of resinous metallic copper powder with a particle size of 5 to 10 μm, 7 parts by weight of resol type phenolic resin, 4 parts by weight of potassium oleate, 20 parts by weight of triethanolamine, and 1 part by weight of glutamic acid. Blend the mixture, add some butyl cellosolve acetate as a solvent, and knead with a 3-shaft roll for 20 minutes to adjust the viscosity to an appropriate level.
〔その３：導電塗料〕
粒径５〜１０μｍの樹枝状金属銅粉９３重量部、樹脂混
和物（マレイン化ロジン１０重量％とレゾール型フェノ
ール樹脂９０重量％とからなる樹脂混和物）７重量部、
オレイン酸カリウム４重量部、トリエタノールアミン２
０重量部、グルタミン酸０６５重量部を配合し、溶剤と
して若干のブチルセルソルブアセテートを加えて、２０
分間３軸ロールで混練して適当な粘度に調整する。[Part 3: Conductive paint] 93 parts by weight of dendritic metal copper powder with a particle size of 5 to 10 μm, 7 parts by weight of resin mixture (resin mixture consisting of 10% by weight of maleated rosin and 90% by weight of resol type phenolic resin) ,
4 parts by weight of potassium oleate, 2 parts of triethanolamine
0 parts by weight and 065 parts by weight of glutamic acid were added, and some butyl cellosolve acetate was added as a solvent.
Knead with a 3-axis roll for a minute to adjust the viscosity to an appropriate level.
〔その４：導電塗料〕
粒径５〜１０μｍの樹枝状金属銅粉９５重量部、樹脂混
和物（マレイン化ロジン１０重世％とレゾール型フェノ
ール樹脂９０重量％とからなる樹脂混和物）５重量部、
オレイン酸カリウム４重量部、トリエタノールアミン２
０重量部を配合し、溶剤として若干のブチルセルソルブ
アセテートを加えて、２０分間３軸ロールで混練して適
当な粘度に調整する。[Part 4: Conductive paint] 95 parts by weight of dendritic metal copper powder with a particle size of 5 to 10 μm, 5 parts by weight of resin mixture (resin mixture consisting of 10% by weight of maleated rosin and 90% by weight of resol type phenolic resin) Department,
4 parts by weight of potassium oleate, 2 parts of triethanolamine
A small amount of butyl cellosolve acetate is added as a solvent, and the mixture is kneaded with a triaxial roll for 20 minutes to adjust the viscosity to an appropriate level.
〔その５：導電塗料〕
粒径５〜１０μｍの樹枝状金属銅粉９３重量部、樹脂混
和物（マレイン化ロジン二粒状フェノール樹脂ニレゾー
ル型フェノール樹脂＝１０：３０：６０重量％）７重量
部、オレイン酸カリウム４重量部、トリエタノールアミ
ン２０重量部、グルタミン酸０．５重量部を配合し、溶
剤として若干のブチルセルソルブアセテートを加えて、
２０分間３軸ロールで混練して適当な粘度に調整する。[Part 5: Conductive paint] 93 parts by weight of dendritic metal copper powder with a particle size of 5 to 10 μm, 7 parts by weight of resin mixture (maleated rosin, 2 grains of phenolic resin, nyresol type phenolic resin = 10:30:60% by weight), 4 parts by weight of potassium oleate, 20 parts by weight of triethanolamine, and 0.5 parts by weight of glutamic acid were added, and some butyl cellosolve acetate was added as a solvent.
Knead with a 3-axis roll for 20 minutes to adjust the viscosity to an appropriate level.
〔その６：導電塗料〕
粒径５〜１０μｍの樹枝状金属銅粉１００重量部、樹脂
混和物（アクリル樹脂７０〜３０重量％、残部アミノ樹
脂とからなる樹脂混和物）１２重量部、オレイン酸カリ
ウム２重量部、オレイン酸ｗ４２重量部、トリエタノー
ルアミン２．５重量部を配合し、溶剤として若干のブチ
ルセルソルブアセテートを加えて、２０分間３軸ロール
で混練して適当な粘度に調整する。[Part 6: Conductive paint] 100 parts by weight of dendritic metal copper powder with a particle size of 5 to 10 μm, 12 parts by weight of a resin mixture (a resin mixture consisting of 70 to 30% by weight of acrylic resin and the balance of amino resin), oleic acid Blend 2 parts by weight of potassium, 42 parts by weight of oleic acid, and 2.5 parts by weight of triethanolamine, add some butyl cellosolve acetate as a solvent, and mix with a 3-shaft roll for 20 minutes to adjust the viscosity to an appropriate level. .
（効 果）
以上説明した如く本発明のフラットケーブルにあっては
、次の如き効果を奏する。(Effects) As explained above, the flat cable of the present invention has the following effects.
（１）半田付は可能な導電塗料によるシールド層を有す
るプラスチックフィルムを使用して、並列にされた複数
の絶縁心線上に筒状に縦添え成形してシールド層を形成
し、しかも所要の長さ毎にシールド層のない部分が設け
られるので、その部分の中央で切断し、接地を必要とし
ない場合は外被およびシールド層を剥離することなく、
外被上から圧着型コネクターを圧着して容易に装着する
ことができる。(1) For soldering, a plastic film with a shielding layer made of conductive paint is used, and the shielding layer is formed by longitudinally forming a cylindrical shape onto multiple insulated core wires arranged in parallel, and the length is as long as required. Since there is a part without a shield layer for each section, cut it in the center of that part, and if grounding is not required, you can cut it without peeling off the outer jacket and shield layer.
The crimp-type connector can be easily attached by crimping it onto the outer cover.
シールド層の接地を必要とする場合は、コネクター接続
に必要な外被を剥離して、シールド層全周に半田付けを
して導体とシールド層全部の接地接続を圧着型コネクタ
ーで行える。If the shield layer needs to be grounded, the outer sheath required for connector connection can be peeled off, soldered around the entire circumference of the shield layer, and the conductor and the entire shield layer can be grounded using a crimp type connector.
（２）所望の切断長に合わせて印刷ロールに切込み部（
印刷ロールの外径を変える）を設け、これによりプラス
チックフィルム上に半田付は可能な導電塗料を転写させ
、精度よく連続生産できるシールド付きプラスチックフ
ィルムを使用するので、フラットケーブルを経済的に製
造することができる。(2) Cut the printing roll according to the desired cutting length (
By changing the outside diameter of the printing roll), a conductive paint that can be soldered is transferred onto the plastic film, and a shielded plastic film that can be produced continuously with high precision is used, making it possible to economically manufacture flat cables. be able to.
（３）使用する半田付は可能な導電塗料によるシールド
層は、導電性、密着性、耐湿性、可撓性、耐クランク性
にすぐれているので、良好な遮蔽特性を有するフラット
ケーブルができる。(3) The shield layer made of conductive paint that can be soldered has excellent conductivity, adhesion, moisture resistance, flexibility, and crank resistance, so a flat cable with good shielding properties can be obtained.
第１図は本発明に係るフラットケーブルの斜視図、第２
図は本発明に係るフラットケーブルに使用される半田付
は可能な導電塗料によるシールド付きプラスチックフィ
ルムの製造説明図、第３図は本発明に係るフラットケー
ブルの製造説明図、第４図は本発明に係るフランｔ・ケ
ーブルのシールド層の半田付は説明図で、（Ａ）は断面
半田付説明図、（Ｂ）は半田付けの斜視説明図、第５図
は接地線を有するシールド付きフラットケーブルの断面
図である。図中の主な符号は次の通りである。
（１）・・・・・・導体、（２）・・・・・・絶縁被覆
、（３）・・・・・・絶縁心線、（４）・・・・・・半
田付は可能な導電塗料、（５）・・・・・・塗料が塗布
してない部分、（６）・・・・・・シールド付きプラス
チックフィルム、（７）・・・・・・シールド付き絶縁
心線、（８）・・・・・・外被。
特許出願人 タック電線株式会社
代理人 弁理士 水 口 孝 −′技尾窯Fig. 1 is a perspective view of a flat cable according to the present invention, Fig. 2 is a perspective view of a flat cable according to the present invention;
The figure is an explanatory diagram of manufacturing a plastic film with a shield made of conductive paint that can be soldered to be used in a flat cable according to the present invention, Figure 3 is an explanatory diagram of manufacturing a flat cable according to the present invention, and Figure 4 is an explanatory diagram of the invention. The soldering of the shield layer of the flan t cable related to this is an explanatory diagram, (A) is a cross-sectional soldering diagram, (B) is a perspective diagram of soldering, and Fig. 5 is a shielded flat cable with a ground wire. FIG. The main symbols in the figure are as follows. (1)...Conductor, (2)...Insulation coating, (3)...Insulated core wire, (4)...Soldering possible Conductive paint, (5)... Parts not coated with paint, (6)... Plastic film with shield, (7)... Insulated core wire with shield, ( 8)... Outer covering. Patent applicant Tak Electric Cable Co., Ltd. Agent Patent attorney Takashi Mizuguchi −′Gibo Kiln
Claims (2)
の長さ方向に対して、一定長毎に半田付け可能な導電塗
料を塗布してない部分を設け塗布した半田付け可能な導
電塗料によるシールド層を有するプラスチックフィルム
を添わせ、絶縁心線数に応じて切断した前記プラスチッ
クフィルムを、各絶縁心線上に筒状に縦添え成形し、そ
の外周に外被を施して成ることを特徴とするフラットケ
ーブル。(1) Multiple insulated core wires are arranged in parallel, and parts of the parallel insulated core wires that are not coated with solderable conductive paint are provided at fixed lengths in the length direction of the parallel insulated core wires. A plastic film having a shielding layer made of conductive paint is attached, and the plastic film cut according to the number of insulated core wires is vertically attached and formed into a cylindrical shape on each insulated core wire, and an outer cover is applied to the outer periphery of the plastic film. A flat cable featuring
クフィルムの半田付け可能な導電塗料の塗布層を外側に
向けてなることを特徴とするフラットケーブル。(2) The flat cable according to claim 1, characterized in that the solderable conductive paint coating layer of the plastic film is directed outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026688A JPH01195611A (en) | 1988-01-30 | 1988-01-30 | Flat cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026688A JPH01195611A (en) | 1988-01-30 | 1988-01-30 | Flat cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01195611A true JPH01195611A (en) | 1989-08-07 |
Family
ID=12022391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026688A Pending JPH01195611A (en) | 1988-01-30 | 1988-01-30 | Flat cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01195611A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086907A (en) * | 2001-06-29 | 2003-03-20 | Tatsuta Electric Wire & Cable Co Ltd | Shielded flexible printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62230869A (en) * | 1986-03-31 | 1987-10-09 | Tatsuta Electric Wire & Cable Co Ltd | Electrically conductive coating compound to be soldered |
-
1988
- 1988-01-30 JP JP2026688A patent/JPH01195611A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62230869A (en) * | 1986-03-31 | 1987-10-09 | Tatsuta Electric Wire & Cable Co Ltd | Electrically conductive coating compound to be soldered |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086907A (en) * | 2001-06-29 | 2003-03-20 | Tatsuta Electric Wire & Cable Co Ltd | Shielded flexible printed wiring board |
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