JPH0119345Y2 - - Google Patents
Info
- Publication number
- JPH0119345Y2 JPH0119345Y2 JP1981023655U JP2365581U JPH0119345Y2 JP H0119345 Y2 JPH0119345 Y2 JP H0119345Y2 JP 1981023655 U JP1981023655 U JP 1981023655U JP 2365581 U JP2365581 U JP 2365581U JP H0119345 Y2 JPH0119345 Y2 JP H0119345Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- conductive layer
- heating element
- extraction hole
- resistance heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000000605 extraction Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005340 laminated glass Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- 206010014357 Electric shock Diseases 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Landscapes
- Resistance Heating (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はセラミツクスヒーターに関するもので
ある。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a ceramic heater.
従来、リード線をある対象物に接続する構造と
して特開昭50−60513号公報のものがある。
Conventionally, there is a structure for connecting a lead wire to a certain object as disclosed in Japanese Patent Application Laid-Open No. 50-60513.
この先行技術は導電性合せガラス間に導電層を
設けると共に、その導電層に臨む通孔を一方の合
せガラスから穿設し、この通孔内においてリード
線をハンダ付けや導電性接着剤で上記導電層に固
着し、更にその通孔内にエポキシ樹脂等の接着剤
を充填したものである。 In this prior art, a conductive layer is provided between conductive laminated glasses, a through hole facing the conductive layer is bored from one of the laminated glasses, and a lead wire is connected in this through hole by soldering or using conductive adhesive. It is fixed to a conductive layer and its through holes are filled with an adhesive such as epoxy resin.
この先行技術は対象物がガラスである為、必然
的に導電層として高融点金属（タングステン、モ
リブデン、金、白金等）を用いることができず、
勿論、表面温度が数百度にもなる対象物にリード
線を接続する接続構造を供するものでもない。 Since the object of this prior art is glass, it is inevitably impossible to use high-melting point metals (tungsten, molybdenum, gold, platinum, etc.) as the conductive layer.
Of course, it does not provide a connection structure for connecting a lead wire to an object whose surface temperature reaches several hundred degrees.
即ち、斯るリード線の接続構造を、高融点金属
からなる抵抗発熱体を埋設したセラミツクスを対
象として採用した際、ハンダ、導電性接着剤、及
びエポキシ樹脂等の接続層のどれをとつても、耐
熱性を具備するものではなく、溶融して接続構造
を構成しなくなるからである。 In other words, when such a lead wire connection structure is adopted for ceramics in which a resistance heating element made of a high-melting point metal is embedded, no connection layer such as solder, conductive adhesive, or epoxy resin is used. This is because it does not have heat resistance and will melt and no longer form a connection structure.
本考案の目的は、高融点金属からなる抵抗発熱
体を埋設したセラミツクスにリード線を接続する
に際し、長期間にわたつて、安定した耐熱性及び
接合力を発揮するリード線の接続構造を有するセ
ラミツクスヒーターを供することにある。
The purpose of this invention is to create a ceramic lead wire connection structure that exhibits stable heat resistance and bonding strength over a long period of time when connecting lead wires to ceramics in which a resistance heating element made of a high-melting point metal is embedded. The purpose is to provide a heater.
本考案の技術的手段はセラミツクス内に、タン
グステン、モリブデン、金、白金等の高融点金属
からなる抵抗発熱体を埋設した本体内に、その抵
抗発熱体に至る取出穴を穿設し、この取出穴内周
面及び取出穴穴縁の上記本体上面部分に高融点金
属からなる金属ペーストを塗布して導電層を形成
し、この導電層表面全面にニツケル層を施こすと
共に、このニツケル層によつて囲まれた挿入間隙
に、銀ろうを介してリード線端部を挿入固着した
ことである。
The technical means of this invention is to drill an extraction hole leading to the resistance heating element in the main body in which a resistance heating element made of a high melting point metal such as tungsten, molybdenum, gold, platinum, etc. is embedded in ceramics, and to take out the resistance heating element. A conductive layer is formed by applying a metal paste made of a high melting point metal to the inner circumferential surface of the hole and the upper surface of the main body at the edge of the extraction hole, and a nickel layer is applied to the entire surface of this conductive layer. The end of the lead wire was inserted and fixed into the enclosed insertion gap via silver solder.
以下、本考案の実施例を図面に基づいて説明す
る。
Hereinafter, embodiments of the present invention will be described based on the drawings.
図中、Ａはヒーター本体で、セラミツク基板１
Ａ、その基板１Ａ内に内蔵する抵抗発熱体１、ヒ
ーター本体Ａに開穿した取出穴２、ならびにその
取出穴２を介して抵抗発熱体１に接続するリード
線３からなり、セラミツク基板１Ａは、アルミナ
等のセラミツク粉末に可塑剤、即ち結合剤として
有機バインダーを添加し押出成形機等により薄板
状に成形後乾燥して形成する。 In the figure, A is the heater body, and the ceramic substrate 1
A, the ceramic substrate 1A consists of a resistance heating element 1 built into the substrate 1A, an extraction hole 2 drilled in the heater body A, and a lead wire 3 connected to the resistance heating element 1 through the extraction hole 2. It is formed by adding a plasticizer, that is, an organic binder as a binder to ceramic powder such as alumina, molding it into a thin plate shape using an extruder or the like, and then drying it.
抵抗発熱体１は、高融点金属である例えばタン
グステン、モリブデン、金、白金等の金属粉末
に、エチルセルローズ、テルピネオール、酢酸ブ
チルカルビトールを主成分とする有機バインダー
及び溶剤を加えて調整したペースト状物をスクリ
ーン印刷機等によりセラミツク基板１Ａ上に配設
形成する。 The resistance heating element 1 is made of a paste prepared by adding an organic binder and a solvent mainly composed of ethyl cellulose, terpineol, and butyl carbitol acetate to metal powder such as high melting point metal such as tungsten, molybdenum, gold, and platinum. Objects are arranged and formed on the ceramic substrate 1A using a screen printer or the like.
取出穴２は、セラミツク基板１Ａの所定箇所に
開穴し、この取出穴２を開穴したセラミツク基板
１Ａと、取出穴２を開穴していないセラミツク基
板１Ａを積層圧着する。この状態において取出穴
２はセラミツク積層板Ｂの下面には開口は臨ま
ず、下位のセラミツク基板１Ａにより閉塞され、
抵抗発熱体１は両基板１Ａ間にサンドイツチ状で
配設される。 The take-out hole 2 is opened at a predetermined location of the ceramic substrate 1A, and the ceramic substrate 1A with the take-out hole 2 opened and the ceramic substrate 1A without the take-out hole 2 are laminated and pressure-bonded. In this state, the extraction hole 2 does not open to the lower surface of the ceramic laminate B, but is closed by the lower ceramic substrate 1A.
The resistance heating element 1 is arranged in a sandwich-like pattern between both substrates 1A.
斯る如くに形成したセラミツク積層板Ｂには取
出穴２内周面及びその取出穴２穴縁の本体Ａ上面
に高融点金属からなるタングステン等の金属ペー
ストを塗布後乾燥して導電層５を形成し、その導
電層５内周面に数ミクロンのニツケル層６を施
し、リード線３挿入後銀ろう７からなる封着手段
をもつてニツケル層６とリード線３との挿入間隙
８、リード線３の取出面部分即ち本体Ａ上面部分
を密封状に封着してリード線３を取付ける。これ
によりリード線３と本体Ａとの間には、リード線
３をヒーター本体Ａに接合する導電層５、ニツケ
ル層６、銀ろう７からなる電極金属４層が形成さ
れる。而して、リード線３の取付接合力はリード
線３先端外周面全面と銀ろう７との接合力及び、
その銀ろう７とニツケル層６を介して接合される
高融点金属からなる導電層５との接合力が相俟つ
て強力な接合力を発揮する。 On the ceramic laminate B thus formed, a conductive layer 5 is formed by applying a metal paste such as tungsten made of a high melting point metal to the inner peripheral surface of the extraction hole 2 and the upper surface of the main body A around the edge of the extraction hole 2 and drying it. A nickel layer 6 of several microns is applied to the inner peripheral surface of the conductive layer 5, and after the lead wire 3 is inserted, a sealing means consisting of silver solder 7 is used to close the insertion gap 8 between the nickel layer 6 and the lead wire 3, and the lead wire 3. The lead wire 3 is attached by sealing the lead-out surface portion of the wire 3, that is, the upper surface portion of the main body A. As a result, between the lead wire 3 and the main body A, four electrode metal layers consisting of a conductive layer 5, a nickel layer 6, and a silver solder 7 for joining the lead wire 3 to the heater main body A are formed. Therefore, the attachment bonding force of the lead wire 3 is determined by the bonding force between the entire outer peripheral surface of the tip of the lead wire 3 and the silver solder 7, and
The bonding force between the silver solder 7 and the conductive layer 5 made of a high melting point metal that is bonded via the nickel layer 6 together exerts a strong bonding force.
本考案は以上のようにセラミツクス内に、タン
グステン、モリブデン、金、白金等の高融点金属
からなる抵抗発熱体を埋設した本体内に、その抵
抗発熱体に至る取出穴を穿設し、この取出穴内周
面及び取出穴穴縁の上記本体上面部分に高融点金
属からなる金属ペーストを塗布して導電層を形成
し、この導電層表面全面にニツケル層を施こすと
共に、このニツケル層によつて囲まれた挿入間隙
に、銀ろうによつてリード線端部を挿入固着した
ので、下記の作用及びその効果がある。
As described above, the present invention has a main body in which a resistance heating element made of a high-melting point metal such as tungsten, molybdenum, gold, or platinum is embedded in ceramics, and an extraction hole leading to the resistance heating element is bored in the body. A conductive layer is formed by applying a metal paste made of a high melting point metal to the inner peripheral surface of the hole and the upper surface of the main body at the edge of the extraction hole, and a nickel layer is applied to the entire surface of this conductive layer. Since the end of the lead wire is inserted and fixed into the enclosed insertion gap using silver solder, the following functions and effects can be obtained.
リード線は取付穴内周面及びその取出穴穴縁
に塗布された高融点金属ペーストからなる導電
層の本体への接合力及びその導電層にニツケル
層を介して挿入間隙内に充填される銀ろうの接
合力が相乗して取出穴に固着される。 The lead wire is bonded to the main body by a conductive layer made of high melting point metal paste applied to the inner peripheral surface of the mounting hole and the edge of the extraction hole, and by silver solder filled into the insertion gap on the conductive layer via a nickel layer. The bonding force of the two is combined to fix it in the extraction hole.
故に耐熱性を具備し、所望方向へリード線を
引つ張り方向変換しても剥離する心配のない接
合強度をも有する耐久性に秀でたリード線の接
続構造を形成し得る。 Therefore, it is possible to form a highly durable lead wire connection structure that is heat resistant and has a bonding strength that does not cause peeling even when the lead wire is pulled in a desired direction and the direction of tension is changed.
リード線の取出穴をヒーター本体内の抵抗発
熱体迄至る穴としてなるので導電部が裏面より
露出せず、従つて暖房設備の如き人体が接触し
易い設備に用いても感電する危険性はない。 Since the lead wire exit hole is a hole that extends to the resistance heating element inside the heater body, the conductive part is not exposed from the back side, so there is no risk of electric shock even when used in equipment that is easily touched by the human body, such as heating equipment. .
絶縁体にて封着する必要なくコスト的にも安
価であると共にフラツトな面上にも確実に面固
定することができる。 There is no need for sealing with an insulator, and the cost is low, and the surface can be securely fixed even on a flat surface.
依つて所期の目的を達成し得る。 Thus, the intended purpose can be achieved.
第１図は本考案セラミツクヒーターのリード線
の取付構造部分の拡大断面図、第２図、第３図は
従来のリード線の取付構造部分の拡大断面図であ
る。
尚、図中、Ａ：ヒーター本体、１：抵抗発熱
体、２：取出穴、３：リード線、４：電極金属、
５：導電層、６：ニツケル層、７：銀ろう。
FIG. 1 is an enlarged sectional view of the lead wire mounting structure of the ceramic heater of the present invention, and FIGS. 2 and 3 are enlarged sectional views of the conventional lead wire mounting structure. In the figure, A: heater body, 1: resistance heating element, 2: extraction hole, 3: lead wire, 4: electrode metal,
5: conductive layer, 6: nickel layer, 7: silver solder.
Claims (1)
ン、金、白金等の高融点金属からなる抵抗発熱体
を埋設した本体内に、その抵抗発熱体に至る取出
穴を穿設し、この取出穴内周面及び取出穴穴縁の
上記本体上面部分に高融点金属からなる金属ペー
ストを塗布して導電層を形成し、この導電層表面
全面にニツケル層を施こすと共に、このニツケル
層によつて囲まれた挿入間隙に、銀ろうを介して
リード線端部を挿入固着したことを特徴とするセ
ラミツクスヒーター。 A resistance heating element made of a high melting point metal such as tungsten, molybdenum, gold, platinum, etc. is embedded in the ceramic body, and an extraction hole leading to the resistance heating element is bored, and the inner peripheral surface of the extraction hole and the extraction hole hole are A conductive layer is formed by applying a metal paste made of a high melting point metal to the upper surface of the body at the edge, and a nickel layer is applied to the entire surface of the conductive layer, and in the insertion gap surrounded by the nickel layer, A ceramic heater characterized by having lead wire ends inserted and fixed through silver solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981023655U JPH0119345Y2 (en) | 1981-02-21 | 1981-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981023655U JPH0119345Y2 (en) | 1981-02-21 | 1981-02-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57136196U JPS57136196U (en) | 1982-08-25 |
| JPH0119345Y2 true JPH0119345Y2 (en) | 1989-06-05 |
Family
ID=29821404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981023655U Expired JPH0119345Y2 (en) | 1981-02-21 | 1981-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0119345Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1627555B1 (en) * | 2003-05-28 | 2006-11-22 | Saint-Gobain Glass France | Laminated element provided with a heated layer |
| WO2021075240A1 (en) * | 2019-10-18 | 2021-04-22 | 京セラ株式会社 | Structure and heating device |
| WO2023189185A1 (en) * | 2022-03-31 | 2023-10-05 | 株式会社巴川製紙所 | Sheet-shaped heater |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5060513A (en) * | 1973-09-28 | 1975-05-24 | ||
| JPS51106058A (en) * | 1975-03-14 | 1976-09-20 | Citizen Watch Co Ltd | SERAMITSUKUKIBAN |
| JPS545595A (en) * | 1977-06-14 | 1979-01-17 | Hitachi Chemical Co Ltd | Method of making electric resistor |
| JPS5433422U (en) * | 1977-08-10 | 1979-03-05 |
-
1981
- 1981-02-21 JP JP1981023655U patent/JPH0119345Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5060513A (en) * | 1973-09-28 | 1975-05-24 | ||
| JPS51106058A (en) * | 1975-03-14 | 1976-09-20 | Citizen Watch Co Ltd | SERAMITSUKUKIBAN |
| JPS545595A (en) * | 1977-06-14 | 1979-01-17 | Hitachi Chemical Co Ltd | Method of making electric resistor |
| JPS5433422U (en) * | 1977-08-10 | 1979-03-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57136196U (en) | 1982-08-25 |
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