JPH01190755A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH01190755A JPH01190755A JP1665588A JP1665588A JPH01190755A JP H01190755 A JPH01190755 A JP H01190755A JP 1665588 A JP1665588 A JP 1665588A JP 1665588 A JP1665588 A JP 1665588A JP H01190755 A JPH01190755 A JP H01190755A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- weight
- resin
- bisphenol
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 40
- -1 triazine compound Chemical class 0.000 claims abstract description 29
- 150000001875 compounds Chemical class 0.000 claims abstract description 20
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 19
- 229920006230 thermoplastic polyester resin Polymers 0.000 claims abstract description 18
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 14
- 229920000098 polyolefin Polymers 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 13
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 claims abstract description 7
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 19
- 239000002253 acid Substances 0.000 abstract description 12
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract description 10
- 238000002156 mixing Methods 0.000 abstract description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract description 5
- 150000002148 esters Chemical class 0.000 abstract description 5
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 abstract description 5
- 150000004985 diamines Chemical class 0.000 abstract description 4
- 229920001283 Polyalkylene terephthalate Polymers 0.000 abstract description 2
- 150000003951 lactams Chemical class 0.000 abstract description 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 description 14
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 11
- 239000005977 Ethylene Substances 0.000 description 11
- 229920000877 Melamine resin Polymers 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000001746 injection moulding Methods 0.000 description 9
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical class OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000005907 alkyl ester group Chemical group 0.000 description 3
- 239000004566 building material Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 150000007974 melamines Chemical class 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 150000003751 zinc Chemical class 0.000 description 3
- XLYMOEINVGRTEX-ONEGZZNKSA-N (e)-4-ethoxy-4-oxobut-2-enoic acid Chemical class CCOC(=O)\C=C\C(O)=O XLYMOEINVGRTEX-ONEGZZNKSA-N 0.000 description 2
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002734 clay mineral Substances 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 239000001530 fumaric acid Chemical class 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- VBIWIGSLGRYEDA-UHFFFAOYSA-N 1,3,5-triethyl-1,3,5-triazinane-2,4,6-trione Chemical compound CCN1C(=O)N(CC)C(=O)N(CC)C1=O VBIWIGSLGRYEDA-UHFFFAOYSA-N 0.000 description 1
- AHWDQDMGFXRVFB-UHFFFAOYSA-N 1,3,5-trimethyl-1,3,5-triazinane-2,4,6-trione Chemical compound CN1C(=O)N(C)C(=O)N(C)C1=O AHWDQDMGFXRVFB-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- ZLKYBXDNXFQYDL-UHFFFAOYSA-N 2,4,6-triethoxy-1,3,5-triazine Chemical compound CCOC1=NC(OCC)=NC(OCC)=N1 ZLKYBXDNXFQYDL-UHFFFAOYSA-N 0.000 description 1
- DFUGJTBMQKRCPI-UHFFFAOYSA-N 2,4,6-trimethoxy-1,3,5-triazine Chemical compound COC1=NC(OC)=NC(OC)=N1 DFUGJTBMQKRCPI-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- QLVPICNVQBBOQP-UHFFFAOYSA-N 2-(4,6-diamino-1,3,5-triazin-2-yl)guanidine Chemical compound NC(N)=NC1=NC(N)=NC(N)=N1 QLVPICNVQBBOQP-UHFFFAOYSA-N 0.000 description 1
- BMFMTNROJASFBW-UHFFFAOYSA-N 2-(furan-2-ylmethylsulfinyl)acetic acid Chemical compound OC(=O)CS(=O)CC1=CC=CO1 BMFMTNROJASFBW-UHFFFAOYSA-N 0.000 description 1
- MUOPWKRYDKBMJS-UHFFFAOYSA-N 2-[(2-hydroxyphenyl)methyl]-4-methyl-3-(2-methylpropyl)phenol Chemical compound CC(C)CC1=C(C)C=CC(O)=C1CC1=CC=CC=C1O MUOPWKRYDKBMJS-UHFFFAOYSA-N 0.000 description 1
- RWKGRPMIVVAART-UHFFFAOYSA-N 2-[(2-hydroxyphenyl)methyl]-4-methyl-3-phenylphenol Chemical compound C=1C=CC=CC=1C=1C(C)=CC=C(O)C=1CC1=CC=CC=C1O RWKGRPMIVVAART-UHFFFAOYSA-N 0.000 description 1
- JVPFOKXICYJJSC-UHFFFAOYSA-N 2-azaniumylnonanoate Chemical compound CCCCCCCC(N)C(O)=O JVPFOKXICYJJSC-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical class CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 description 1
- UPUBPJSRVFPODT-UHFFFAOYSA-N 3-ethyl-2-[(2-hydroxyphenyl)methyl]-4-methylphenol Chemical compound CCC1=C(C)C=CC(O)=C1CC1=CC=CC=C1O UPUBPJSRVFPODT-UHFFFAOYSA-N 0.000 description 1
- UFERIGCCDYCZLN-UHFFFAOYSA-N 3a,4,7,7a-tetrahydro-1h-indene Chemical compound C1C=CCC2CC=CC21 UFERIGCCDYCZLN-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- SNULTPQANPFFQH-UHFFFAOYSA-N 6-methoxy-1h-1,3,5-triazine-2,4-dione Chemical compound COC1=NC(=O)NC(=O)N1 SNULTPQANPFFQH-UHFFFAOYSA-N 0.000 description 1
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920003182 Surlyn® Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- YSKUZVBSHIWEFK-UHFFFAOYSA-N ammelide Chemical compound NC1=NC(O)=NC(O)=N1 YSKUZVBSHIWEFK-UHFFFAOYSA-N 0.000 description 1
- MASBWURJQFFLOO-UHFFFAOYSA-N ammeline Chemical compound NC1=NC(N)=NC(O)=N1 MASBWURJQFFLOO-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- YSRVJVDFHZYRPA-UHFFFAOYSA-N melem Chemical compound NC1=NC(N23)=NC(N)=NC2=NC(N)=NC3=N1 YSRVJVDFHZYRPA-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000005395 methacrylic acid group Chemical class 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical compound [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野〕 本発明は新規な樹脂組成物に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to a novel resin composition.
さらに詳しくいえば、本発明は、電気・電子部品や建材
部品などに好適な、電気特性及び機械的特性に優れ、か
つ吸湿によるそれらの変化が少なく、靭性も高い上に、
難燃性に優れ、しかも金属腐食性が低いなど、優れた特
徴を有する樹脂組成物に関するものである。More specifically, the present invention is suitable for electrical/electronic parts and building material parts, has excellent electrical properties and mechanical properties, has little change in these properties due to moisture absorption, and has high toughness.
The present invention relates to a resin composition having excellent characteristics such as excellent flame retardancy and low metal corrosiveness.
[従来の技術]
ポリアミド樹脂は、乾燥状態では機械的特性及び電気特
性などに優れているが、吸湿性が高く、吸湿によって物
性や寸法の変化が大きく、特に電気的特性の低下が著し
いことから、例えば電気・電子部品などの用途への使用
は制約を免れないという欠点を有している。[Prior art] Polyamide resin has excellent mechanical and electrical properties in a dry state, but it is highly hygroscopic, and its physical properties and dimensions change significantly due to moisture absorption, and in particular, the electrical properties deteriorate significantly. However, it has the drawback that its use in applications such as electrical and electronic components is subject to restrictions.
一方、熱可塑性ポリエステル樹脂は、吸湿性が低く、電
気的特性の変化が少ないという長所を有しているものの
、難燃化が容易ではなく、難燃化には臭素化合物などの
ハロゲン系難燃剤やアンチモン化合物の配合が必要であ
って、該ハロゲン系難燃剤は金属接点を腐食させやすい
ため、やはり電気・電子部品などの用途への使用は制約
を免れないという問題がある。On the other hand, although thermoplastic polyester resin has the advantage of low hygroscopicity and little change in electrical properties, it is not easy to make it flame retardant, and halogenated flame retardants such as bromine compounds are required to make it flame retardant. Since the halogen-based flame retardant tends to corrode metal contacts, there are still restrictions on its use in electrical and electronic parts.
さらに、該熱可塑性ポリエステル樹脂は、ポリアミド樹
脂に比較して靭性に劣るため、樹脂の靭性と弾性を利用
したスナツプフィツトや結線保持などのコネクター類に
は、そのままでは使用しにくく、このような用途に用い
るには、通常エラストマー成分を配合することが行われ
ているが、この場合、難燃性が低下するため、離燃剤の
配合量を多くせざるをえず、したがって電気・電子部品
用としては、金属腐食性が大きくなるという不都合な問
題が生じる。Furthermore, since thermoplastic polyester resin has inferior toughness compared to polyamide resin, it is difficult to use it as is for connectors such as snap fits and wire retention that utilize the toughness and elasticity of resin, and it is difficult to use it as is for such applications. For this purpose, elastomer components are usually blended, but in this case, the flame retardant properties are reduced, so it is necessary to increase the amount of flame release agent blended, and therefore it is not suitable for electrical and electronic parts. , the disadvantageous problem of increased metal corrosivity arises.
[発明が解決しようとする課題]
本発明はこのような事情のもとで、電気特性及び機械的
特性に優れ、かつ吸湿によるそれらの変化が少なく、靭
性も高い上に、離燃性に優れ、しかも金属腐食性か低い
など、優れた特徴を有していて、電気・電子部品や建材
部品などに好適に用いられる樹脂組成物を提供すること
を目的としてなされたものである。[Problems to be Solved by the Invention] Under these circumstances, the present invention provides a material that has excellent electrical and mechanical properties, has little change in these properties due to moisture absorption, has high toughness, and has excellent flammability. The purpose of this invention is to provide a resin composition which has excellent characteristics such as low metal corrosiveness and is suitable for use in electric/electronic parts, building material parts, etc.
[課題を解決するだめの手段]
本発明者らは、前記の優れた特徴を有する樹脂組成物を
開発するために鋭意研究を重ねた結果、所定の割合のポ
リアミド樹脂と熱可塑性ポリエステル樹脂との混合物に
、トリアジン系化合物とヒスフェノール型エポキシ化合
物及び/又は特定のオレフィン系重合体とを、所定の割
合で配合して成る組成物が、その目的に適合しうろこと
を見い出し、この知見に基づいて本発明を完成するに至
っlこ 。[Means for Solving the Problems] As a result of intensive research to develop a resin composition having the above-mentioned excellent characteristics, the present inventors discovered that a polyamide resin and a thermoplastic polyester resin in a predetermined ratio were combined. Based on this finding, we discovered that a composition consisting of a mixture containing a triazine compound, a hisphenol-type epoxy compound, and/or a specific olefin polymer in a predetermined ratio is suitable for the purpose. This led to the completion of the present invention.
すなわち本発明は、(A)(イ)ポリアミド樹脂20〜
95重量%と(ロ)熱可塑性ポリエステル樹脂80〜5
重量%との樹脂混合物100重量部に対し、(B)トリ
アジン系化合物5〜50重量部、(C)ヒスフェノール
類とエピクロルヒドリンとの縮合物から成る重合度3以
上のヒスフェノール型エポキシ化合物0.01〜30重
量部、及び/又は(D)α、β−不飽和カルボン酸若し
くはその誘導体を共重合又はこれらで変性したオレフィ
ン系重合体2〜40重量部を配合して成る樹脂組成物を
提供するものである。That is, the present invention provides (A) (a) polyamide resin 20 to
95% by weight and (b) thermoplastic polyester resin 80-5
(B) 5 to 50 parts by weight of a triazine compound, (C) a hisphenol-type epoxy compound with a degree of polymerization of 3 or more consisting of a condensate of hisphenols and epichlorohydrin, and 0.0% to 100 parts by weight of the resin mixture. 01 to 30 parts by weight, and/or (D) 2 to 40 parts by weight of an olefin polymer copolymerized with or modified with an α,β-unsaturated carboxylic acid or a derivative thereof. It is something to do.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明組成物においては、(A)成分としてポリアミド
樹脂及び熱可塑性ポリエステル樹脂が用いられる。該ポ
リアミド樹脂としては、3員環以上のラクタム、重合可
能なω−アミノ酸、二塩基酸とジアミンなどの重縮合に
よって得られるポリアミド樹脂を用いることができる。In the composition of the present invention, a polyamide resin and a thermoplastic polyester resin are used as component (A). As the polyamide resin, a polyamide resin obtained by polycondensation of a lactam having three or more membered rings, a polymerizable ω-amino acid, a dibasic acid, and a diamine can be used.
このようなポリアミド樹脂の具体例としては、ε−カプ
ロラクタム、アミノカプロン酸、エナントラクタム、7
−アミンへブタン酸、11−アミノウンデカン酸、9−
アミノノナン酸、α−ピロリドン、α−ピペリドンなと
の重合体、ヘキサメチレンジアミン、ノナメチレンジア
ミン、ウンデカメチレンジアミン、ドテカメチレンジア
ミン、メタキシリレンジアミンなどのジアミンと、テレ
フタル酸、イソフタル酸、アジピン酸、セパチン酸、ド
デカンニ塩基酸、ゲルタール酸なとのジカルボン酸とを
重縮合させて成る重合体又はこれらの共重合体、例えば
、ナイロン4.6.7.8.11.12.6,6.6,
9.6,10.6、I+、 6.+2.6T、 6/6
,6.6/12.6/6T、 6+/67などが挙げら
れる。これらのポリアミド樹脂は1種用いてもよいし、
2種以上を組み合わせて用いてもよい。Specific examples of such polyamide resins include ε-caprolactam, aminocaproic acid, enantlactam, 7
-Aminhebutanoic acid, 11-aminoundecanoic acid, 9-
Polymers of aminononanoic acid, α-pyrrolidone, α-piperidone, diamines such as hexamethylene diamine, nonamethylene diamine, undecamethylene diamine, dotecamethylene diamine, metaxylylene diamine, and terephthalic acid, isophthalic acid, adipine. Polymers formed by polycondensation of dicarboxylic acids such as acid, cepatic acid, dodecane dibasic acid, and geltaric acid, or copolymers thereof, such as nylon 4.6.7.8.11.12.6,6 .6,
9.6, 10.6, I+, 6. +2.6T, 6/6
, 6.6/12.6/6T, 6+/67, etc. One type of these polyamide resins may be used, or
You may use two or more types in combination.
一方、熱可塑性ポリエステル樹脂としては、テレフタル
酸又はそのジアルキルエステルと脂肪族グリコール類と
の重縮合反応によって得られるポリアルキレンテレフタ
レート又はこれらを主体とする共重合体が用いられ、代
表的なものとしては、ポリエチレンテレフタレート、ポ
リブチレンテレフタレートなどが挙げられる。On the other hand, as the thermoplastic polyester resin, polyalkylene terephthalate obtained by the polycondensation reaction of terephthalic acid or its dialkyl ester with aliphatic glycols, or a copolymer mainly composed of these, is used. , polyethylene terephthalate, polybutylene terephthalate, and the like.
該脂肪族グリコール類としては、例えば、エチレングリ
コール、プロピレングリコール、テトラメチレングリコ
ール、ヘキサメチレングリコールなどが挙げられるが、
これら脂肪族グリコール類と共に他のジオール類又は多
価アルコール類、例えば脂肪族グリコール類に対して3
0重量%以下のシクロヘキサンジオーノ呟 シクロヘキ
サンジメタツール、キシリレングリコール、2,2−ビ
ス(4−ヒドロキシフェニル)プロパン、2,2−ビス
(4−ヒドロキシ−3,5−ジブロモフェニル)プロノ
くン、2,2−ビス(4−ヒドロキシエトキシフェニル
)プロパン、2.2−ビス(4−ヒドロキシエトキシ−
3,5−ジブロモフェニル)プロパン、グリセリン、ペ
ンタエリスリトールなとを混合して用いてもよい。Examples of the aliphatic glycols include ethylene glycol, propylene glycol, tetramethylene glycol, hexamethylene glycol, etc.
3 for these aliphatic glycols as well as other diols or polyhydric alcohols, such as aliphatic glycols.
0% by weight or less of cyclohexane dimetatool, xylylene glycol, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dibromophenyl)propane 2,2-bis(4-hydroxyethoxyphenyl)propane, 2,2-bis(4-hydroxyethoxyphenyl)
A mixture of 3,5-dibromophenyl)propane, glycerin, and pentaerythritol may be used.
また、テレフタル酸又はそのジアルキルエステルと共に
他の二塩基酸、多塩基酸又はそれらのアルキルエステル
、例えはテレフタル酸又はそのジアルキルエステルに対
して30重量%以下の7タル酸、イソフタル酸、ナフタ
リンジカルボン酸、ジフェニルジカルボン酸、アジピン
酸、セバシン酸、トリメシン酸、トリメリント酸、それ
らのアルキルエステルなどを混合して用いてもよい。In addition, together with terephthalic acid or its dialkyl ester, other dibasic acids, polybasic acids, or their alkyl esters, such as 7-thalic acid, isophthalic acid, naphthalene dicarboxylic acid, in an amount of not more than 30% by weight based on terephthalic acid or its dialkyl ester. , diphenyldicarboxylic acid, adipic acid, sebacic acid, trimesic acid, trimellitic acid, alkyl esters thereof, etc. may be used in combination.
前記熱可塑性ポリエステル樹脂は1種用いてもよいし、
2種以上を組み合わせて用いてもよい。One type of the thermoplastic polyester resin may be used, or
You may use two or more types in combination.
本発明組成物における前記のポリアミド樹脂と熱可塑性
ポリエステル樹脂との配合割合についてはポリアミド樹
脂が20〜95重量%、好ましくは40〜80重量%、
熱可塑性ポリエステル樹脂が80〜5重量%、好ましく
は60〜20重量%になるような割合で配合することが
必要である。Regarding the blending ratio of the polyamide resin and thermoplastic polyester resin in the composition of the present invention, the polyamide resin is 20 to 95% by weight, preferably 40 to 80% by weight,
It is necessary to mix the thermoplastic polyester resin in a proportion of 80 to 5% by weight, preferably 60 to 20% by weight.
この配合割合が前記範囲を逸脱すると所望の物性を有す
る樹脂組成物が得られず、本発明の目的が十分に達成さ
れない。If this blending ratio deviates from the above range, a resin composition having desired physical properties will not be obtained, and the object of the present invention will not be fully achieved.
本発明組成物においては、その難燃性を高めるために、
(B)成分としてトリアジン系化合物が配合される。こ
のトリアジン系化合物としては、例えば一般式
(式中のR1、R2及びR3は、それぞれ水素原子又は
アルキル基であり、それらは同一であってもよいし、た
がいに異なっていてもよい)で表わされる化合物、メラ
ミン類、シアヌル酸メ7一
ラミンなどが挙げられる。In order to improve the flame retardancy of the composition of the present invention,
A triazine compound is blended as component (B). This triazine compound is, for example, one represented by the general formula (in the formula, R1, R2, and R3 are each a hydrogen atom or an alkyl group, and they may be the same or different). Examples include compounds such as melamine, melamine cyanurate, and the like.
前記一般式(I)で表わされる化合物の具体例としては
、シアヌル酸、トリメチルシアヌレート、トリエチルシ
アヌレート
アヌレート、メチルシアヌレート、ジエチルシアヌレ−
1・なとが挙げられ、また前記一般式(II)で表わさ
れる化合物の具体例としては、インシアヌル酸、トリメ
チルイソシアヌレート、トリエチルイソシアヌレート、
トリ(n−プロピル)インシアヌレート、ジエチルイソ
シアヌレ−1−、メチルイソンアヌレートなどが挙げら
れる。Specific examples of the compound represented by the general formula (I) include cyanuric acid, trimethyl cyanurate, triethyl cyanurate, methyl cyanurate, and diethyl cyanurate.
Specific examples of the compound represented by the general formula (II) include incyanuric acid, trimethyl isocyanurate, triethyl isocyanurate,
Examples include tri(n-propyl)ine cyanurate, diethyl isocyanurate-1-, and methylisone anurate.
一方、前記メラミン類は、メラミンをはじめ、メラミン
誘導体、メラミンと類似の構造を有する化合物、メラミ
ンの縮合物などであり、このようなものとしては、例え
ばメラミン、アンメリド、アンメリン、ホルモグアナミ
ン、グアニルメラミン、ンアノメラミン、アリールグア
ナミン、メラム、メレム、メロンなどを挙げることがで
きる。On the other hand, the melamines include melamine, melamine derivatives, compounds having a similar structure to melamine, condensates of melamine, etc.; examples of such melamines include melamine, ammelide, ammeline, formoguanamine, and guanylmelamine. , ananomelamine, arylguanamine, melam, melem, melon, etc.
さらに前記シアヌル酸メラミンは、シアヌル酸とメラミ
ンとの等モル反応物であって、例えばシアヌル酸の水溶
液とメラミンの水溶液とを混合し、90〜1 0 0
’0で撹拌下反応させ、生成した沈殿をろ別することに
よって得ることかできる。このものは白色の固体であり
、微粉末状に粉砕して使用することが望ましい。もちろ
ん、市販品をそのまま、又は粉砕して使用することがで
きるし、また、シアヌル酸メラミン中のアミノ基又は水
酸基のいくつかが他の置換基で置換されたものも用いる
ことができる。Further, the cyanuric acid melamine is an equimolar reaction product of cyanuric acid and melamine, for example, by mixing an aqueous solution of cyanuric acid and an aqueous solution of melamine.
It can be obtained by carrying out the reaction under stirring at 0.0 0.0000000000000 000 and filtering off the produced precipitate. This product is a white solid and is preferably used after being ground into a fine powder. Of course, commercially available products can be used as they are or after being crushed, and melamine cyanurate in which some of the amino groups or hydroxyl groups have been substituted with other substituents can also be used.
これらのトリアジン系化合物は、それぞれ単独で用いて
もよいし、2種以上を組み合わせて用いてもよい。また
、前記トリアジン系化合物の中では、メラミン及びシア
ヌル酸メラミンが好ましく、特にシアヌル酸メラミンは
分解物が成形体の表面に浮き出てくる。いわゆるブルー
ミングなどの不都合がないので好ましい。These triazine compounds may be used alone or in combination of two or more. Furthermore, among the triazine compounds, melamine and melamine cyanurate are preferred, and in particular, melamine cyanurate causes decomposition products to emerge on the surface of the molded article. This is preferable because there is no inconvenience such as so-called blooming.
本発明組成物においては、この(B)成分のトリアジン
系化合物の配合量は、前記(A)成分のポリアミド樹脂
と熱可塑性ポリエステル樹脂との混合物100重量部に
対し、5〜50重量部、好ましくけ7〜35重量部の範
囲で選ばれる。この量が5重量部未満では該組成物の難
燃性改良効果が期待できないし、50重量部を超えると
該組成物の電気特性や機械的特性などが低下するおそれ
がある。In the composition of the present invention, the amount of the triazine compound as the component (B) is preferably 5 to 50 parts by weight, based on 100 parts by weight of the mixture of the polyamide resin and thermoplastic polyester resin as the component (A). The amount is selected in the range of 7 to 35 parts by weight. If this amount is less than 5 parts by weight, no effect of improving the flame retardance of the composition can be expected, and if it exceeds 50 parts by weight, the electrical properties, mechanical properties, etc. of the composition may deteriorate.
本発明組成物においては、その耐衝撃性や電気特性を向
上させるために、(C)成分としてビスフェノール型エ
ポキシ化合物及び/又は(D)成分としてオレフィン系
重合体が配合される。前記(C)成分のビスフェノール
型エポキシ化合物は、ヒスフェノール類とエピクロルヒ
ドリンとの縮合物から成り、かつ重合度が3以上、好ま
しくは15以上の高分子量のものである。In the composition of the present invention, a bisphenol type epoxy compound as component (C) and/or an olefin polymer as component (D) are blended in order to improve its impact resistance and electrical properties. The bisphenol type epoxy compound of component (C) is composed of a condensate of hisphenols and epichlorohydrin, and has a high molecular weight with a degree of polymerization of 3 or more, preferably 15 or more.
このビスフェノール型エポキシ化合物は、例えばビスフ
ェノール類がビスフェノールAである場合、次の一般式
で表わすことができる。This bisphenol type epoxy compound can be represented by the following general formula when the bisphenol is bisphenol A, for example.
(以下余白)
(式中のnは3以上、好ましくは15以上の数である)
該ビスフェノール類としては、例えばビスフェノールA
1 ビスフェノールF1 ビスフェノールC1テトラメ
チルビスフェノールA1テトラメチルビスフエノールF
1ジイソプロピルビスフエノールA1ジー5ec−ブチ
ルビスフェノールA1テトラ−tert−ブチルビスフ
ェノールA1テトラ−tert−ブチルビスフェノール
F1テトラ−tert−ブチルヒスフェノール、1.l
−エチリデンビスフェノール、l、1−インブチリデン
ビスフェノール、メチルーエチルーメチレンビスフエノ
ーノL=。(The following is a blank space) (n in the formula is a number of 3 or more, preferably 15 or more) The bisphenols include, for example, bisphenol A
1 Bisphenol F1 Bisphenol C1 Tetramethylbisphenol A1 Tetramethylbisphenol F
1 diisopropyl bisphenol A1 di-5ec-butylbisphenol A1 tetra-tert-butylbisphenol A1 tetra-tert-butylbisphenol F1 tetra-tert-butylhisphenol, 1. l
-ethylidene bisphenol, l, 1-imbutylidene bisphenol, methyl-ethyl-methylene bisphenol L=.
メチル−イソブチル−メチレンビスフェノール、メチル
−ヘキシル−メチレンヒスフェノール、メチル−フェニ
ル−メチレンビスフェノール、ビスフェノールz、p、
p’−ビスフェノール、メチレンビス(2,4−ジーt
ert−ブチルー3−クレゾール)、o、 pl−ビス
フェノールA1メチルプロピネイトジフエノール、エチ
ルプロピネイトジフェノール、テトラメチルビスフェノ
ールSなどを挙げることができる。Methyl-isobutyl-methylenebisphenol, methyl-hexyl-methylenehisphenol, methyl-phenyl-methylenebisphenol, bisphenol z, p,
p'-bisphenol, methylenebis(2,4-di-t
ert-butyl-3-cresol), o, pl-bisphenol A1 methylpropinate diphenol, ethylpropinate diphenol, tetramethylbisphenol S, and the like.
本発明組成物においては、前記(C)成分のビスフェノ
ール型エポキシ化合物の配合量は、前記(A)成分のポ
リアミド樹脂と熱可塑性ポリエステル樹脂との混合物1
00重量部に対して、0.01〜30重量部、好ましく
は0.1〜15重量部の範囲で選ばれる。この量が0,
01重量部未満では耐衝撃性や電気特性の改良効果が期
待できないし、30重量部を超えるとポリアミド樹脂と
熱可塑性ポリエステル樹脂との混合樹脂本来の物性が損
なわれるようになる。In the composition of the present invention, the blending amount of the bisphenol-type epoxy compound as the component (C) is equal to 1% of the mixture of the polyamide resin and the thermoplastic polyester resin as the component (A).
0.01 to 30 parts by weight, preferably 0.1 to 15 parts by weight. This amount is 0,
If it is less than 0.01 parts by weight, no effect of improving impact resistance or electrical properties can be expected, and if it exceeds 30 parts by weight, the original physical properties of the mixed resin of polyamide resin and thermoplastic polyester resin will be impaired.
前記(1))成分のオレフィン系重合体は、α、β−不
飽和カルボン酸若しくはその誘導体を共重合又はこれら
で変性したものであって、該α、β−不飽和カルボン酸
若しくはその誘導体としては、(1)炭素数3〜12の
エチレン性不飽和モノ又はジカルボン酸、(2)炭素数
1〜29のアルコールとモノカルボン酸とのエステル、
該アルコールとジカルボン酸とのモノエステル及びジエ
ステル、(3)カルボキシル基の一部又は全部の水酸基
が金属イオンによって置換されているモノカルボン酸、
ジカルボン酸及びジカルボン酸モノエステルの金属塩な
どを挙げることができる。The olefinic polymer of component (1) above is a copolymerized or modified α,β-unsaturated carboxylic acid or its derivative, and as the α,β-unsaturated carboxylic acid or its derivative. is (1) an ethylenically unsaturated mono- or dicarboxylic acid having 3 to 12 carbon atoms, (2) an ester of an alcohol having 1 to 29 carbon atoms and a monocarboxylic acid,
Monoesters and diesters of the alcohol and dicarboxylic acid; (3) monocarboxylic acids in which some or all of the hydroxyl groups of the carboxyl groups are substituted with metal ions;
Examples include metal salts of dicarboxylic acids and dicarboxylic acid monoesters.
このようなものの具体例としては、メチルメタクリレー
ト、ブチルアクリレート、エチルアクリレート、アクリ
ル酸及びメタクリル酸のアルキルエステル、メタクリル
酸ナトリウム、メタクリル酸亜鉛、マレイン酸、無水マ
レイ酸、マレイン酸モノエチルエステル、マレイン酸モ
ノエチルエステル金属塩、フマル酸、フマル酸モノエチ
ルエステル、フマル酸モノエチルエステルの金属塩、マ
レイン酸、フマル酸の炭素数29までのアルキルモノエ
ステル、グリシジルメタクリレート、グリシジルアクリ
レートなとか挙げられる。Specific examples of these include methyl methacrylate, butyl acrylate, ethyl acrylate, alkyl esters of acrylic and methacrylic acids, sodium methacrylate, zinc methacrylate, maleic acid, maleic anhydride, maleic acid monoethyl ester, maleic acid Examples include monoethyl ester metal salts, fumaric acid, fumaric acid monoethyl ester, metal salts of fumaric acid monoethyl ester, maleic acid, alkyl monoesters of fumaric acid having up to 29 carbon atoms, glycidyl methacrylate, and glycidyl acrylate.
該オレフィン系重合体は、これらのα、β−不飽和カル
ボン酸又はその誘導体がエチレン、プロピレン、ブテン
などの単量体とランダムに共重合したものであってもよ
いし、エチレン、プロピレン、ブテンなどのオレフィン
重合体にグラフト重合又はグラフト反応したものであっ
てもよい。具体的には、エチレン/メタクリル酸又はメ
タクリル酸の亜鉛塩、エチレン/イソブチルアクリレー
ト/メタクリル酸の亜鉛塩:エチレン/メチルアクリレ
ート/無水マレイン酸のモノエチルエステル及びその0
〜100%中和した亜鉛、ナトリウム、カルシウム、リ
チウム、アンチモン、及びカリウム塩二エチレン/プロ
ピレン/ g −無水マレイン酸:エチレン/フテン/
g−無水マレイン酸:エチレン/メチルアクリレート/
メタクリル酸及びその亜鉛塩:エチレン/酢酸ビニル/
メタクリル酸及びその亜鉛塩:エチレン/プロピレン/
1,4−ヘキサジエン/g−無水マレイン酸:エチレン
/プロピレン/ノルボルナジェン/g−無水マレイン酸
:エチレン/プロピレン/テトラヒドロインデン/g−
7マル酸:エチレン/グリシジルメタクリレート:エチ
レン/酢酸上ニル/グリシジルメタクリレート:エチレ
ン/プロピ1フフg−テトラヒドロフルフリルメタクリ
レート:エチレン/ブチ2フg−テトラヒドロフルフリ
ルメタクリレート:エチレン/フロピレン/9−無水マ
レイン酸/g−テトラヒドロフルフリルメタクリレート
:エチレン/ブチテン/g−無水マレイン酸/7−チト
ラヒドロフルフリルメタクリレート(gはグラフトを意
味する)などのランダム共重合体又はグラフト物を挙げ
ることができる。The olefin polymer may be one in which these α,β-unsaturated carboxylic acids or derivatives thereof are randomly copolymerized with monomers such as ethylene, propylene, butene, or ethylene, propylene, butene, etc. It may be one obtained by graft polymerization or graft reaction with an olefin polymer such as. Specifically, ethylene/methacrylic acid or zinc salt of methacrylic acid, ethylene/isobutyl acrylate/zinc salt of methacrylic acid: monoethyl ester of ethylene/methyl acrylate/maleic anhydride and its 0
~100% neutralized zinc, sodium, calcium, lithium, antimony, and potassium salts diethylene/propylene/g - maleic anhydride: ethylene/phthene/
g-Maleic anhydride: ethylene/methyl acrylate/
Methacrylic acid and its zinc salt: ethylene/vinyl acetate/
Methacrylic acid and its zinc salt: ethylene/propylene/
1,4-hexadiene/g-maleic anhydride: ethylene/propylene/norbornadiene/g-maleic anhydride: ethylene/propylene/tetrahydroindene/g-
7 Malic acid: ethylene/glycidyl methacrylate: ethylene/propylene acetate/glycidyl methacrylate: ethylene/propylene 1 fug-tetrahydrofurfuryl methacrylate: ethylene/buty 2 fug-tetrahydrofurfuryl methacrylate: ethylene/furopylene/9-maleic anhydride Random copolymers or grafts such as acid/g-tetrahydrofurfuryl methacrylate: ethylene/butythene/g-maleic anhydride/7-titrahydrofurfuryl methacrylate (g means graft) can be mentioned.
α、β−不飽和カルボン酸又はその誘導体をランダム共
重合する場合には、その量は全成分の合計重量に対して
50重量%以下、グラフトさせる場合には0.01〜2
重量%の範囲が好ましい。In the case of random copolymerization of α,β-unsaturated carboxylic acids or derivatives thereof, the amount thereof is 50% by weight or less based on the total weight of all components, and in the case of grafting, the amount is 0.01 to 2
A weight percent range is preferred.
本発明で用いるオレフィン系重合体としては、ある程度
柔軟性の良好なものが耐衝撃性改良効果が著しく、した
がって曲げ弾性率が100〜5−150GO/cm2、
好ましくは200−8000kg/ cm2の範囲のも
のが望ましい。該オレフィン系重合体の中でも、特に金
属イオン含をエチレン共重合体が好適である。この金属
イオン含有エチレン共重合体は、エチレンとアクリル酸
、メタクリル酸のような不飽和カルボン酸との共重合体
にナトリウム、亜鉛、マグネシウムのような金属イオン
を結合させたもので、一般にアイオノマーと呼ばれてい
るものであり、このようなものとしては、例えば、デュ
ポン社製のアイオノマー樹脂(商標:サーリン)を挙げ
ることができる。As for the olefin polymer used in the present invention, those having good flexibility to some extent have a remarkable impact resistance improvement effect, and therefore have a bending modulus of 100 to 5-150 GO/cm2,
Preferably, it is in the range of 200-8000 kg/cm2. Among the olefin polymers, metal ion-containing ethylene copolymers are particularly preferred. This metal ion-containing ethylene copolymer is a copolymer of ethylene and an unsaturated carboxylic acid such as acrylic acid or methacrylic acid, with metal ions such as sodium, zinc, or magnesium bound to it, and is generally combined with an ionomer. An example of such a resin is ionomer resin (trademark: Surlyn) manufactured by DuPont.
前記(D)成分のオレフィン系重合体の配合量は、(A
)成分のポリアミド樹脂と熱可塑性ポリエステル樹脂と
の混合物100重量部に対し、2〜40重量部、好まし
くは3〜25重量部の範囲で選ばれる。この量が2重量
部未満では該組成物の耐衝撃性や電気特性の改良効果が
十分に発揮されないし、40重量部を超えるとポリアミ
ド樹脂と熱可塑性ポリエステル樹脂との混合樹脂本来の
物性が損なわれるおそれがある。The blending amount of the olefin polymer as the component (D) is (A
2 to 40 parts by weight, preferably 3 to 25 parts by weight, based on 100 parts by weight of the mixture of polyamide resin and thermoplastic polyester resin (component). If this amount is less than 2 parts by weight, the impact resistance and electrical properties of the composition will not be sufficiently improved, and if it exceeds 40 parts by weight, the original physical properties of the mixed resin of polyamide resin and thermoplastic polyester resin will be impaired. There is a risk of being exposed.
=16−
本発明組成物には、前記の各成分以外に、所望に応じ、
公知の各種添加剤、例えばガラス繊維、炭素繊維、金属
ウィスカーのような補強剤、シリカ、アルミナ、シリカ
−アルミナ系粘土鉱物、シリカ−マグネシウム系粘土鉱
物、ケイ酸カルシウム、炭酸カルシウム、アスベスト、
カーボンブラックのような充填剤、その他階剤、核剤、
酸化防止剤、難燃剤、帯電防止剤、耐候付与剤などを添
加してもよい。=16- In addition to the above-mentioned components, the composition of the present invention may contain, as desired,
Various known additives, such as glass fibers, carbon fibers, reinforcing agents such as metal whiskers, silica, alumina, silica-alumina clay minerals, silica-magnesium clay minerals, calcium silicate, calcium carbonate, asbestos,
Fillers such as carbon black, other flooring agents, nucleating agents,
Antioxidants, flame retardants, antistatic agents, weathering agents, etc. may be added.
本発明組成物は、前記の(A)成分、(B)成分、(C
)成分及び/又は(D)成分、さらに必要に応じて用い
られる各種添加剤を、通常用いられている方法により溶
融混練することによって調製することができる。混練機
としては、例えばエクストルーダー、バンバリーミキサ
−、スーパーミキサー、ロール、ニーダ−などが用いら
れるが、なかでもエクストルーダーを用い、樹脂温度2
20〜300°Cの範囲の温度において溶融混練する方
法が有利である。The composition of the present invention comprises the above-mentioned (A) component, (B) component, (C
It can be prepared by melt-kneading component ) and/or component (D), and various additives used as necessary, by a commonly used method. Examples of kneading machines used include extruders, Banbury mixers, super mixers, rolls, and kneaders.
Melt-kneading methods at temperatures in the range from 20 to 300°C are advantageous.
[発明の効果コ
本発明の樹脂組成物は、ポリアミド樹脂と熱可塑性ポリ
エステル樹脂との混合物に、トリアジン系化合物、特定
のビスフェノール型エポキシ化合物及び/又はオレフィ
ン系重合体を配合したものであって、電気特性及び機械
的特性に優れ、かつ吸湿によるそれらの変化が少なく、
靭性も高い上に、難燃性に優れしかも金属腐食性が低い
など、優れた特徴を有しており、例えば電気・電子部品
や建材部品などに好適に用いられる。[Effects of the Invention] The resin composition of the present invention is a mixture of a polyamide resin and a thermoplastic polyester resin blended with a triazine compound, a specific bisphenol type epoxy compound, and/or an olefin polymer, It has excellent electrical and mechanical properties, and has little change in them due to moisture absorption.
It has excellent characteristics such as high toughness, excellent flame retardancy, and low metal corrosion, and is suitable for use in, for example, electrical/electronic parts and building material parts.
[実施例]
次に実施例により本発明をさらに詳細に説明するが、本
発明はこれらの例によってなんら限定されるものではな
い。[Examples] Next, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited to these Examples in any way.
なお、組成物の各物性は次の方法に従って測定しjこ。In addition, each physical property of the composition was measured according to the following method.
(1)燃焼特性 1/16インチ厚みの試験片を用い、 UL94に準じて求めた。(1) Combustion characteristics Using a 1/16 inch thick test piece, Obtained according to UL94.
(2)体積固有抵抗
100mm113mm厚の試験片を用い、ASTM D
257に準じて測定した。(2) Using a test piece with a volume resistivity of 100 mm and a thickness of 113 mm, ASTM D
Measured according to 257.
(3)絶縁破壊電圧
100mm1.3mm厚の試験片を用い、ASTM D
149に準じて測定した。(3) Using a test piece with a dielectric breakdown voltage of 100 mm and a thickness of 1.3 mm, ASTM D
149.
(4)金属腐食性
ペレット100g中に、2X3X0.5cmの345C
製試験片を埋め、これを100℃の恒温槽中に96時間
放置後、試験片の表面を目視により観察し、次の判定基
準に従い評価しIこ。(4) In 100g of metal corrosive pellets, 2X3X0.5cm of 345C
After burying a manufactured test piece and leaving it in a constant temperature bath at 100°C for 96 hours, the surface of the test piece was visually observed and evaluated according to the following criteria.
優 :僅かに艶を失うが、腐食はない
良 :1〜5個/cm2の孔腐食がある不良:全面に腐
食がある
(5)曲げ弾性率
ASTM D 790に準じて測定した。Excellent: Slight loss of gloss, but no corrosion Good: 1 to 5 pits/cm2 of corrosion Poor: Corrosion on the entire surface (5) Flexural modulus Measured according to ASTM D 790.
(6)アイゾツト衝撃値 1/2インチ厚みの試験片を用い、 ASTM D 256に準じて測定した。(6) Izotsu impact value Using a 1/2 inch thick test piece, Measured according to ASTM D 256.
また、吸湿による物性の変化については、試験片を80
°0195%RH雰囲気下で168時間の吸湿処理を行
い、処理前後の曲げ弾性率、アイゾツト衝撃値、体積固
有抵抗及び絶縁破壊電圧を比較した。In addition, regarding changes in physical properties due to moisture absorption, test pieces were
Moisture absorption treatment was performed for 168 hours in an atmosphere of 195% RH, and the flexural modulus, Izot impact value, volume resistivity, and dielectric breakdown voltage before and after the treatment were compared.
実施例1〜7
ポリアミド樹脂として、相対粘度(JISK−6810
に準じたオスワルド粘度管にて測定)が3.0のナイロ
ン6又はナイロン66樹脂を用い、熱可塑性ポリエステ
ル樹脂として、極限粘度0.8のポリエチレンテレフタ
レート又は極限粘度1.1のポリブチレンテレフタレー
トを用い、第1表に示す組成になるように、これらの樹
脂にビスフェノール型エポキシ化合物及びトリアジン系
化合物を配合したのち、40mm$押出機で樹脂温度2
40〜290°Cの範囲内にて溶融混線後、得られた組
成物を型締カフ5tonの射出成形機[東芝機械(株)
製l575型]により射出成形を行った。Examples 1 to 7 Relative viscosity (JISK-6810
Using nylon 6 or nylon 66 resin with an Oswald viscosity tube of 3.0 (measured with an Oswald viscosity tube according to After compounding these resins with a bisphenol-type epoxy compound and a triazine-based compound so as to have the composition shown in Table 1, the resin temperature was increased to 2 using a 40 mm extruder.
After melting and mixing at a temperature of 40 to 290°C, the resulting composition was molded into a 5-ton injection molding machine with a mold clamping cuff [Toshiba Machine Co., Ltd.]
Injection molding was carried out using a model 1575 manufactured by Manufacturer Co., Ltd.
このようにして得られた成形品につい゛C各物性を求め
た。その結果を第2表に示す。The physical properties of the thus obtained molded article were determined. The results are shown in Table 2.
比較例1.2
=20−
ヒスフェノール型エポキシ化合物又はトリアジン系化合
物のいずれかを除いて、第1表に示す組成になるように
各成分を配合し、実施例1〜7と同様にして組成物を、
調製したのち、射出成形を行い、この成形品について各
物性を求めた。その結果を第2表に示す。Comparative Example 1.2 = 20- Each component was blended to have the composition shown in Table 1, except for either the hisphenol type epoxy compound or the triazine compound, and the composition was prepared in the same manner as Examples 1 to 7. Things,
After preparation, injection molding was performed, and various physical properties of this molded product were determined. The results are shown in Table 2.
比較例3.4
エポキシ化合物として、本発明の特許請求の範囲以外の
ものを用い、第1表に示す組成になるように各成分を配
合し、実施例1〜7と同様にして組成物を調製したのち
、射出成形を行い、この成形品について各物性を求めた
。その結果を第2表に示す。Comparative Example 3.4 Using an epoxy compound other than the claims of the present invention, each component was blended to have the composition shown in Table 1, and the composition was prepared in the same manner as Examples 1 to 7. After preparation, injection molding was performed, and various physical properties of this molded product were determined. The results are shown in Table 2.
比較例5〜13
難燃剤として、第1表に示す常用される化合物を用い、
該表に示す組成になるように各成分を配合し、実施例1
〜7と同様にして組成物を調製したのち、射出成形を行
い、この成形品について各物性を求めた。その結果を第
2表に示す。Comparative Examples 5 to 13 Using commonly used compounds shown in Table 1 as flame retardants,
Each component was blended so as to have the composition shown in the table, and Example 1
After preparing a composition in the same manner as in steps 7 to 7, injection molding was performed, and each physical property of the molded product was determined. The results are shown in Table 2.
実施例8〜15
ポリアミド樹脂として、相対粘度(JISK−6810
に準じたオスワルド粘度管にて測定)が3.0のナイロ
ン6又はナイロン66樹脂を用い、熱可塑性ポリエステ
ル樹脂として、極限粘度0.8のポリエチレンテレ7タ
ート又は極限粘度1.1のポリブチレンテレフタレート
を用い、第3表に示す組成になるように、これらの樹脂
にオレフィン系重合体及びトリアジン系化合物を配合し
たのち、40mm1押出機で樹脂温度240〜290°
Cの範囲内にて溶融混練後、得られた組成物を型締カフ
5tonの射出成形機[東芝機械(株)製、l575型
]により射出成形を行った。Examples 8 to 15 Relative viscosity (JISK-6810
Nylon 6 or nylon 66 resin with a viscosity of 3.0 (measured with an Oswald viscosity tube according to After blending these resins with an olefin polymer and a triazine compound so as to have the composition shown in Table 3 using
After melt-kneading within the range of C, the resulting composition was injection molded using a 5 ton injection molding machine [manufactured by Toshiba Machinery Co., Ltd., model 1575].
このようにして得られた成形品について各物性を求めた
。その結果を第4表に示す。Each physical property was determined for the molded article thus obtained. The results are shown in Table 4.
比較例14.15
オレフィン系重合体又はトリアジン系化合物のいずれか
を除いて、第3表に示す組成になるように各成分を配合
し、実施例8〜15と同様にして組成物を調製したのち
、射出成形を行い、この成形品について各物性を求めた
。その結果を第4表に示す。Comparative Example 14.15 A composition was prepared in the same manner as Examples 8 to 15, except for either the olefin polymer or the triazine compound, by blending each component so as to have the composition shown in Table 3. Afterwards, injection molding was performed, and various physical properties of this molded product were determined. The results are shown in Table 4.
比較例16
熱可塑性ポリエステル樹脂を用いずに、ナイロン6のみ
を用い、第3表に示す組成になるように各成分を配合し
、実施例8〜15と同様にして組成物を調製したのち、
射出成形を行い、この成形品について各物性を求めた。Comparative Example 16 Using only nylon 6 without using a thermoplastic polyester resin, each component was blended to have the composition shown in Table 3, and a composition was prepared in the same manner as Examples 8 to 15.
Injection molding was performed, and each physical property of the molded product was determined.
その結果を第4表に示す。The results are shown in Table 4.
比較例17〜23
難燃剤として、第3表に示す常用される化合物を用い、
第3表に示す組成になるように各成分を配合し、実施例
8〜15と同様にして組成物を調製したのち、射出成形
を行い、この成形品について各物性を求めた。その結果
を第4表に示す。Comparative Examples 17-23 Using commonly used compounds shown in Table 3 as flame retardants,
Each component was blended so as to have the composition shown in Table 3, and a composition was prepared in the same manner as in Examples 8 to 15. Then, injection molding was performed, and each physical property of the molded product was determined. The results are shown in Table 4.
(以下余白)
以上の結果から明らかなように、本発明組成物は、吸湿
による電気特性及び機械的特性の変化が少なく、かつ靭
性も高い上、U L 9’ 4燃焼試験において、V−
1−V−2の燃焼性を有し、しかも金属腐食性が著しく
低い。(Left below) As is clear from the above results, the composition of the present invention shows little change in electrical and mechanical properties due to moisture absorption, has high toughness, and has a V-
It has a flammability of 1-V-2 and has extremely low metal corrosiveness.
特許出願人 三菱化成工業株式会社Patent applicant: Mitsubishi Chemical Industries, Ltd.
Claims (1)
脂混合物100重量部に対し、 (B)トリアジン系化合物5〜50重量部、 (C)ビスフェノール類とエピクロルヒドリンとの縮合
物から成る重合度3以上のビスフェノール型エポキシ化
合物0.01〜30重量部、及び/又は (D)α,β−不飽和カルボン酸若しくはその誘導体を
共重合又はこれらで変性したオレフィン系重合体2〜4
0重量部を配合して成る樹脂組成物。(1) (B) 5 to 50 parts by weight of a triazine compound to 100 parts by weight of a resin mixture of (A) (a) 20 to 95% by weight of polyamide resin and (b) 80 to 5% by weight of thermoplastic polyester resin. , (C) 0.01 to 30 parts by weight of a bisphenol-type epoxy compound with a degree of polymerization of 3 or more consisting of a condensate of bisphenols and epichlorohydrin, and/or (D) an α,β-unsaturated carboxylic acid or a derivative thereof. Olefin polymers 2 to 4 polymerized or modified with these
A resin composition containing 0 parts by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1665588A JPH01190755A (en) | 1988-01-27 | 1988-01-27 | Resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1665588A JPH01190755A (en) | 1988-01-27 | 1988-01-27 | Resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01190755A true JPH01190755A (en) | 1989-07-31 |
Family
ID=11922357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1665588A Pending JPH01190755A (en) | 1988-01-27 | 1988-01-27 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01190755A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4314852A1 (en) * | 1993-05-05 | 1994-11-10 | Gerhard Dr Pohl | Process for producing flame-retardant thermoplastic materials with improved mechanical properties |
US5795935A (en) * | 1993-12-28 | 1998-08-18 | Daicel Chemical Industries, Ltd. | Thermoplastic composition of polyester, polyamide and glycidyl-modified polyolefin |
JP2012530172A (en) * | 2009-06-19 | 2012-11-29 | ロディア オペレーションズ | Composition of a blend of polyamide and polyester resin |
-
1988
- 1988-01-27 JP JP1665588A patent/JPH01190755A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4314852A1 (en) * | 1993-05-05 | 1994-11-10 | Gerhard Dr Pohl | Process for producing flame-retardant thermoplastic materials with improved mechanical properties |
US5795935A (en) * | 1993-12-28 | 1998-08-18 | Daicel Chemical Industries, Ltd. | Thermoplastic composition of polyester, polyamide and glycidyl-modified polyolefin |
JP2012530172A (en) * | 2009-06-19 | 2012-11-29 | ロディア オペレーションズ | Composition of a blend of polyamide and polyester resin |
EP2443198B1 (en) * | 2009-06-19 | 2019-05-01 | Rhodia Opérations | Composition of a blend of polyamide and polyester resins |
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