JPH01188851A - Planographic printing plate material free from dampening water - Google Patents
Planographic printing plate material free from dampening waterInfo
- Publication number
- JPH01188851A JPH01188851A JP1333788A JP1333788A JPH01188851A JP H01188851 A JPH01188851 A JP H01188851A JP 1333788 A JP1333788 A JP 1333788A JP 1333788 A JP1333788 A JP 1333788A JP H01188851 A JPH01188851 A JP H01188851A
- Authority
- JP
- Japan
- Prior art keywords
- printing plate
- photosensitive layer
- group
- plate material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 6
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 6
- 125000001624 naphthyl group Chemical group 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims description 12
- 239000005871 repellent Substances 0.000 claims description 9
- 125000001424 substituent group Chemical group 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 abstract description 3
- 125000003118 aryl group Chemical group 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 52
- -1 fumaric acid ester compound Chemical class 0.000 description 25
- 239000003822 epoxy resin Substances 0.000 description 24
- 229920000647 polyepoxide Polymers 0.000 description 24
- 229920002379 silicone rubber Polymers 0.000 description 18
- 239000004945 silicone rubber Substances 0.000 description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 150000008065 acid anhydrides Chemical class 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- BLLFPKZTBLMEFG-UHFFFAOYSA-N 1-(4-hydroxyphenyl)pyrrole-2,5-dione Chemical compound C1=CC(O)=CC=C1N1C(=O)C=CC1=O BLLFPKZTBLMEFG-UHFFFAOYSA-N 0.000 description 4
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 238000011907 photodimerization Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- AOGNACZDZNOTSN-UHFFFAOYSA-N 2,3-dihydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(CO)C(=O)C1=CC=CC=C1 AOGNACZDZNOTSN-UHFFFAOYSA-N 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical group 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- CNPVJWYWYZMPDS-UHFFFAOYSA-N 2-methyldecane Chemical compound CCCCCCCCC(C)C CNPVJWYWYZMPDS-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- FEIQOMCWGDNMHM-KBXRYBNXSA-N (2e,4e)-5-phenylpenta-2,4-dienoic acid Chemical compound OC(=O)\C=C\C=C\C1=CC=CC=C1 FEIQOMCWGDNMHM-KBXRYBNXSA-N 0.000 description 1
- XXURNZLYJUXXCF-CMDGGOBGSA-N (e)-4-octan-3-yloxy-4-oxobut-2-enoic acid Chemical compound CCCCCC(CC)OC(=O)\C=C\C(O)=O XXURNZLYJUXXCF-CMDGGOBGSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- UOZNXGJVAWDLQK-UHFFFAOYSA-N 1-(2,3-dimethylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(N2C(C=CC2=O)=O)=C1C UOZNXGJVAWDLQK-UHFFFAOYSA-N 0.000 description 1
- JFCMPPOHFHBDJX-UHFFFAOYSA-N 1-(6-phenylhexyl)pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCCCCCC1=CC=CC=C1 JFCMPPOHFHBDJX-UHFFFAOYSA-N 0.000 description 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- FXEKNWLZNLIDNR-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)propyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCCN1C(=O)C=CC1=O FXEKNWLZNLIDNR-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- PZQWVKKXPIZFHC-UHFFFAOYSA-N 1-decylpyrrole-2,5-dione Chemical compound CCCCCCCCCCN1C(=O)C=CC1=O PZQWVKKXPIZFHC-UHFFFAOYSA-N 0.000 description 1
- SWPTWQOTNPHEGB-UHFFFAOYSA-N 1-docosylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCCCCCCCN1C(=O)C=CC1=O SWPTWQOTNPHEGB-UHFFFAOYSA-N 0.000 description 1
- FDAOHAAJGZHMKN-UHFFFAOYSA-N 1-ethyl-3-hexylpyrrole-2,5-dione Chemical compound CCCCCCC1=CC(=O)N(CC)C1=O FDAOHAAJGZHMKN-UHFFFAOYSA-N 0.000 description 1
- FBPVUBVZRPURIU-UHFFFAOYSA-N 1-hexylpyrrole-2,5-dione Chemical compound CCCCCCN1C(=O)C=CC1=O FBPVUBVZRPURIU-UHFFFAOYSA-N 0.000 description 1
- GJPPVIKZFHWIKH-UHFFFAOYSA-N 1-methylidene-2h-biphenylene Chemical group C12=CC=CC=C2C2=C1C(=C)CC=C2 GJPPVIKZFHWIKH-UHFFFAOYSA-N 0.000 description 1
- KBZVSYQZRXCWHY-VAWYXSNFSA-N 1-o-butyl 4-o-octyl (e)-but-2-enedioate Chemical compound CCCCCCCCOC(=O)\C=C\C(=O)OCCCC KBZVSYQZRXCWHY-VAWYXSNFSA-N 0.000 description 1
- HOLZCMFSCBLOLX-UHFFFAOYSA-N 1-octadecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCCCN1C(=O)C=CC1=O HOLZCMFSCBLOLX-UHFFFAOYSA-N 0.000 description 1
- KIKBJYQCJJXCBZ-UHFFFAOYSA-N 1-octylpyrrole-2,5-dione Chemical compound CCCCCCCCN1C(=O)C=CC1=O KIKBJYQCJJXCBZ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- TZXATTMVGZDPHM-UHFFFAOYSA-N 2-[4-[(2-chloro-4-nitrophenyl)diazenyl]-n-ethylanilino]ethyl-trimethylazanium Chemical compound C1=CC(N(CC[N+](C)(C)C)CC)=CC=C1N=NC1=CC=C([N+]([O-])=O)C=C1Cl TZXATTMVGZDPHM-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- IVDGXLVAYRCQRS-UHFFFAOYSA-N 2-hydroxy-2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(O)(OC)C(=O)C1=CC=CC=C1 IVDGXLVAYRCQRS-UHFFFAOYSA-N 0.000 description 1
- ZDRNBORFSHEXKD-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-1,2-diphenylbutan-1-one Chemical compound C=1C=CC=CC=1C(O)(C(C)(C)C)C(=O)C1=CC=CC=C1 ZDRNBORFSHEXKD-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BVCOHOSEBKQIQD-UHFFFAOYSA-N 2-tert-butyl-6-methoxyphenol Chemical compound COC1=CC=CC(C(C)(C)C)=C1O BVCOHOSEBKQIQD-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- SAPGIBGZGRMCFZ-UHFFFAOYSA-N 3-[(2,5-dioxopyrrol-3-yl)methyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CC=2C(NC(=O)C=2)=O)=C1 SAPGIBGZGRMCFZ-UHFFFAOYSA-N 0.000 description 1
- NMRBLPVLHGBBJR-UHFFFAOYSA-N 3-[10-(2,5-dioxopyrrol-3-yl)decyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CCCCCCCCCCC=2C(NC(=O)C=2)=O)=C1 NMRBLPVLHGBBJR-UHFFFAOYSA-N 0.000 description 1
- VXPSQDAMFATNNG-UHFFFAOYSA-N 3-[2-(2,5-dioxopyrrol-3-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C(=CC=CC=2)C=2C(NC(=O)C=2)=O)=C1 VXPSQDAMFATNNG-UHFFFAOYSA-N 0.000 description 1
- SLJJEYCPTRKHFI-UHFFFAOYSA-N 3-[6-(2,5-dioxopyrrol-3-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CCCCCCC=2C(NC(=O)C=2)=O)=C1 SLJJEYCPTRKHFI-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical group C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- YGHFDTDSFZTYBW-UHFFFAOYSA-N O-silylhydroxylamine Chemical compound NO[SiH3] YGHFDTDSFZTYBW-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 241000555745 Sciuridae Species 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 description 1
- BTHCBXJLLCHNMS-UHFFFAOYSA-N acetyloxysilicon Chemical compound CC(=O)O[Si] BTHCBXJLLCHNMS-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- LHMRXAIRPKSGDE-UHFFFAOYSA-N benzo[a]anthracene-7,12-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)C1=CC=CC=C1C2=O LHMRXAIRPKSGDE-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- ROPXFXOUUANXRR-BUHFOSPRSA-N bis(2-ethylhexyl) (e)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C\C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-BUHFOSPRSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- FEIQOMCWGDNMHM-UHFFFAOYSA-N cinnamylideneacetic acid Natural products OC(=O)C=CC=CC1=CC=CC=C1 FEIQOMCWGDNMHM-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical group C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- STDUJGRYOCDXBT-VGFSZAGXSA-N didocosyl (e)-but-2-enedioate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCCCCCCCCCCCCCCCC STDUJGRYOCDXBT-VGFSZAGXSA-N 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- XHSDDKAGJYJAQM-ULDVOPSXSA-N dioctadecyl (e)-but-2-enedioate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCCCCCCCCCCCC XHSDDKAGJYJAQM-ULDVOPSXSA-N 0.000 description 1
- WTIFDVLCDRBEJK-VAWYXSNFSA-N diphenyl (e)-but-2-enedioate Chemical compound C=1C=CC=CC=1OC(=O)/C=C/C(=O)OC1=CC=CC=C1 WTIFDVLCDRBEJK-VAWYXSNFSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical group O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- DYUMLJSJISTVPV-UHFFFAOYSA-N phenyl propanoate Chemical compound CCC(=O)OC1=CC=CC=C1 DYUMLJSJISTVPV-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000005630 sialyl group Chemical group 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、湿し水不要平版印刷版材料に関し、詳しくは
印刷物に汚れのな゛い湿し水不要平版印刷版材料に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a lithographic printing plate material that does not require dampening water, and more particularly to a lithographic printing plate material that does not require dampening water and does not cause stains on printed matter.
[従来の技術]
従来、支持体上に感光層、シリコーンゴム層を順に有す
る湿し水不要平版印刷版材料を用い、該材料に露光現像
することにより、画線部のシリコーンゴム層又はシリコ
ーンゴム層と感光層の全部を剥離することにより、画像
を形成して刷版を製造している。[Prior Art] Conventionally, a lithographic printing plate material that does not require dampening water and has a photosensitive layer and a silicone rubber layer on a support in that order is used, and by exposing and developing the material, the silicone rubber layer or silicone rubber in the image area is removed. By peeling off all of the layers and the photosensitive layer, an image is formed and a printing plate is manufactured.
従来の湿し水不要平版印刷版材料に用いられる感光層と
しては、■光重合タイプ、■ジアゾ樹脂タイプ、■光二
量化タイプのもの等が知られている。■の光重合タイプ
のものは、ビニル基を含むモノマーの光重合を利用する
もので、活性光により千ツマ−を直接もしくは、開始剤
を用いて間接に励起し、光重合させるものである。この
タイプを用いると露光部は重合により不溶化し、未露光
部は溶媒により溶出除去される。■のジアゾ樹脂タイプ
のものとしては1例えば4−ジアゾ−1,1′−ジフェ
ニルアミン塩化物の塩化亜鉛複塩とバラホルムアルデヒ
ドを縮合させて得られたジアゾ樹脂を用いたものが知ら
れている。このタイプを用いると露光によりジアゾ基が
光分解して親水性が失われるので水性の溶媒で現像する
と未露光部が除去される。■光二量化タイプのものとし
ては、光二量化反応により(2+2)型の付加反応をし
て四員環状の二量体を与える化合物のうち、感光性樹脂
として実用化されたものにはケイ皮酸およびシンナミリ
デン酢酸が知られている。このタイプを用いると未露光
部は溶媒により溶出除去される。As photosensitive layers used in conventional lithographic printing plate materials that do not require dampening water, there are 1) photopolymerization type, 2) diazo resin type, and 2) photodimerization type. The photopolymerization type (2) utilizes photopolymerization of a monomer containing a vinyl group, and the photopolymerization is carried out by exciting the monomer directly with active light or indirectly using an initiator. When this type is used, exposed areas are made insolubilized by polymerization, and unexposed areas are eluted and removed by a solvent. As the diazo resin type (1), for example, one using a diazo resin obtained by condensing zinc chloride double salt of 4-diazo-1,1'-diphenylamine chloride and paraformaldehyde is known. When this type is used, the diazo group is photodecomposed by exposure and hydrophilicity is lost, so the unexposed areas are removed when developed with an aqueous solvent. ■As photodimerization type compounds, among the compounds that undergo a (2+2) type addition reaction and give a four-membered cyclic dimer through a photodimerization reaction, those that have been put to practical use as photosensitive resins include cinnamic acid. and cinnamylidene acetic acid are known. When this type is used, the unexposed area is eluted and removed by a solvent.
[発明が解決しようとする問題点]
しかし、従来の■〜■タイプの感光層は、何れもシリコ
ーンゴム暦との接着性が劣り、画像汚れを生じるという
欠点があった。[Problems to be Solved by the Invention] However, all of the conventional photosensitive layers of types (1) to (3) have the disadvantage of poor adhesion to silicone rubber, resulting in image staining.
[発明の目的コ
そこで本発明の目的は、接着性に優れた画像汚れのない
湿し水不要平版印刷版材料を提供することにある。[Object of the Invention] Therefore, an object of the present invention is to provide a lithographic printing plate material which has excellent adhesion and does not cause image stains and does not require dampening water.
[問題点を解決するための手段]
本発明者は、上記目的を達成すべく鋭意検討の結果、本
発明に至った。[Means for Solving the Problems] The inventor of the present invention has conducted intensive studies to achieve the above object, and as a result, has arrived at the present invention.
即ち1本発明に係る湿し水不要平版印刷版材料(以下、
湿し水不要版材または単に版材という)は、支持体上に
感光層及びインキ反撥性物質含有層を有する湿し水不要
平版印刷版材料において。Namely, 1. the dampening water-free lithographic printing plate material according to the present invention (hereinafter referred to as
A dampening water-free lithographic printing plate material (also referred to simply as a plate material) is a lithographic printing plate material that does not require dampening water and has a photosensitive layer and an ink-repellent material-containing layer on a support.
上記感光層が下記−儀式[I]及び/又は[■]で表わ
される化合物及び該化合物と反応し得るポリマー又はプ
レポリマーを含有する光架橋型であることを特徴とする
。The above-mentioned photosensitive layer is characterized in that it is a photocrosslinkable type containing a compound represented by formula [I] and/or [■] below and a polymer or prepolymer that can react with the compound.
[式中、 R+及びR2はそれぞれ置換基を有してもよ
い炭素数2〜30のアルキル基、アリール基又はアラル
キル基を表し1両者は同一でも異なってもよい、]
一般式[II ]
[式中、R3はそれぞれ置換基を有してもよいアルキル
基、フェニル基又はナフチル基を表す、]本発明におい
て一般式[I]で表されるフマル酸エステル化合物とし
ては1例えばフマル酸ジエチルエステル、フマル酸ジブ
チルエステル、フマル酸ジオクチルエステル、フマル酸
ジステアリルエステル、フマル酸ブチルオクチルエステ
ル、フマル酸ジフェニルエステル、フマル酸ジベンジル
エステル、フマル酸ビス(3−フェニルプロピル)エス
テル、フマル酸ジラウリルエステル、フマル酸ジベヘニ
ルエステル等を挙げることがきるが、これらに限定され
るものではない、これらは単独で用いてもよいし29以
上を組合せて用いてもよい。[In the formula, R+ and R2 each represent an alkyl group, an aryl group, or an aralkyl group having 2 to 30 carbon atoms which may have a substituent, and both may be the same or different.] General formula [II] In the formula, R3 represents an alkyl group, a phenyl group, or a naphthyl group, each of which may have a substituent. In the present invention, examples of the fumaric acid ester compound represented by the general formula [I] include 1, for example, fumaric acid diethyl ester. , dibutyl fumarate ester, dioctyl fumarate ester, distearyl fumarate, butyl octyl fumarate, diphenyl fumarate, dibenzyl fumarate ester, bis(3-phenylpropyl) fumarate ester, dilauryl fumarate ester , fumaric acid dibehenyl ester, etc., but are not limited to these. These may be used alone or in combination of 29 or more.
本発明において一般式[■]で表されるマレイミド化合
物としては、R3が炭素数1〜22の直鎖枝分れもしく
は環状のアルキル基、炭素数1〜6の直鎖もしくは枝分
れ状アルキル基、又はハロゲン原子で核置換もしくは非
置換のフェニル基もしくはナフチル基であるものが挙げ
られ、また炭素数1〜6のアルキル基にフェニル基が置
換した形のアラルキル基等でNf11換されたマレイミ
ド、又は炭素数1〜12のアルキレン基、フェニレン基
、ビフェニレン基、1.6−ヘキサメチレンビフェニレ
ン基、メチレンビフェニレン基、2.2−ジフェニレン
プロパン基等の二価の炭化水素残基に2つのマレイミド
基がNの位置て結合した形のマレイミド化合物等が挙げ
られる。In the present invention, as a maleimide compound represented by the general formula [■], R3 is a straight chain branched or cyclic alkyl group having 1 to 22 carbon atoms, a straight chain or branched alkyl group having 1 to 6 carbon atoms, or a phenyl group or naphthyl group substituted or unsubstituted with a halogen atom, and a maleimide substituted with Nf11, such as an aralkyl group in which an alkyl group having 1 to 6 carbon atoms is substituted with a phenyl group. , or a divalent hydrocarbon residue such as an alkylene group having 1 to 12 carbon atoms, a phenylene group, a biphenylene group, a 1,6-hexamethylenebiphenylene group, a methylenebiphenylene group, a 2,2-diphenylenepropane group, etc. Examples include maleimide compounds in which a maleimide group is bonded at the N position.
この具体例としてはN−メチルマレイミド、N−エチル
マレイミド、N−プロピルマレイミド、ドブチルマレイ
ミド、N−ベゾチルマレイミト、トn−へキシルマレイ
ミド、N−シクロへキシルマレイミド。Specific examples include N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, dobutylmaleimide, N-bezotylmaleimide, n-hexylmaleimide, and N-cyclohexylmaleimide.
N−n−オクチルマレイミド、N−2−エチルへキシル
マレイミド、N−n−デシルマレイミド、トラウリルマ
レイミド、N−ステアリルマレイミド、N−ベヘニルマ
レイミド、N−フェニルマレイミド、トクロルフェニル
マレイミド、N7)リルマレイミド、N−キシリルマレ
イミド、N−ベンジルマレイミド、N−(6−フェニル
ヘキシル)マレイミド、メチレンビスマレイミド、エチ
レンビスマレイミド、トリメチレンビスマレイミド、ヘ
キサメチレンビスマレイミド、デカメチレンビスマレイ
ミド、ドデカメチレンビスマレイミド、フェニレンビス
マレイミF、 2.2−ジフェニレンプロ・パンビスマ
レイミド、ジフェニレンメタンビスマレイミド、N−(
4〜ヒドロキシフエニル)マレイミド等が挙げられ、好
ましくはアルキル基の炭素数6〜22のトアルキルマレ
イミド、N−フェニルマレイミド、N−ベンジルマレイ
ミド、 N−(4−ヒドロキシフェニル)マレイミドが
挙げられ、より好ましくはN−(4−ヒドロキシフェニ
ル)マレイミドが挙げられる。N-n-octylmaleimide, N-2-ethylhexylmaleimide, N-n-decylmaleimide, traurylmaleimide, N-stearylmaleimide, N-behenylmaleimide, N-phenylmaleimide, tochlorphenylmaleimide, N7) Ryl Maleimide, N-xylylmaleimide, N-benzylmaleimide, N-(6-phenylhexyl)maleimide, methylene bismaleimide, ethylene bismaleimide, trimethylene bismaleimide, hexamethylene bismaleimide, decamethylene bismaleimide, dodecamethylene bismaleimide , phenylene bismaleimide F, 2.2-diphenylenepropanbismaleimide, diphenylenemethane bismaleimide, N-(
4-hydroxyphenyl)maleimide and the like, preferably toalkylmaleimide, N-phenylmaleimide, N-benzylmaleimide, and N-(4-hydroxyphenyl)maleimide in which the alkyl group has 6 to 22 carbon atoms, More preferred is N-(4-hydroxyphenyl)maleimide.
本発明の感光層には、上記−儀式[工]又は−儀式[r
I]で表される化合物の中から1種又は2種以上を選択
使用できる。The photosensitive layer of the present invention includes the above-mentioned -ritual [work] or -ritual [r].
One or more of the compounds represented by [I] can be selected and used.
本発明においては一般式[I]と一般式[rl]で表さ
れる化合物をMi合使用することが好ましい。In the present invention, it is preferable to use compounds represented by general formula [I] and general formula [rl] in combination with Mi.
−儀式[I]又は−儀式[+1]で表される化合物の添
加量は5〜80重量%、好ましくはlO〜40重州%で
ある。The amount of the compound represented by -ritual [I] or -ritual [+1] is 5 to 80% by weight, preferably 10 to 40% by weight.
本発明において一般式[I]又は[■1で表される化合
物と反応し得るポリマー又はプレポリマーとしては、そ
の分子中の主鎖、末端あるいは側鎖に一般式[I]又は
[II]で表される化合物と反応し得る炭素−炭素不飽
和基を宥するポリマー又はプレポリマーが用いられる。In the present invention, the polymer or prepolymer that can react with the compound represented by the general formula [I] or [■1] has the general formula [I] or [II] in the main chain, terminal or side chain of the molecule. Polymers or prepolymers are used that contain carbon-carbon unsaturation capable of reacting with the represented compounds.
[具体例]
(i)末端或いは側鎖に不飽和基を有するエポキシ樹脂
例えば
(i−1)
エポキシ樹脂のアクリル酸エステル(n=1のものはビ
スフェノールA−ジグリシジルエーテルジアクリラート
)で、プレポリマーであるす)。[Specific examples] (i) Epoxy resin having an unsaturated group at the terminal or side chain, for example (i-1) Acrylic acid ester of epoxy resin (n=1 is bisphenol A-diglycidyl ether diacrylate), (prepolymer).
(i−2)
エポキシ樹脂とアクリル酸とメチルテトラヒドロフタル
酸無水物とから作られたエポキシアクリラート、
(j−3)
GHz−CHCOOCHtCIls + Epo +
C)I2CIIJCOCII=CIIgエポキシ樹脂に
2−ヒドロキシエチルアクリラートを反応させたもの、
(ト4)
(i−1)に無水マレイン酸を反応させたもの、(i−
5)
→ +EpO+(:1ICIl□0COCIl=CH2
0COCR=C1lz
エポキシ樹脂に無水アクリル酸を反応させて末端に2つ
の不飽和基を同時にエステル化させたもの。(i-2) Epoxy acrylate made from epoxy resin, acrylic acid, and methyltetrahydrophthalic anhydride, (j-3) GHz-CHCOOCHtCIls + Epo +
C) I2CIIJCOCII=CIIg Epoxy resin reacted with 2-hydroxyethyl acrylate, (T4) (i-1) reacted with maleic anhydride, (i-
5) → +EpO+(:1ICIl□0COCIl=CH2
0COCR=C1lz An epoxy resin reacted with acrylic anhydride to simultaneously esterify two unsaturated groups at the terminals.
(i−6)
(i−1)にグリシジルメタクリラートやへロゲン含有
二塩基性カルボン酸を反応させたもの。(i-6) A product obtained by reacting (i-1) with glycidyl methacrylate or a dibasic carboxylic acid containing halogen.
(i−7)
エポキシ樹脂にブチルアミンとグリシジルメタクリラー
トとを反応させたもの、
(i−8)
エポキシ樹脂のジグリシジルエーテルにジアリルアミン
を反応させたもの。(i-7) A product obtained by reacting an epoxy resin with butylamine and glycidyl methacrylate. (i-8) A product obtained by reacting a diglycidyl ether of an epoxy resin with diallylamine.
(i−9)
(i−])を]N−メチロールアクリルアミでエーテル
化したもの
(ii)主鎖、側鎖或いは末端に不悠和結合を有するポ
リエステル
例えば
(ii−1)
(ii−2)
(ii−3)
(ii−4)
(ii−5)
?H3
←+CH2CHz0九C0CH=CHCOO+、CH2
CHGH20COC−CH2H
(目i)末端に不飽和基を有するポリウレタン例えば
(iii−])
(iii−2)
(iii−3)
(iv)側鎖に不飽和基を有するポリビニルアルコール
例えば
(iシー1)
CIIJIICOCII’(:II。(i-9) Polyesters obtained by etherifying (i-]) with ]N-methylolacrylamide (ii) Polyesters having a perturbable bond in the main chain, side chain, or terminal, e.g. (ii-1) (ii-2 ) (ii-3) (ii-4) (ii-5) ? H3 ←+CH2CHz09C0CH=CHCOO+, CH2
CHGH20COC-CH2H (I) Polyurethane having an unsaturated group at the end, e.g. (iii-]) (iii-2) (iii-3) (iv) Polyvinyl alcohol having an unsaturated group at the side chain, e.g. (i-1) CIIJIIICOCII'(:II.
(iv−2) +C11□−C11+ (iv−3) +ClLa−Cl+)−+CHt−CI++l− などで好ましくはエポキシ樹脂が用いられる。(iv-2) +C11□-C11+ (iv-3) +ClLa-Cl+)-+CHt-CI++l- Epoxy resin is preferably used.
本発明の感光層に有効な光重合開始剤としては、ベンゾ
フェノン、ミヒラーケトン、ベンゾイン、ベンゾインメ
チルエーテル、ベンゾインエチルエーテル、ベンゾイン
イソプロピルエーテル、ベンゾインイソブチルエーテル
、α−メチロールベンゾイン、α−メチロールベンゾイ
ンイソメチルエーテル、α−メトキシベンゾインエーテ
ル、ベンゾインフェニルエーテル、α−t−ブチルベン
ゾイン、2.2−ジメトキシフェニルアセトフェノン、
2.2−ジェトキシフェニルアセトフェノン、2.2−
ジェトキシアセトフェノン、ベンジル、ビハロイン、ア
ンスラキノン、ベンズアンスラキノン、2−エチルアン
スラキノン、2−クロルアンスラキノン等を例として挙
げることがてきる。このような光重合開始剤は重合有効
量すなわち少なくとも0.01重量%以上添加されるの
が好ましく、一般には0.1〜lO重量%の範囲で添加
されるのか好ましい。Photopolymerization initiators useful in the photosensitive layer of the present invention include benzophenone, Michler's ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, α-methylolbenzoin, α-methylolbenzoin isomethyl ether, α-methoxybenzoin ether, benzoin phenyl ether, α-t-butylbenzoin, 2,2-dimethoxyphenylacetophenone,
2.2-jethoxyphenylacetophenone, 2.2-
Examples include jetoxyacetophenone, benzyl, bihaloin, anthraquinone, benzanthraquinone, 2-ethylanthraquinone, and 2-chloroanthraquinone. Such a photopolymerization initiator is preferably added in an effective amount for polymerization, that is, at least 0.01% by weight, and generally preferably in a range of 0.1 to 10% by weight.
本発明の感光層は0.001〜2Tf1量%の熱重合防
止剤を含むことができる。この熱重合防止剤としては1
例えば2,6−ジーt−ブチル−p−クレゾール、p−
メトキシフェノール、ベジタエリスリトールテトラキス
(3−(:l ” 、5−−ジ−t−ブチル−4′−ヒ
ドロキシ)フェニルプロピオネート)、ヒドロキノン、
t−フチルカテコール、t−ブチルヒドロキシアニソー
ル、 4.4′−ツチリデンビス(3−メチル−6−t
−ブチル)フェノール等を挙げることができる。The photosensitive layer of the present invention may contain a thermal polymerization inhibitor of 1% by weight of 0.001 to 2Tf. As this thermal polymerization inhibitor, 1
For example, 2,6-di-t-butyl-p-cresol, p-
Methoxyphenol, Vegetaerythritol Tetrakis (3-(:l'', 5--di-t-butyl-4'-hydroxy)phenylpropionate), Hydroquinone,
t-phthylcatechol, t-butylhydroxyanisole, 4,4'-thulydenbis(3-methyl-6-t
-butyl) phenol, etc.
本発明に用いられるインキ反撥性物質含有層は、次のよ
うなくり返し単位を有する分子量数千〜数十刃の線状有
機ポリシロキサンを主成分とすることか好ましい。The ink-repellent material-containing layer used in the present invention preferably has as a main component a linear organic polysiloxane having the following repeating unit and having a molecular weight of several thousand to several tens of blades.
ここでRは)欠素数1〜10のアルキル基、アルケニル
基あるいはフェニル基であるか、Rが60%以上かメチ
ル基であるものが好ましい。このような線状有機ポリシ
ロキサンは、反応性の架橋剤を添加して架橋しシリコー
ンゴムとするのが一般的である。いわゆる室温(低温)
硬化型シリコーンゴムに使われる架橋剤としては、珪素
原子に結合した一価の有機基を有するかまたは有しない
アセトキシシラン、ケトオキシム、シラン、アミノキシ
シラン、アミドシラン、アルコキシシラン、ヒドロキシ
シラン等のシランや、これ等の低重合度縮合物であるシ
ロキサン類、オルガノ−ハイドロジエンポリシロキサン
等がある。また感光層/シリコーンゴム層の接着力を向
上させ、長期間経時後も層間接着力の低下を防ぐべくア
リルイソシアヌレート基を有する反応性シラン化合物、
アミノアルキル基を有する反応性シラン化合物等をシリ
コーンゴム組成物中に添加する場合もある。Here, R is preferably an alkyl group, an alkenyl group, or a phenyl group having 1 to 10 atomic atoms, or one in which R is 60% or more or a methyl group. Such linear organic polysiloxanes are generally crosslinked by adding a reactive crosslinking agent to form silicone rubber. So-called room temperature (low temperature)
Crosslinking agents used in curable silicone rubber include silanes such as acetoxysilane, ketoxime, silane, aminoxysilane, amidosilane, alkoxysilane, and hydroxysilane, which may or may not have a monovalent organic group bonded to a silicon atom. , siloxanes which are low polymerization degree condensates of these, organo-hydrodiene polysiloxanes, etc. In addition, in order to improve the adhesion between the photosensitive layer and the silicone rubber layer and prevent the interlayer adhesion from decreasing even after a long period of time, a reactive silane compound having an allyl isocyanurate group,
A reactive silane compound having an aminoalkyl group or the like may be added to the silicone rubber composition.
シリコーンゴム層中に含まれる上記反応性架橋剤及び/
又は反応性シラン化合物の添加量は、好ましくは0.0
5〜lO%、より好ましくは0.1〜5%が選ばれる。The above reactive crosslinking agent and/or contained in the silicone rubber layer
Or the amount of reactive silane compound added is preferably 0.0
5-10%, more preferably 0.1-5% is selected.
又これら接着成分同士を混合して用いることもできる。Moreover, these adhesive components can also be used in combination.
またシリコーンゴム層には、更に触媒として少量の有機
スズ化合物が添加されるのが一般的である。Furthermore, a small amount of an organic tin compound is generally added to the silicone rubber layer as a catalyst.
本発明に用いられる支持体としては、通常の平版印刷機
にセットできるたわみ性と印刷時に加わる荷重に耐えう
るちのが好ましい0代表的なものとしてはアルミニウム
、亜鉛、銅、鋼等の金属板、及びクロム、亜鉛、銅、ニ
ッケル、アルミニウム及び鉄等がメツキ又は蒸着された
金属板。The support used in the present invention preferably has the flexibility to be set in a normal lithographic printing machine and the ability to withstand the load applied during printing. Typical examples include metal plates such as aluminum, zinc, copper, and steel; and metal plates plated or vapor-deposited with chromium, zinc, copper, nickel, aluminum, iron, etc.
紙、プラスチックフィルム及びガラス板、樹脂コート紙
、アルミニウム等の金属箔がが張られた紙、親木化処理
したプラスチックフィルム等が挙げられる。これらのう
ち好ましいのはアルミニウム板である。アルミニウム板
を使用する場合、公知の砂目立て処理、陽極酸化処理及
び必要に応じて封孔処理等の表面処理が施されていても
よい°、なおこれらの支持体上にハレーション防止その
他の目的でさらにコーティングを施してもよい。Examples include paper, plastic films and glass plates, resin-coated paper, paper covered with metal foil such as aluminum, and plastic films treated with wood-protecting treatments. Among these, aluminum plates are preferred. When using an aluminum plate, it may be subjected to known surface treatments such as graining, anodizing, and sealing as needed. Further coating may be applied.
本発明に用いられる版材を構成する各層の厚さは、支持
体は50〜400pmが好ましく、より好ましくは 1
00〜300pmであり、感光層は0.05〜10ルm
が好ましく、より好ましくは0.2〜5pLmであり、
インキ反撥性物質含有層は0.5〜100終mが好まし
く、より好ましくは1〜10IL+*である。The thickness of each layer constituting the plate material used in the present invention is preferably 50 to 400 pm, more preferably 1
00-300pm, and the photosensitive layer is 0.05-10 lm
is preferable, more preferably 0.2 to 5 pLm,
The ink-repellent substance-containing layer preferably has a thickness of 0.5 to 100 IL, more preferably 1 to 10 IL+*.
本発明において、支持体と感光層の間には接着剤層(プ
ライマー層)を有していてもよい0本発明で使用するプ
ライマー層は、次の条件を満たすことが好ましい、即ち
、支持体と感光層とをよく接着し、経時において安定で
あること、さらに、露光、現像してプライマー層が露出
するためよくインキを受容し、かつ現像液の溶剤に対す
る耐溶剤性がよいこと、である。In the present invention, an adhesive layer (primer layer) may be provided between the support and the photosensitive layer. The primer layer used in the present invention preferably satisfies the following conditions. and the photosensitive layer, and is stable over time. Furthermore, since the primer layer is exposed by exposure and development, it receives ink well, and has good solvent resistance to the solvent of the developer. .
この様の条件を満たすものとして、エポキシ樹脂、ポリ
ウレタン樹脂を適当な硬化剤を用いて加熱硬化させたも
のが例示される。また、光二量化型硬化剤樹脂からなる
居を光硬化させたものも使用できるが、なかでもエポキ
シ樹脂が好ましい。Examples of materials that satisfy these conditions include epoxy resins and polyurethane resins that are heat-cured using a suitable curing agent. Further, a photocured resin made of a photodimerizable curing agent resin can also be used, but epoxy resins are particularly preferred.
本発明のプライマー層に使用されるエポキシ樹脂の代表
例は、下記のようなものである。Typical examples of epoxy resins used in the primer layer of the present invention are as follows.
(1)ビスフェノールAとエピクロルヒドリンとの反応
生成物
(2)ノボラック樹脂とエピクロルヒドリンとの反応生
I&物
(3)ビスフェノールFとエピクロルヒドリンとの反応
生成物
(4)テトラブロモビスフェノールAとエピクロルヒド
リンとの反応生成物
(5)環式脂肪族エポキシ樹脂(シクロヘキセンオキサ
イド基、トリシクロヘキセンオキサイド基、シクロペン
テンオキサイド基を有する化合物)
(6)グリシジルエステル系エポキシ樹脂(多価カルボ
ン酸とエピクロルヒドリンとの反応生成物)
(7)グリシジルアミン系エポキシ樹脂(アミンとエピ
クロルヒドリンとの反応生成物)
(8)複素環式エポキシ樹脂(ヒダントイン環をグリシ
ジル化したヒダントイン型エポキシ樹脂及びトリアジン
環を有するトリグリシジルイソシアヌレート)
エポキシ樹脂としては、この他にも、公知のエポキシ樹
脂すなわち分子当り少なくとも平均1個以上のエポキシ
基を有するものであれば何でも使用できるが、特に好ま
しいものは、(1)に示したビスフェノールA系エポキ
シ樹脂である。−儀式は下記の通ってあり、種々のエポ
キシ当量のものがあるが、エポキシ当量180〜400
0のものが好ましい。(1) Reaction product between bisphenol A and epichlorohydrin (2) Reaction product I and product between novolak resin and epichlorohydrin (3) Reaction product between bisphenol F and epichlorohydrin (4) Reaction product between tetrabromobisphenol A and epichlorohydrin Product (5) Cycloaliphatic epoxy resin (compound having a cyclohexene oxide group, tricyclohexene oxide group, or cyclopentene oxide group) (6) Glycidyl ester-based epoxy resin (reaction product of polyhydric carboxylic acid and epichlorohydrin) (7 ) Glycidylamine-based epoxy resin (reaction product of amine and epichlorohydrin) (8) Heterocyclic epoxy resin (hydantoin-type epoxy resin with glycidylated hydantoin ring and triglycidyl isocyanurate with triazine ring) As the epoxy resin, In addition, any known epoxy resin, ie, one having an average of at least one epoxy group per molecule, can be used, but particularly preferred is the bisphenol A-based epoxy resin shown in (1). -The ceremony is as follows, and there are various epoxy equivalents, but the epoxy equivalent is 180 to 400.
0 is preferred.
上記エポキシ樹脂の硬化剤としては、脂肪族ポリアミン
、芳香族ポリアミン、ポリアミドアミン、ポリメルカプ
タン、酸無水物および三級アミンが有効であるが、中で
も酸無水物を硬化剤とし、三級アミンを硬化促進剤とし
て用いたものて最も有効である。As curing agents for the above epoxy resin, aliphatic polyamines, aromatic polyamines, polyamide amines, polymercaptans, acid anhydrides, and tertiary amines are effective.Among them, acid anhydrides are used as curing agents, and tertiary amines are used to cure It is most effective when used as a promoter.
酸無水物硬化剤の添加量は、エポキシ樹脂に対し2〜1
00重量%(以下、%と略称する。)の範囲である。特
に好ましい範囲は、使用するエポキシ樹脂および酸無水
物の種類により異なるが、1例として、エポキシ当量5
00のエポキシ樹脂と無水酸当量150の酸無水物を使
用した場合は、10〜50%となる。The amount of acid anhydride curing agent added is 2 to 1 per epoxy resin.
00% by weight (hereinafter abbreviated as %). A particularly preferable range varies depending on the type of epoxy resin and acid anhydride used, but as an example, an epoxy equivalent of 5
When using an epoxy resin of 0.00 and an acid anhydride with an acid anhydride equivalent of 150, it is 10 to 50%.
硬化促進剤として用いる三級アミン化合物の添加量はエ
ポキシ樹脂に対し0.5〜30%、特に好ましくは5〜
20%の範囲である。The amount of the tertiary amine compound used as a curing accelerator is 0.5 to 30%, particularly preferably 5 to 30%, based on the epoxy resin.
It is in the range of 20%.
上述のようなエポキシ樹脂、酸無水物および三級アミン
化合物は適当な有機溶剤に溶解して、支持体上に塗布し
た後、80〜150”Cの温度で加熱硬化する。The above-mentioned epoxy resin, acid anhydride, and tertiary amine compound are dissolved in a suitable organic solvent, coated on a support, and then cured by heating at a temperature of 80 to 150''C.
なおこのプライマー層には、必要に応じ酸化チタン等の
充填剤、あるいはハレーション防止剤、また焼き出し性
付与のための染料や酸発生剤を適宜混合して使用するこ
ともてきる。In this primer layer, if necessary, a filler such as titanium oxide, an antihalation agent, a dye or an acid generator for imparting print-out properties may be appropriately mixed and used.
上記プライマー層の厚みは0.1ルl〜100 ALm
か好ましく、より好ましくは1.OJLm〜15#Lm
である。The thickness of the above primer layer is 0.1 l~100 alm
1. is preferable, more preferably 1. OJLm~15#Lm
It is.
尚、インキ反撥性物質含有層の上面には必要に応じて保
護層を有していてもよい。Note that a protective layer may be provided on the upper surface of the ink-repellent material-containing layer, if necessary.
以上説明した湿し水不要版材は、例えば次のようにして
製造される。The dampening water-free plate material described above is manufactured, for example, as follows.
支持体上に、リバースロールコータ、エアーナイフコー
タ、メーヤハーコータなどの通常のコータあるいはホエ
ラーのような回転塗布装置を用い、感光層を構成すべき
組成物溶液を塗布乾燥および必要に応じて熱キユア後、
必要ならば該感光層のうえに同様な方法で接着層を塗布
、乾燥後。A composition solution to form a photosensitive layer is coated onto the support using a conventional coater such as a reverse roll coater, an air knife coater, a Meyer coater, or a rotary coater such as a Whaler. After drying and, if necessary, heat curing. ,
If necessary, apply an adhesive layer on the photosensitive layer in the same manner, and after drying.
シリコーンゴム溶液を接着層上に同様の方法で塗布し、
通常100〜120°Cの温度で数分間熱処理して、十
分に硬化せしめてインキ反撥性物質含有層(シリコーン
ゴム層)を形成する。必要に応じ該シリコーンゴム層上
にラミネーター等を用いて保護フィルムを設けることか
できる。Apply the silicone rubber solution onto the adhesive layer in the same way,
The ink-repellent material-containing layer (silicone rubber layer) is formed by heat treatment, usually at a temperature of 100 to 120° C. for several minutes, to fully cure the ink-repellent material. If necessary, a protective film can be provided on the silicone rubber layer using a laminator or the like.
以上のようにして得られた版材を用いて刷版な得るには
、原稿であるポジフィルムを版材表面に真空電着させ、
露光する。この露光用の光源は、紫外線を豊富に発生す
る水銀灯、カーボンアーク灯、キセノンランプ、メタル
ハライドランプ、蛍光灯などが用いられる。露光によっ
て感光層に光不溶化部を形成する。次いて未露光部を溶
媒を用いて溶出除去して現像すると1画線部(凹部)を
形成する。To obtain a printing plate using the plate material obtained as described above, a positive film, which is an original, is vacuum electrodeposited on the surface of the plate material,
Expose. As a light source for this exposure, a mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a fluorescent lamp, etc., which generate abundant ultraviolet light, are used. A photo-insolubilized portion is formed in the photosensitive layer by exposure. Next, the unexposed area is eluted and removed using a solvent and developed to form one image area (concave area).
現像液としては湿し水不要版材の現像液として公知のも
のが使用てきる。例えば脂肪族炭化水素類(ヘキサン、
ヘプタン、′アイソパーE、H。As the developer, one known as a developer for plate materials that do not require dampening water can be used. For example, aliphatic hydrocarbons (hexane,
Heptane, 'Isopar E, H.
G”(エッソ化学製脂肪族炭化水素類の商品名)或はガ
ソリン、灯油等)、芳香族炭化水素類(トルエン、キシ
レン等)、或はハロゲン化炭化水素類(トリクレン等)
に下記の極性溶媒を添加したものが好適である。G” (trade name of aliphatic hydrocarbons manufactured by Esso Chemical) or gasoline, kerosene, etc.), aromatic hydrocarbons (toluene, xylene, etc.), or halogenated hydrocarbons (triclene, etc.)
It is preferable to add the following polar solvent to the above.
アルコール類(メタノール、エタノール、水等)
エーテル類(メチルセロソルブ、エチルセロソルブ、プ
チルセロソルフ、メチルカルピトール、エチルカルピト
ール、ブチルカルどトール、ジオキサン等)
ケトン類(アセトン、メチルエチルケトン等)エステル
類(酢酸エチル、メチルセロソルブアセテート、セロン
ルブアセテート、カルピトールアセテート等)
またクリスタルバイオレット、アストラゾンレッド等の
染料を現像液に加えて現像と同時に画像部の染色化を行
うこともできる。Alcohols (methanol, ethanol, water, etc.) Ethers (methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl calpitol, ethyl carpitol, butyl caldotol, dioxane, etc.) Ketones (acetone, methyl ethyl ketone, etc.) Esters (ethyl acetate, Methyl cellosolve acetate, selonlube acetate, carpitol acetate, etc.) It is also possible to dye the image area at the same time as development by adding a dye such as crystal violet or astrazone red to the developer.
現像は1例えば上記のような現像液を含む現像用パッド
でこすったり、現像液を版面に注いだ後に現像ブラシで
こする等、公知の方法で行うことができる。これにより
、画像部のシリコーンゴム層と感光層が除かれ、プライ
マー層の表面が露出し、その部分がインキ受容部となる
。Development can be carried out by a known method, such as rubbing with a developing pad containing a developer as described above, or pouring a developer onto the printing plate and then rubbing with a developing brush. As a result, the silicone rubber layer and photosensitive layer in the image area are removed, and the surface of the primer layer is exposed, which becomes an ink receiving area.
インキ受容部の深さは感光層とインキ反撥性物質含有層
の厚さ分だけであってもよいし、感光層もしくはインキ
反撥性物質含有層の厚さ分だけであってもよい。The depth of the ink receiving portion may be only the thickness of the photosensitive layer and the ink-repellent material-containing layer, or may be only the thickness of the photosensitive layer or the ink-repellent material-containing layer.
なお必要に応じて、インキ受容部(画線部)の深さを浅
くするためにインキ着肉性物質を該凹部内に埋め込むこ
とも好ましい。Note that, if necessary, it is also preferable to embed an ink receptive substance in the recess in order to reduce the depth of the ink receiving part (printing part).
[発明の効果]
本発明によれば、接着性に優れ、かつ画像汚れがない湿
し水不要平版印刷版材料を提供することができる。[Effects of the Invention] According to the present invention, it is possible to provide a lithographic printing plate material that does not require dampening water and has excellent adhesive properties and is free from image stains.
[実施例] 以下に実施例を挙げて本発明を更に詳説する。[Example] The present invention will be explained in further detail by giving examples below.
実施例 1
通常の方法で脱脂したスムースアルミニウム板上に乾燥
膜厚で2μmになるよう下記のプライマー層用組成物を
塗布し、 120’Oで5分間加熱硬化させた。Example 1 The following composition for a primer layer was applied to a smooth aluminum plate degreased in a conventional manner to a dry film thickness of 2 μm, and cured by heating at 120'O for 5 minutes.
エピコート1001 (シェル化学社製 100重量部
ビスフェノールA系エポキシ樹脂、
エポキシ当量450〜500)
メチルテトラヒドロ無水フタル酸 36重量部2.4
.8−)リス(ジメチルアミツメ 12重量部チル)
フェノール
メチルセロソルブアセテート 120mm部トル
エン 120重量部メチルエチ
ルケトン 120重量部塗布硬化させた
プライマー層は、現像液、あるいは感光層塗布用混合溶
剤(メチルエチルケトン/トルエン= 1/1重量部比
混合物)に浸漬しても溶解することはなかった。Epicoat 1001 (manufactured by Shell Chemical Co., Ltd. 100 parts by weight bisphenol A epoxy resin, epoxy equivalent 450-500) Methyltetrahydrophthalic anhydride 36 parts by weight 2.4
.. 8-) Squirrel (dimethyl amitume 12 parts by weight chill)
Phenol methyl cellosolve acetate 120 mm parts Toluene 120 parts Methyl ethyl ketone 120 parts by weight The cured primer layer can be immersed in a developer or a mixed solvent for photosensitive layer coating (methyl ethyl ketone/toluene = 1/1 parts by weight mixture). It never dissolved.
上記プライマー層を塗設したアルミニウム板上に、下記
の感光性組成物を乾燥膜厚で0.25 gtmになるよ
うに塗布し、乾燥した。On the aluminum plate coated with the primer layer, the following photosensitive composition was applied to a dry film thickness of 0.25 gtm and dried.
社製、リポキシVR−60)
N−ラウリルマレイミド 15重量部シー
2−エチルへキシルフマレート 15重量部2.2−
ジメトキシフェニルアセト 5重量部フェノン
メチルセロソルブ 1000重量部次に
、上記感光層に下記のシリコーンゴム組成物を乾燥膜厚
て2ル朧になるように塗布し、乾燥し、シリコーンゴム
硬化層を得た。Co., Ltd., Lipoxy VR-60) N-lauryl maleimide 15 parts by weight C2-ethylhexyl fumarate 15 parts by weight 2.2-
Dimethoxyphenylaceto 5 parts by weight Phenonemethyl cellosolve 1000 parts by weight Next, the following silicone rubber composition was applied to the photosensitive layer to a dry film thickness of 2 ml, and dried to obtain a cured silicone rubber layer. .
両末端に水酸基を有するジメチル 100重量部ポリシ
ロキサン(分子量 約100,000)両末端にトリメ
チルシリルノ、(を右 3 、5 屯’B”(:部ロキ
サン(分子量 約2,500)
1−メトキシシリルプロピル−3,5−3,:1重量部
シアリルイソシアヌレート
ジブチル錫ジオクタノエート3.3重量部アイソパーG
(エッソ化学社製) 1500重量部上記のようにし
て得られたシリコーンゴム層の表面に厚さ+2pa+の
片面マット化ポリプロピレンフィルムをラミネートし、
湿し水不要版材を製造した。Dimethyl having hydroxyl groups at both ends 100 parts by weight Polysiloxane (molecular weight approximately 100,000) Trimethylsilyl at both ends, Propyl-3,5-3,: 1 part by weight sialyl isocyanurate dibutyltin dioctanoate 3.3 parts by weight Isopar G
(Manufactured by Esso Chemical Co., Ltd.) 1500 parts by weight A single-sided matted polypropylene film with a thickness of +2 pa+ was laminated on the surface of the silicone rubber layer obtained as above,
A plate material that does not require dampening water was manufactured.
現像液組成
アイソパーH(エッソ化学社製) 252!!量部
ツルフィツト(クラレイソブレン 25重量部ケミカ
ル社製)
メタノール 25重量部トルエ
ン 25重量部上記版材の上
面にポジフィルムを真空密着させてメタルハライドラン
プを用いて露光した0次いて上記現像液を用いて未露光
部の感光層とシリコーンゴム層を除去し、湿し水不要平
版印刷版を製造した。Developer composition Isopar H (manufactured by Esso Chemical Co., Ltd.) 252! ! Parts: Turfitz (Kuraray Sobrene, 25 parts by weight, manufactured by Chemical Co., Ltd.) Methanol: 25 parts by weight Toluene: 25 parts by weight A positive film was vacuum-adhered to the top surface of the above plate material and exposed using a metal halide lamp.Then, the above developer was used. The unexposed areas of the photosensitive layer and silicone rubber layer were removed to produce a lithographic printing plate that did not require dampening water.
これをハイデルベルグGTO印刷機に取り付は東洋イン
キ社製TKUアクワレスG紅インキにより印刷したとこ
ろ汚れのない印刷物が10,000枚得られた。This was attached to a Heidelberg GTO printing machine and printed using TKU Acwares G red ink manufactured by Toyo Ink Co., Ltd., and 10,000 clean prints were obtained.
実施例 2
実施例1のN−ラウリルマレイミドをN−(4−ヒドロ
キシフェニル)マレイミドに変更して同様にして湿し水
不要平版印刷版を得、同様に印刷したところ汚れのない
印刷物が20,000枚得られた。Example 2 A lithographic printing plate requiring no dampening water was obtained in the same manner as in Example 1 except that N-laurylmaleimide was changed to N-(4-hydroxyphenyl)maleimide, and printing was performed in the same manner. 000 pieces were obtained.
比較例
実施例1のN−ラウリルマレイミドとジー2−エチルへ
キシルフマレートをジエチレングリコールジアクリレー
トに変更した。Comparative Example N-laurylmaleimide and di-2-ethylhexyl fumarate in Example 1 were changed to diethylene glycol diacrylate.
3000枚で非画線部にキズが生じ、汚れが発生した。After 3,000 sheets, scratches and stains appeared in the non-image area.
実施例 3
実施例1においてN−ラウリルマレイミド又はジー2−
エチルへキシルフマレートのいずれか一方のみを用い、
添加量を30重量部とした以外は同様にして、湿し水不
要平版印刷版を得、同様に印刷したところ、いずれの場
合も実施例1より劣るが本発明の効果が確認された。Example 3 In Example 1, N-laurylmaleimide or di-2-
Using only one of ethylhexyl fumarate,
A lithographic printing plate without dampening water was obtained in the same manner except that the amount added was 30 parts by weight, and printing was carried out in the same manner. Although the results were inferior to Example 1 in each case, the effects of the present invention were confirmed.
特許出願人 コ ニ カ 株 式 会 社代 理 人
弁理士 坂口信昭Patent applicant Nobuaki Sakaguchi, agent of Konica Co., Ltd., patent attorney
Claims (1)
湿し水不要平版印刷版材料において、上記感光層が下記
一般式[ I ]及び/又は[II]で表わされる化合物及
び該化合物と反応し得るポリマー又はプレポリマーを含
有する光架橋型であることを特徴とする湿し水不要平版
印刷版材料。 一般式[ I ] ▲数式、化学式、表等があります▼ [式中、R_1及びR_2はそれぞれ置換基を有しても
よい炭素数2〜30のアルキル基、アリール基又はアラ
ルキル基を表し、両者は同一でも異なってもよい。] 一般式[II] ▲数式、化学式、表等があります▼ [式中、R_3はそれぞれ置換基を有してもよいアルキ
ル基、フェニル基又はナフチル基を表す。][Scope of Claims] A lithographic printing plate material that does not require dampening water and has a photosensitive layer and an ink-repellent material-containing layer on a support, wherein the photosensitive layer is represented by the following general formula [I] and/or [II]. A lithographic printing plate material that does not require dampening water and is a photocrosslinkable type material containing a compound and a polymer or prepolymer that can react with the compound. General formula [I] ▲ Numerical formulas, chemical formulas, tables, etc. may be the same or different. ] General formula [II] ▲ Numerical formulas, chemical formulas, tables, etc. are available ▼ [In the formula, R_3 represents an alkyl group, a phenyl group, or a naphthyl group, each of which may have a substituent. ]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63013337A JP2651687B2 (en) | 1988-01-22 | 1988-01-22 | Lithographic printing plate material that does not require dampening water |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63013337A JP2651687B2 (en) | 1988-01-22 | 1988-01-22 | Lithographic printing plate material that does not require dampening water |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01188851A true JPH01188851A (en) | 1989-07-28 |
JP2651687B2 JP2651687B2 (en) | 1997-09-10 |
Family
ID=11830314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63013337A Expired - Lifetime JP2651687B2 (en) | 1988-01-22 | 1988-01-22 | Lithographic printing plate material that does not require dampening water |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2651687B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002357899A (en) * | 2001-05-31 | 2002-12-13 | Mitsubishi Gas Chem Co Inc | Photosensitive resin composition |
JP2002357900A (en) * | 2001-05-31 | 2002-12-13 | Mitsubishi Gas Chem Co Inc | Photosensitive resin composition |
JP2008013772A (en) * | 1994-09-02 | 2008-01-24 | Quantum Materials Inc | Thermosetting resin composition containing maleimide and/or vinyl compound |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4944802A (en) * | 1972-09-07 | 1974-04-27 | ||
JPS49126407A (en) * | 1973-04-10 | 1974-12-04 | ||
JPS53127004A (en) * | 1977-04-11 | 1978-11-06 | Asahi Chemical Ind | Photosensitive elastomer composition |
JPS5548744A (en) * | 1978-10-02 | 1980-04-08 | Asahi Chem Ind Co Ltd | Photosensitive elastomer composition |
JPS57158229A (en) * | 1981-03-25 | 1982-09-30 | Nitto Electric Ind Co Ltd | Curable resin composition excellent in heat resistance |
JPS6250760A (en) * | 1985-08-29 | 1987-03-05 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate requiring no dampening water |
JPS62111254A (en) * | 1985-07-11 | 1987-05-22 | Fuji Photo Film Co Ltd | Dry photosensitive lithographic plate |
JPS62177559A (en) * | 1986-01-31 | 1987-08-04 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate without requiring damping water |
JPS62194255A (en) * | 1986-02-20 | 1987-08-26 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate without requiring damping water |
-
1988
- 1988-01-22 JP JP63013337A patent/JP2651687B2/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4944802A (en) * | 1972-09-07 | 1974-04-27 | ||
JPS49126407A (en) * | 1973-04-10 | 1974-12-04 | ||
JPS53127004A (en) * | 1977-04-11 | 1978-11-06 | Asahi Chemical Ind | Photosensitive elastomer composition |
JPS5548744A (en) * | 1978-10-02 | 1980-04-08 | Asahi Chem Ind Co Ltd | Photosensitive elastomer composition |
JPS57158229A (en) * | 1981-03-25 | 1982-09-30 | Nitto Electric Ind Co Ltd | Curable resin composition excellent in heat resistance |
JPS62111254A (en) * | 1985-07-11 | 1987-05-22 | Fuji Photo Film Co Ltd | Dry photosensitive lithographic plate |
JPS6250760A (en) * | 1985-08-29 | 1987-03-05 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate requiring no dampening water |
JPS62177559A (en) * | 1986-01-31 | 1987-08-04 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate without requiring damping water |
JPS62194255A (en) * | 1986-02-20 | 1987-08-26 | Fuji Photo Film Co Ltd | Photosensitive lithographic printing plate without requiring damping water |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008013772A (en) * | 1994-09-02 | 2008-01-24 | Quantum Materials Inc | Thermosetting resin composition containing maleimide and/or vinyl compound |
JP2002357899A (en) * | 2001-05-31 | 2002-12-13 | Mitsubishi Gas Chem Co Inc | Photosensitive resin composition |
JP2002357900A (en) * | 2001-05-31 | 2002-12-13 | Mitsubishi Gas Chem Co Inc | Photosensitive resin composition |
JP4545989B2 (en) * | 2001-05-31 | 2010-09-15 | 三菱瓦斯化学株式会社 | Photosensitive resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP2651687B2 (en) | 1997-09-10 |
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