JPH01186619A - Method and equipment for removing organic matter by decomposition - Google Patents
Method and equipment for removing organic matter by decompositionInfo
- Publication number
- JPH01186619A JPH01186619A JP62250207A JP25020787A JPH01186619A JP H01186619 A JPH01186619 A JP H01186619A JP 62250207 A JP62250207 A JP 62250207A JP 25020787 A JP25020787 A JP 25020787A JP H01186619 A JPH01186619 A JP H01186619A
- Authority
- JP
- Japan
- Prior art keywords
- ozone
- organic matter
- reaction chamber
- decomposition
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005416 organic matter Substances 0.000 title claims abstract description 28
- 238000000354 decomposition reaction Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 15
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000006243 chemical reaction Methods 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims description 16
- 230000003247 decreasing effect Effects 0.000 claims 1
- 150000002500 ions Chemical class 0.000 abstract description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 13
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 4
- 229910001882 dioxygen Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- SURLGNKAQXKNSP-DBLYXWCISA-N chlorin Chemical compound C\1=C/2\N/C(=C\C3=N/C(=C\C=4NC(/C=C\5/C=CC/1=N/5)=CC=4)/C=C3)/CC\2 SURLGNKAQXKNSP-DBLYXWCISA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004018 waxing Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は有機物担体上の有機物を該担体から分解除去す
る方法及び装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method and apparatus for decomposing and removing organic substances on an organic substance carrier from the carrier.
ｆ機物担体上から有機物をオゾン又は（オゾン及び紫外
線）にて分解除去する場合として、例えば、ダイオード
、トランジスタ、半導体ＩＣ等の半導体製品を作るにあ
たり、半導体ウェハに不純物を添加する場所や電極を設
ける場所等を形成するために、該ウェハ表面の酸化膜上
にホトレジスト（感光性有機物）膜を形成し、該ホトレ
ジスト上にパターン形成フィルムを配置し、その上から
露光して所定パターンを焼き付け、次いで現像処理し、
ホトレジストが無くなって露出した酸化膜部分をエツチ
ング処理で除去し、そのあと残ったホトレジストを加熱
下にオゾン又は（オゾン及び紫外線）にて除去する場合
を挙げることができる。f When organic substances are decomposed and removed from organic material carriers using ozone or (ozone and ultraviolet rays), for example, when manufacturing semiconductor products such as diodes, transistors, and semiconductor ICs, it is possible to remove impurities from places and electrodes on semiconductor wafers. In order to form a location, etc., a photoresist (photosensitive organic substance) film is formed on the oxide film on the wafer surface, a pattern forming film is placed on the photoresist, and a predetermined pattern is printed by exposing it from above. Then, it is developed,
An example of this is the case where the exposed oxide film portion with no photoresist is removed by etching, and then the remaining photoresist is removed with ozone or (ozone and ultraviolet rays) under heating.
このようなホトレジスト除去操作においては、ホトレジ
ストの分解除去終了の判断は時間の測定により行われて
いる。すなわち、ホトレジスト膜の厚みは予め分かって
おり、その厚みのホトレジスト分解に要するおよその時
間も実験等で予め分かっているので、完全を期するため
、その厚みのホトレジストが分解されるに要するであろ
う時間より多めの時間、分解除去操作を継続するのであ
る。In such a photoresist removal operation, the completion of decomposition and removal of the photoresist is determined by measuring time. In other words, the thickness of the photoresist film is known in advance, and the approximate time required for the photoresist of that thickness to decompose is also known in advance through experiments, so for completeness, we have calculated the time required for the photoresist of that thickness to be decomposed. The decomposition and removal operation is continued for a time longer than the waxing time.
しかしながら、このような有機物分解除去に消費される
時間は、実際のホトレジスト分解に要する時間より長い
ので、それだけ半導体製品の生産性が低下し、製品の数
が増えると、それは顕著となる。However, the time consumed for such decomposition and removal of organic matter is longer than the time required for actual photoresist decomposition, so the productivity of semiconductor products decreases, and this becomes more noticeable as the number of products increases.
残留ホトレジストをプラズマアッシャ−で燃やし、該燃
焼における色の変化を見て、ホトレジストの分解除去終
了を判断する方法も考えられるが、後にイオンが残留す
るという問題がある。A method of burning the remaining photoresist with a plasma asher and observing a change in color during the burning to determine whether the photoresist has been decomposed and removed can be considered, but there is a problem in that ions remain afterwards.
そこで本発明は、有機物担体上の有機物をオゾン又は（
オゾン及び紫外線）にて分解除去する場合において、時
間の無駄なく、また、残留イオン発生のおそれなく、該
有機物を分解除去できる方法及び装置を提供しようとす
るものである。Therefore, in the present invention, the organic matter on the organic matter carrier is removed by ozone or (
The purpose of the present invention is to provide a method and apparatus capable of decomposing and removing organic substances without wasting time and without fear of generating residual ions when decomposing and removing organic substances using ozone and ultraviolet rays.
すなわち本発明は、分解除去しようとする有機物を担っ
た有機物担体を密閉反応室内に配置し、該反応室ＣＯ２
濃度を測定しつつ該有機物をオゾン又は（オゾン及び紫
外線）により加熱下に分解し、前記ＣＯ１１度が予め定
めた値より低下したことをもって該有機物の分解除去が
終了したと判断することを特徴とする有機物分解除去方
法、並びに加熱手段を有する密閉可能な反応室、前記反
応室に接続されたオゾン発生器及び前記反応室に接続さ
れたＣ Ｏｚ濃度測定装置を備えたことを特徴とする有
機物分解除去装置を提供するものである。That is, in the present invention, an organic substance carrier carrying an organic substance to be decomposed and removed is placed in a closed reaction chamber, and CO2 in the reaction chamber is
The organic matter is decomposed under heating with ozone or (ozone and ultraviolet rays) while measuring the concentration, and it is determined that the decomposition and removal of the organic matter has been completed when the CO11 degree falls below a predetermined value. a method for decomposing and removing organic matter, comprising: a sealable reaction chamber having a heating means; an ozone generator connected to the reaction chamber; and a COz concentration measuring device connected to the reaction chamber. A removal device is provided.
以下、本発明の実施例方法及び該方法を実施する装置例
（第１図）を説明する。Hereinafter, an example method of the present invention and an example of an apparatus (FIG. 1) for implementing the method will be described.
該装置例によると、酸素ガスボンベ１に流量計２、無声
放電によるオゾン発生器３、密閉可能な反応室４、オゾ
ン分解器５及び排気管６を順次配管接続しである。According to this example of the apparatus, a flow meter 2, an ozone generator 3 using silent discharge, a sealable reaction chamber 4, an ozone decomposer 5, and an exhaust pipe 6 are connected to an oxygen gas cylinder 1 in sequence.
反応室４は図示しないヒータ加熱装置を有し、回転駆動
され得る物品支持台４１を備えている。The reaction chamber 4 has a heater heating device (not shown) and is equipped with an article support stand 41 that can be rotated.
この反応室には、必要に応じ、図示しない紫外線照射装
置を付設することができる。This reaction chamber may be provided with an ultraviolet irradiation device (not shown), if necessary.
オゾン発生器３と反応室４との間には窒素ガスボンベ７
が接続されており、また、反応室４とオゾン分解器５と
の間にはオゾン濃度測定器８、ＣＯ□濃度測定器９、オ
ゾン分解器１０及び排気用ポンプ１１が順次配管接続さ
れている。A nitrogen gas cylinder 7 is installed between the ozone generator 3 and the reaction chamber 4.
is connected, and between the reaction chamber 4 and the ozone decomposer 5, an ozone concentration measuring device 8, a CO□ concentration measuring device 9, an ozone decomposer 10, and an exhaust pump 11 are sequentially connected via piping. .
なお、一つの弁１２を除いて他は図示されていないが、
配管の要所要所には装置運転に必要な弁が設けられる。Note that except for one valve 12, the others are not shown,
Valves necessary for equipment operation are installed at important points in the piping.
前記ＣＯ□濃度測定器９の詳細は次のとおりである。The details of the CO□ concentration measuring device 9 are as follows.
（１）ベスト測器株式会社製、ＢＮＣＯ−２００（２）
検出方法 ＪＩＳによる非分散型赤外吸光法（３）測定
範囲 Ｏ〜約３０００ｐｐｍ（４）測定成分 ＣＯ。(1) Manufactured by Best Sokki Co., Ltd., BNCO-200 (2)
Detection method: Non-dispersive infrared absorption method according to JIS (3) Measurement range: O to approximately 3000 ppm (4) Measurement component: CO.
（５）再現性 ±１％ ／ＦＳ
（６）ドリフト ±３％ ／ＦＳ ／Ｈ（７）他ガスの
干渉 特になし
また、他の機器は次のとおりである。(5) Reproducibility ±1% /FS (6) Drift ±3% /FS /H (7) Interference with other gases None In addition, other equipment is as follows.
（１）オゾン発生器３ クロリンエンジニアズ■製（２
） ＣＯ□濃度記録計 日本電子科学■製（図示しなイ
） Ｕ−２２８−ＩＰ−００（３）オゾン濃度測定
器８ ダイレック■製ＭＯＤＬ １００６− ＡＨＪ
また、有機物分解除去処理条件は次のとおりである。(1) Ozone generator 3 Manufactured by Chlorin Engineers (2
) CO□ concentration recorder manufactured by JEOL Ltd. (A not shown) U-228-IP-00 (3) Ozone concentration measuring device 8 manufactured by Dylec ■ MODL 1006-AHJ In addition, the organic matter decomposition and removal treatment conditions are as follows. It is.
（１）有機物担体 表面にＳｉｎ、膜を有するシリコ
ンウェハ 直径５インチ（約
１２．７ｃｍ）
（２）有機物 ホトレジスト（東京応化工業■製
０ＦＰＲ８００）、
担体全面に厚み１．８μ
（３）支持台４１
のヒータ温度 約３００°Ｃ
（４）酸素ガス流量 約２００１７Ｈ
（５）オゾン濃度 ５〜７％
（６）反応時間 ３分
この条件での有機物分解除去手順は次のとおりである。(1) Organic material carrier Silicon wafer with a Sin film on the surface, diameter 5 inches (about 12.7 cm) (2) Organic material photoresist (0FPR800 manufactured by Tokyo Ohka Kogyo ■), thickness 1.8μ on the entire surface of the carrier (3) Support stand 41 Heater temperature: about 300°C (4) Oxygen gas flow rate: about 20017H (5) Ozone concentration: 5 to 7% (6) Reaction time: 3 minutes The procedure for decomposing and removing organic matter under these conditions is as follows.
また、当該分解除去操作中のｃｏ、１度の変化状態は、
図示しない前記ＣＯｔ濃度記録計により第２図のとおり
現れる。In addition, the state of change of co, 1 degree during the decomposition and removal operation is as follows:
It appears as shown in FIG. 2 by the COt concentration recorder (not shown).
■ 反応室４に酸素ガスを流し、ＣＯ□濃度測定器９の
零点を校正する。 。(2) Flow oxygen gas into the reaction chamber 4 and calibrate the zero point of the CO□ concentration measuring device 9. .
■酸素ガス供給を止め、弁１２を開き、ＣＯ□濃度測定
器９に大気を流し、スパンを校正する。■ Stop the oxygen gas supply, open the valve 12, let the atmosphere flow through the CO□ concentration measuring device 9, and calibrate the span.
（大気のＣＯ，濃度は約４００ｐｐｍである。）■反応
室４に再び酸素を流し、再度、零点を確認する。(The concentration of CO in the atmosphere is about 400 ppm.) - Flow oxygen into the reaction chamber 4 again and check the zero point again.
■オゾン発生器３を作動させ、反応室４にオゾンを流し
、再度、零点を確認する。また、オゾンを流しても測定
器９の指示に変化がないことを確認する。- Operate the ozone generator 3, flow ozone into the reaction chamber 4, and check the zero point again. Also, confirm that there is no change in the indication on the measuring device 9 even if ozone is supplied.
■ 反応室４の支持台４１上に有機物を担った担体１３
を載置して該反応室を密閉し、支持台４１を加熱すると
ともに該反応室にオゾンを流し、該反応室中のＣＯ□濃
度を測定器９で測定しつつ、担体１３上の有機物を分解
除去する。第２図から分かるように、有機物分解スター
ト時には約１６００ｐｐｍのＣＯ２が発生し、分解が進
むにつれてｃｏｔｅ度が低下する。ＣＯｔ濃度が予め定
めた値（スレッショルド値）約２００ｐｐｍより下回る
と、該有機物が完全に分解除去されたと判断する。■ A carrier 13 carrying an organic substance is placed on a support stand 41 in the reaction chamber 4.
The support stage 41 is heated, ozone is flowed into the reaction chamber, and the organic matter on the carrier 13 is measured while the CO□ concentration in the reaction chamber is measured with the measuring device 9. Decompose and remove. As can be seen from FIG. 2, about 1600 ppm of CO2 is generated at the start of organic substance decomposition, and as the decomposition progresses, the degree of cote decreases. When the COt concentration falls below a predetermined value (threshold value) of about 200 ppm, it is determined that the organic matter has been completely decomposed and removed.
■ そのあと反応室４を窒素ガスにてパージし、測定器
９の指示が零になることを確認する。(2) After that, purge the reaction chamber 4 with nitrogen gas and confirm that the reading on the measuring device 9 becomes zero.
■更に反応室にオゾンを流し、これによっても測定器９
の零点が実質上変わらないことを確認する。■Furthermore, ozone is flowed into the reaction chamber, which also causes the measuring device 9 to
Verify that the zero point of is virtually unchanged.
■弁１２を開き、測定器９に大気を流し、スパン値の再
現があることを確認する。■Open the valve 12, let air flow through the measuring device 9, and confirm that the span value is reproduced.
第２図において部分ＸではＣＯ□濃度が局部的に高くな
っているが、これは反応室内の支持台４１を回転させて
、分解むらを補正した結果である。In FIG. 2, the CO□ concentration is locally high in portion X, but this is the result of correcting uneven decomposition by rotating the support stand 41 in the reaction chamber.
前記各ステップにおいてはポンプ１１が運転される。In each step, the pump 11 is operated.
このように実施例方法によると、有機物担体上の有機物
除去を確実に、速やかに行うことができる。As described above, according to the method of the embodiment, the organic matter on the organic matter carrier can be removed reliably and quickly.
なお、本発明は前記実施例に限定されるものではない。Note that the present invention is not limited to the above embodiments.
例えば、ＣＯ□濃度のスレッショルド値は有機物の量、
種類等に応じて他の値に適当に定めることができる。ま
た、本発明は前記実施例分野だけでなく、有機物担体上
の有機物を分解しなければならない各種分野において採
用して有利である。For example, the threshold value for CO□ concentration is the amount of organic matter,
It can be appropriately set to other values depending on the type, etc. Furthermore, the present invention is advantageously applicable not only to the field of the above-mentioned embodiments but also to various fields in which organic matter on an organic matter carrier must be decomposed.
本発明によると、有機物担体上の有機物をオゾン又は（
オゾン及び紫外線）にて分解除去する場合において、時
間の無駄なく、また、残留イオン発生のおそれなく、該
有機物を分解除去できる方法及び装置を提供することが
できる効果がある。According to the present invention, the organic substance on the organic substance carrier is removed by ozone or (
In the case of decomposing and removing organic matter using ozone and ultraviolet rays, it is possible to provide a method and apparatus that can decompose and remove the organic matter without wasting time and without fear of generating residual ions.
第１図は本発明方法を実施するための装置例の概略説明
図、第２図は゛第１図に示す装置を用いた本発明方法実
施例におけるＣ Ｏｚ濃度変化状態を表すグラフである
。
３・・・・・オゾン発生器、
４・・・・・反応室、
９・・・・・ＣＯｔ濃度測定器、
１３・・・・有機物担体。FIG. 1 is a schematic explanatory diagram of an example of an apparatus for carrying out the method of the present invention, and FIG. 2 is a graph showing changes in COz concentration in an example of the method of the present invention using the apparatus shown in FIG. 3...Ozone generator, 4...Reaction chamber, 9...COt concentration measuring device, 13...Organic substance carrier.
Claims (2)
を密閉反応室内に配置し、該反応室ＣＯ＿２濃度を測定
しつつ該有機物をオゾン又は（オゾン及び紫外線）によ
り加熱下に分解し、前記ＣＯ＿２濃度が予め定めた値よ
り低下したことをもって該有機物の分解除去が終了した
と判断することを特徴とする有機物分解除去方法。(1) An organic substance carrier carrying an organic substance to be decomposed and removed is placed in a closed reaction chamber, and while measuring the CO_2 concentration in the reaction chamber, the organic substance is decomposed under heating with ozone or (ozone and ultraviolet rays), and the CO_2 A method for decomposing and removing organic matter, characterized in that it is determined that the decomposition and removal of the organic matter has been completed when the concentration has decreased below a predetermined value.
に接続されたオゾン発生器及び前記反応室に接続された
ＣＯ＿２濃度測定装置を備えたことを特徴とする有機物
分解除去装置。(2) An organic matter decomposition and removal device comprising: a sealable reaction chamber having heating means; an ozone generator connected to the reaction chamber; and a CO_2 concentration measuring device connected to the reaction chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62250207A JPH01186619A (en) | 1987-10-03 | 1987-10-03 | Method and equipment for removing organic matter by decomposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62250207A JPH01186619A (en) | 1987-10-03 | 1987-10-03 | Method and equipment for removing organic matter by decomposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01186619A true JPH01186619A (en) | 1989-07-26 |
Family
ID=17204414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62250207A Pending JPH01186619A (en) | 1987-10-03 | 1987-10-03 | Method and equipment for removing organic matter by decomposition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01186619A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10975182B2 (en) | 2011-12-23 | 2021-04-13 | Japan Polyethylene Corporation | Polar group-containing olefin copolymer, multinary polar olefin copolymer, olefin resin composition, and adhesive material, laminate, and other application products using same |
| US11342162B2 (en) | 2017-09-15 | 2022-05-24 | SCREEN Holdings Co., Ltd. | Resist removing method and resist removing apparatus |
-
1987
- 1987-10-03 JP JP62250207A patent/JPH01186619A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10975182B2 (en) | 2011-12-23 | 2021-04-13 | Japan Polyethylene Corporation | Polar group-containing olefin copolymer, multinary polar olefin copolymer, olefin resin composition, and adhesive material, laminate, and other application products using same |
| US11342162B2 (en) | 2017-09-15 | 2022-05-24 | SCREEN Holdings Co., Ltd. | Resist removing method and resist removing apparatus |
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