JPH01185460A - Ic tester - Google Patents

Abstract

PURPOSE:To obtain not only the uniform cooling capacity of cooling air but also uniform and high radiation capacity, by changing the thickness of each of a circuit boards so as to uniformize the intervals between the circuit boards. CONSTITUTION:By changing the thickness of each of circuit boards 13 on the inner and outer peripheral sides thereof, the interval between the adjacent circuit boards is kept constant and cooling air flows between the circuit boards 13 at a uniform speed to go to a cooling air discharge port 14. Because of uniform air flow velocity, heat conductivity equal over the entire surface of each circuit board 13 can be obtained and the circuit boards 13 can be uniformly cooled. The heat resistance between the radiation fins 17 mounted to the circuit boards 13 and the heat generating elements on the circuit board 13 is reduced because of the large cross-sectional area of each of the circuit boards 13 and heat can be effectively radiated from the radiation fins 17.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC test equipment, and more particularly to an IC test equipment which has been improved in terms of cooling efficiency inside a test head of an IC test equipment.

(Prior Art) A large number of circuit boards are mounted inside the test head of an IC test device, and the amount of heat generated by the mounted components is considerably large. Therefore, for the past year, we have installed a fan inside the test head that sucks outside air through an opening on the bottom of the test head, passes it through the inside of the test head, and then exhausts it from the side of the test head.This cools the circuit board. I try to do that.

However, as ICs to be tested become more highly integrated, the number of circuit boards mounted inside the test head has increased, and the mounting density has also increased, making the conventional cooling structure as described above insufficient. It is difficult to achieve a good cooling effect.
It is becoming ζ.

(Problem to be Solved by the Invention) As the ICs to be tested become highly integrated, the mounting density within the test head also increases, leading to the problem that a sufficient cooling effect cannot be achieved with the conventional cooling structure. be.

The present invention has been made in view of the above circumstances, and its purpose is to provide an IC test device that can uniformly and efficiently cool the inside of a test head even when the test head is mounted in high density. .

[Structure of the invention]

(Means for Solving the Problems) In the present invention, in an IC test apparatus 1 having a test head in which a plurality of circuit boards are housed and arranged in a substantially diagonal manner, the distance between the adjacent circuit boards is The thickness of the circuit board is configured such that the thickness of the circuit board is different from the thinner inner circumference to the outer circumference so that f is approximately constant.

(Function) In this structure, by keeping the distance between the circuit boards constant, the cooling air flow rate can be kept constant, and the entire surface of the circuit board can be cooled uniformly. It becomes possible to have an effect. Furthermore, as the thickness of the circuit board increases as it bends outward in the radial direction, an increase in the amount of heat transmitted through the circuit board by thermal conduction to the heat dissipation fins attached to the outside of the circuit board can be expected. It is possible to cool it down.

(Example 7.) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of the test head section. In this figure, the main body and pedestal, which are considered to be unrelated to the direct cooling structure, are omitted. Further, since the blower 1ζ is a common one, a description thereof will be omitted.

The test head 2 is a mount II on which wafers, etc. are placed and movable.
This is rotatably supported by the support portion 5.

When manually sorting ICs, move the test head 1 as shown in Figure 1.
Set it horizontally. At this time, the IC contact board 9 is connected to the connector pin 1 protruding from the top surface of the test head 2.
The IC socket 111 attached to the IC contact board 91ζ is installed so as to be electrically connected to the IC contact board 91ζ.

When testing an IC woofer, C rotates the test head 2 up and down 180 degrees from the state shown in FIG.

Next, the cooling structure inside the test head will be explained.

The test head 2 is divided into a board storage part 3 and a wiring storage part 4t by the connector board 6I, and the cooling air is supplied through the outer cover 151, which excludes the radiation fins 17, and has a large number of cooling air intake ports 8. Supplied from N1 each circuit board 1
The cooling air flows through the tube 12 side of the microscope tube 12 through the cooling air exhaust duct 14 provided on the side of the microscope tube 12, and passes through the blower to the outside of the test head 1.
This is discharged.

A sectional view taken along line AA in FIG. 1 is shown in FIG. 2f. The present invention f
Accordingly, by changing the thickness between the inner and outer circumferential sides of the circuit board 13, the distance between the circuit boards 13 (l) is maintained at a constant distance, and the cooling air flows between the circuit boards 13 at a uniform speed. The air flows toward the exhaust port 14. Since the air flow rate is uniform, an equal heat transfer coefficient can be obtained over the entire surface of the circuit board 13, and uniform cooling can be achieved.

In addition, the thermal resistance between the heat dissipation fins 17 attached to the circuit board 13 and the heating elements 16 on the circuit board 13 is reduced because the cross-sectional area of the circuit board 13 is large, and the heat dissipation from the heat dissipation fins 17 is reduced. can.

Furthermore, in FIG. 2, the thickness of the circuit boards 13 is varied so that the spacing between each circuit board 13 is constant.
Since the air sucked in from the outer circumferential side of the circuit board 13 goes to the inner circumferential side and thus carries away heat, the temperature rises slightly, so the gap on the inner circumferential side may be made slightly narrower.

Note that the radiation fins 17 may not be provided.

〔Effect of the invention〕

As explained above, according to the present invention, by changing the thickness of the circuit board so that the distance between the circuit boards is uniform, it is possible to obtain a uniform cooling capacity of cooling air and a uniform high heat dissipation capacity. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing the configuration of a main part of a test head of an IC test apparatus according to the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. 2...Test head, 8...Cooling air intake port 413
...Circuit board, 14...Cooling air outlet, 15...
- Outer cover, 16...Heating element, 17...Radiation fin, 18...Air flow.

Claims (1)

[Claims] In an IC test device having a test head in which a plurality of circuit boards are housed and arranged approximately radially, the thickness of the circuit boards is different between the inner circumference side and the outer circumference side so that the distance between the adjacent circuit boards is almost constant. IC characterized by
Test equipment.