JPH01184821A - Wafer replacing method - Google Patents

Abstract

PURPOSE:To reduce the contamination with foreign matters in a thermostatic chamber by a method wherein a wafer cassette is placed on a cassette stand on the load side and the unload side, and the cassette stand is picked up to outside the thermostatic chamber automatically. CONSTITUTION:An aperture 20 in the size in which a loading cassette 8 and an unloading cassette 10 can be taken in or out is provided at a part of the wall surface of a thermostatic chamber 11. When a wafer cassette is replaced, first, a cover 21 is rotated downward. An electromagnetic valve 23 is functioned by operating a switch, and a rod 25 is shifted by allowing compressed air to flow into an air cylinder 24. A wafer stand 26, on which a wafer cassette is placed, is connected to the tip of the rod 25. The wafer cassette is passed through the aperture part 20 of the wafer chamber 11, and picked up to outside of the chamber 11. As a result, the contamination in the chamber 11 with foreign matters can be reduced.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wafer exchange method, and in particular to a wafer exchange method suitable for preventing contamination by foreign matter from occurring in semiconductor manufacturing equipment for manufacturing semiconductor integrated circuit elements. It is about the method.

[Conventional technology]

FIG. 3 shows a schematic diagram of a conventional reduction projection exposure apparatus. Monochromatic light 2 generated from a mercury lamp 1 (for example, wavelength 436n)
g-line) illuminates the reticle 4 through the condenser lens 3. The reticle image is reduced by a reduction lens 5,
It is projected onto the wafer 6. On the other hand, the wafer 6 is moved at regular intervals on the XY stage 7 by a step-and-repeat operation, and the reticle reduced image is transferred.

A plurality of wafers 6 are stored in a load cassette 8,
It is transferred onto the XY stage 7 by the m-transfer arm 9. Next, the exposed wafer 6 is transferred to the transfer arm 9.
is discharged to the unload cassette 10. The reduction projection exposure apparatus is generally used while being housed in a constant temperature chamber 11 whose temperature is controlled.

When all of the wafers 6 in the load cassette 8 have been exposed, they are replaced with a cassette containing new wafers 6.

This replacement work is performed by opening the glass door 12 at the front of the constant temperature chamber 11.

However, by opening the glass door 12 during replacement, outside air flows into the constant temperature chamber 11.

In addition, part of the operator's body enters the constant temperature chamber 11, and foreign matter (dust) contained in the outside air and foreign matter attached to the operator's body enter the constant temperature chamber 11.
had entered the equipment and contaminated the equipment.

[Problem to be solved by the invention]

The above conventional technology does not take into consideration keeping the constant temperature chamber clean at all times, and especially in reduction projection exposure equipment, foreign matter adhering to the reticle can cause fatal damage to the IC circuit pattern and reduce the yield. This resulted in an increase in deterioration and defects.

An object of the present invention is to provide a wafer exchange method that can prevent outside air from flowing into a constant temperature chamber as much as possible when exchanging a wafer cassette.

[Means to solve the problem]

The above purpose is to provide an opening in a part of the constant temperature chamber, attach a door that can be opened and closed to this opening, and by opening this door, a cassette containing a plurality of wafers can be taken in and out of the constant temperature chamber through the opening. I tried to achieve it by doing so.

[Effect]

The wafer cassettes are placed on cassette stands on the load side and unload side, and the cassette stands are automatically taken out of the constant temperature chamber using an air cylinder, etc., without human intervention, which prevents contamination of the inside of the constant temperature chamber with foreign matter. There will be fewer things.

〔Example〕

The present invention will be explained in detail below using the embodiments shown in FIGS. 1 and 2.

FIG. 1 is a block diagram for explaining an embodiment of the wafer exchanging method of the present invention. An opening 20 large enough to take in and take out the load cassette 8 and unload cassette 1O is provided in a part of the wall surface of the constant temperature chamber 11, and is covered with a lid 21 while the apparatus is in operation.

When exchanging the wafer cassette, first rotate the lid 21 downward as shown. Subsequently, by operating a switch (not shown), the solenoid valve 23 is activated, compressed air flows into the air cylinder 24, and the rod 25 begins to move. A wafer stand 26 on which a wafer cassette is placed is connected to the tip of the rod 25. Thereby, the wafer cassette is taken out of the constant temperature chamber 11 through the opening 20 of the constant temperature chamber 11.

The above embodiment is a batch system that handles wafers in wafer cassette units.

In recent years, inline systems aiming at automation have been considered. A method of using this embodiment as an inline system will be explained with reference to FIG. In this case, remove the wafer cassette.

The wafer 31 coated with photoresist by the photoresist coating device 30 is transferred to the carry-in arm 33 by the conveyor belt 32, and then carried into the constant temperature chamber 11 by the air cylinder 24 shown in FIG. The finished wafer is taken out of the constant temperature chamber 11 by the ejection arm 34, and then transferred to the ejection belt 35.
Then, the image is transferred to the developing machine 36.

〔Effect of the invention〕

According to the present invention described above, cassettes can be exchanged through the smallest opening without opening the glass door of the constant temperature chamber, so foreign objects are less likely to enter the constant temperature chamber, and the inside of the constant temperature chamber can always be kept clean. In addition, cassettes can be easily replaced outside the thermostatic chamber, improving work efficiency, and can also be easily automated in-line.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing an example of a reduction projection exposure apparatus for explaining an embodiment of the wafer exchanging method of the present invention, FIG. 2 is a block diagram for explaining the present invention in detail, and FIG. 1 is a schematic diagram of a conventional reduction projection exposure apparatus. 6...Wafer, 8...Load cassette, 10...
・Unload cassette, 11... constant temperature chamber, 2
0... Opening, 21... Lid, 24... Air cylinder, 25... Rod, 26... Wafer stand, 3
2...Transport belt, 33...Carry-in arm, 34...
・Ejection arm, 35...Ejection belt. ff11Figure 2Figure 3

Claims (1)

[Scope of Claims] 1. In a semiconductor manufacturing apparatus in which a device for forming a circuit pattern on a semiconductor wafer is housed in a constant temperature chamber and work is carried out at a predetermined temperature, an opening is provided in a part of the constant temperature chamber; A wafer exchange method characterized in that a door that can be opened and closed is attached to the opening, and by opening the door, a cassette containing a plurality of wafers is taken in and out of the thermostatic chamber through the opening. 2. The wafer exchange method according to claim 1, wherein the cassette is removed and the wafers are taken in and out of the thermostatic chamber in a single wafer manner.