JPH01184582A - Device for inspecting packaged component - Google Patents

Abstract

PURPOSE:To properly inspect aberration and a soldering state by inspecting the aberration by the reflecting image of slit light, and deciding the normal/ defective condition of soldering by the reflected image of vertical light. CONSTITUTION:The slit light 2 and the vertical light 3 are projected simultaneously on a packaged component 5 on a printed board 1, and respective reflected light is image-picked up by television cameras 15 and 16, respectively. Those reflected images are binarized at binarization parts 22 and 23, respectively, and the position detection of an endpoint is performed by supplying the binary image of the slit light to an endpoint detection part 24. Next, at a processing part 25, the aberration state of the packaged component 5 is inspected based on the coordinate of the endpoint, then, an inspection area is decided. And the processing part 25 fetches the binary image by the vertical light, and checks the binary image included in the above started inspection area, then, decides the normal/defective condition of the soldering.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention is based on, for example, checking the misalignment of chip components surface-mounted on a printed circuit board (hereinafter simply referred to as "mounted components"). The present invention relates to a mounted component inspection device for inspecting soldering conditions to determine whether they are good or bad.

<Conventional technology> Conventional devices of this type first irradiate the mounted components on the printed circuit board with horizontally diffused light to obtain a reflected image, and then set a window on the reflected image to detect the positional deviation of the mounted components. There is a method for detecting the amount (Japanese Patent Laid-Open No. 60-25
No. 6004). After setting the inspection area for the soldered state based on the detection data of the amount of positional deviation, this device then irradiates the mounted components on the printed circuit board with incident light from the vertical direction, passing through a red transmission filter and a blue transmission filter. In this method, a set inspection area is inspected for two reflection images taken by the camera to determine whether the soldering condition is good or bad.

Figure 12 shows a reflected image obtained by irradiating horizontally diffused light onto a mounted component 31 on a printed circuit board. As shown in Figure 13, horizontally diffused light is reflected to create whitish areas (high-brightness areas). 33 to 3 days were set, and among these, the horizontal positional deviation of the reflected image was inspected in the four outer windows 33 to 36, and the vertical positional deviation was inspected in the two inner windows 38 and 39. There is.

<Problems to be Solved by the Invention> However, in the above-mentioned positional deviation inspection method, if the entire surface of the mounted component is whitish, the reflected image will have high brightness areas as shown in Figure 14. Since the entire mounted component is affected, it is difficult to inspect the vertical positional displacement of the mounted component using the windows 38 and 39. Furthermore, even if the entire surface of the mounted component is not whitish in color, the same is true even if there are letters written in whitish color, and the reflected droplets, as shown in Fig. 15, are similar.
The character portion 39 appears as a high brightness portion, making it difficult to inspect the vertical positional deviation of the mounted components using the windows 38 and 39.

, this invention was made by focusing on the above problem, and it is possible to reliably detect the positional deviation of the mounted components and properly check the soldering state, regardless of the color or presence of characters on the surface of the mounted components. The purpose of the present invention is to provide a new mounted component inspection device that can be inspected.

<Means for Solving the Problems> In order to quickly achieve the above object, the present invention provides a mounted component inspection device that inspects the soldering state of mounted components on a printed circuit board to determine the quality of the soldered components. a first light projecting means for irradiating the mounted components on the printed circuit board with the slit light; a second light projecting means for irradiating the mounted components on the printed circuit board with reflected light; an imaging device that images each reflected light beam from a printed circuit board caused by the emitted light and generates each reflected image; a positional deviation inspection device that inspects the positional deviation state of the mounted component from the reflected image by the slit light; The present invention includes an inspection area setting means for setting an inspection area for the soldering state based on the inspection result, and a determining means for inspecting the set inspection area for an image reflected by incident light to determine whether the soldering state is good or bad. did.

In addition, in this invention, in order to improve the efficiency of inspection, the first
．． Each of the second light projecting means includes a light projecting means for simultaneously emitting slit light and incident light in separable wavelength bands, and the imaging means includes each reflected light from the printed circuit board due to the slit light and incident light. In order to separately image the images, two imaging devices are included.

Furthermore, in this invention, in order to simplify the configuration of the apparatus, the imaging means is configured with one imaging device for sequentially imaging each of the reflected lights from the printed circuit board due to the slit light and the incident light. , 1st. In response to the sequential operation of the second light projecting means, reflected light from the slit light and incident light are sequentially captured to generate each reflected image individually.

<Operation> When the first light projection means is operated to irradiate the mounted components on the printed circuit board with slit light, and the reflected light is imaged by the imaging means to generate a reflected image, this reflected image is detected by the positional deviation inspection means. After the positional deviation state of the mounted component is inspected, the inspection area setting means sets an inspection area for the soldering state based on the positional deviation inspection result. In this case, the image reflected by the slit light is an image showing the unevenness of the mounted component, so even if the entire surface of the mounted component is whitish or there are whitish characters written on it, the position of the mounted component Misalignment can be detected reliably, and the inspection area for the soldered state can be appropriately set.

Then, the second light projecting means is operated to irradiate the mounted components on the printed circuit board with reflected light from the vertical direction, and the reflected light is imaged by the imaging means to generate a reflected image, and this reflected image is sent to the determining means. The determination means inspects the inspection area using this reflected image and determines whether the soldering condition is good or bad.

In the above-mentioned apparatus, the imaging means is constituted by two imaging devices, and the first imaging device. When the second light projection means is operated simultaneously to simultaneously irradiate the slit light and incident light in separable wavelength bands, one of the imaging devices selects and captures only the light reflected by the slit light, and the reflected light is reflected. An image is generated, and only the reflected light from the incident light is selectively captured in the other imaging device, and a reflected image thereof is simultaneously generated.

Furthermore, in the above-mentioned apparatus, when the imaging means is constituted by one imaging device, the first. When the second light projecting means is sequentially operated, the imaging device first generates a reflected image using the slit light, outputs the reflected image to the positional deviation inspection means, and then
Next, a reflected image is generated by the incident light and the reflected image is output to the determining means.

<Embodiment> FIG. 1 shows a schematic configuration of a mounted component inspection apparatus according to an embodiment of the present invention, in which a slit light 2 and incident light 3 are irradiated onto a position above a printed circuit board 1 to be inspected. A light projecting means (not shown) is provided to capture the reflected light from the slit light 2 and the reflected light 3.

The printed circuit board 1 has lands 4a and 4b at appropriate locations on its surface.
is provided, and this land 4a.

Mounted component 5 is fixed with electrodes 6a and 6b at both ends in the longitudinal direction positioned on 4b. In the illustrated example, one electrode 6a is properly fixed to the land 4a with solder 7, but the other electrode 6b lacks solder and is in a soldering defective state.

FIG. 2 shows a light projecting device that irradiates the slit light 2. In this embodiment, two light projecting devices 8a and 8b are positioned diagonally above the mounted component 5 and at mutually orthogonal positions, respectively. It is deployed. The slit lights 2a and 2b from the respective light projecting devices 8a and 8b are irradiated onto the mounted component 5 along the vertical and horizontal directions of the component, and one slit light is projected onto the surface of the mounted component 5 and the printed circuit board l. Intermittent optical cutting line 9a by 2a.

10a, and intermittent optical cutting lines 9b and 10b by the other slit light 2b are generated.

End points A-D of the mounted components from both ends of each optical cutting line 9a, 9b
are obtained, these optical cutting lines 9a and 9b are imaged by the imaging means 14, and the positions of each end point A-D are extracted by image processing.

FIG. 3 shows images 9a', 10a', 9b', and 10b' of each optical cutting line generated by the imaging means 14 and images A' to D' of each end point.

Now, the position of each end point A-D on the xy coordinates is (Xa
, yA) (XI, )'I) (Xc,
)'e) (xo, yo), the coordinates of the center of the part (x
H, y14) can be obtained using the following formula 00, and this can be calculated using the coordinates of the reference center position (xo.

yo), the positional deviation amounts ΔX and Δy in the X direction and in the X direction can be calculated using the following equations.

ΔX w X M−X o ・・φ・■Δ'/='1
M Vo...■ Returning to FIG. 2, the slit lights 2a, 2b emitted by the respective light projecting devices 8a, 8b have a narrow wavelength band, and for example, as shown in FIG. The projected light is generated by sequentially passing through the slit projection plate 12 and the green transmission filter 3.

On the other hand, the incident light 3 shown in FIG. 1 is set to have a wide wavelength band including the wavelength bands of the slit lights 2a and 2b, but is not limited to this, for example, the wavelength band of the slit lights 2a and 2b is set. It can also be set to have a narrow wavelength band other than the wavelength band.

FIG. 5 shows a state in which the mounted component 5 on the printed circuit board 1 is irradiated with incident light 3 from a vertical direction, and the reflected light is imaged by the imaging means 14. In the illustrated example, solder 7 is appropriately applied to one electrode 6a, but solder is missing from the other electrode 6b. Since the upper surfaces of the electrodes 6a and 6b of the mounted component 5 and the upper surfaces of the lands 4a and 4b of the printed circuit board 1 are flat horizontal surfaces, the reflected light of the incident light 3 travels directly upward, but the soldered portion Since the upper surface of the mirror is an inclined surface, the reflected light of the incident light 3 is directed obliquely upward perpendicular to the inclined surface.

If the shapes of the lands 4a and 4b are vertically elongated rectangles as shown in FIG. 6, and the width thereof is smaller than the width of the mounted component 5, mounting with missing solder as shown in FIG. 7(1) will occur. When the incident light 3 is irradiated onto the electrode 6b portion of the component 5 from directly above, the reflected light from the solder missing portion travels directly upward, resulting in a reflected image as shown in FIG. 8 (1). It becomes a shape. In the figure, the dotted hatched area is a high-luminance area that appears whitish due to the reflection of the incident light 3, and is
The reflected image 6b' of the land 4b and the reflected image 4b' of the land 4b are continuous due to lack of solder.

Next, when the part of the electrode 6b is in a state where there is insufficient solder as shown in FIG. Since it is only scattered and most of it travels directly upward, the reflected image has the shape shown in FIG. 8 (2), that is, the electrode 6b.
A small scattered portion 7' of the solder 7 appears between the reflected image 6b' of the land 4b and the reflected image 4b' of the land 4b.

Next, when the part of the electrode 6b is in a proper soldering state as shown in FIG. Because it is scattered over a wide area, the reflected image is shown in Figure 8 (3).
As shown in FIG. 2, the reflected image 4b' of the land 4b is shaped as if it had been scraped off over a wide area by the scattering portion 7' of the solder 7.

Returning to FIG. 1, an imaging means 14 is provided directly above the mounted component 5 for imaging the reflected light from the slit light 2 and the incident light 3 to generate respective reflected images.

The image capturing means 14 in the illustrated example includes a first industrial television camera 15 for capturing the reflected light by the slit light 2 and a second industrial television camera 16 for capturing the reflected light by the incident light 3. A half mirror 17 is tilted and positioned directly above the mounted component 5, and a second television camera 16 is placed at a position to receive the straight light 18 passing through the half mirror 17, and the half mirror 17 reflects the light. A first television camera 15 is placed at a position where it receives the orthogonal light 19.
Each is arranged separately.

A narrow band cut filter 20 is placed in front of the second television camera 16, and by blocking light in the wavelength band of the slit light 2, the incident light 3
This television camera 16 images only the reflected light.

In addition, a narrow band pass filter 21 is placed in front of the first television camera 15, and by passing only light in the wavelength band of the slit light 2 through this filter 21, only the light reflected by the slit light 2 is filtered out. An image is taken with a television camera 15.

FIG. 9 shows an example of a circuit configuration for image processing a reflected image by the slit light 2 and incident light 3, and includes binarization units 22, 23, end point detection unit 24, and processing unit 25. Contains.

One binarization unit 22 captures the reflected image by the slit light 2 obtained by the first television camera 15 and binarizes it, and the other binarization unit 23 captures the reflected image by the slit light 2 obtained by the first television camera 15.
Take in the reflected image from incident light 3 obtained in step 6 and convert it to 2.
Value.

The endpoint detection section 24 detects the coordinate position (xA) of the endpoint A-D (see FIG. 2) from the binary image of the slit light 2 generated by the binarization section 22.

yA ) (XI + '1m) (Xc + )'c
)(Xo +yo) is detected. The processing unit 25 calculates the coordinates (xH, yx) of the center of the component from the positions of these four end points by executing the calculation of the above formula 00, and further executes the calculation of the formula positional deviation amount ΔX,
Find Δy.

The processing unit 25 in this embodiment determines the inspection area of the soldering state on the side of the end point A in the longitudinal direction at the coordinates (X
M, yA), and after setting the inspection area of the soldered state on the side of the end point B based on the coordinates (xM, yx)k, check the reflected image of the incident light included in each inspection area, Determine whether the soldering condition of each electrode is good or bad.

In FIG. 8 (1), (2), and (3), the rectangular portion indicates the inspection area 26 set by the processing unit 25, and in the state of missing solder (see FIG. 8 (1)), the rectangular portion indicates the inspection area 26. is occupied only by the high-brightness part, and there is a lack of solder (see Figure 8).
2)), the high brightness part decreases in the inspection area 26,
In the proper soldering state (see Figure 8 (3)), the inspection area 26
No high-brightness areas appear within the image. Therefore, in the processing section 25, the area of the high brightness portion within this inspection area 26 or
The quality of soldering is determined by measuring brightness or the like.

FIG. 10 shows the procedure for inspecting the soldering state by the above-mentioned image processing circuit.
TIJ), the end point detection section 24 detects the positions of the four end points A-D of the component from the reflected image (binary image) by the slit light 2, and then the processing section 25 first calculates the coordinates of the four end points in step 2. In step 3, the position of the inspection area 26 is set based on the result of the position deviation inspection.In the final step 4, the soldering condition is inspected from the reflected image in the inspection area 26. There is.

In order to inspect the soldering state of the mounted component 5 using the example of the device having the above configuration, for the mounted component 5 on the printed circuit board 1,
The slit light 2 and the incident light 3 are irradiated simultaneously, and the respective reflected lights are taken into the imaging means 14 all at once. The light reflected by the slit light 2 passes through the narrow band pass filter 21, and is imaged by the first television camera 15. Also, incident light 3
The reflected light passes through the narrow band cut filter 20, and is imaged by the second television camera 16.

Each reflected image obtained by each television camera 15.16 is binarized by a binarization unit 22.23, and the binary image for the slit light is given to an end point detection unit 24, which detects the position of the end point. It will be done. Next, the processing unit 25 inspects the positional deviation state of the mounted component 5 from the coordinates of the end points, and sets an inspection area 26 based on the inspection result. Then, the processing section 25 takes in the binary image by the incident light that has been binarized by the other binarization section 23, checks the binary image included in the inspection area 26, and solders each electrode part. Determine whether the condition is good or bad.

In the above embodiment, the slit light 2 and the incident light 3 are irradiated simultaneously, and the two television cameras 15° 16 simultaneously generate the reflected images of the slit light 2 and the incident light 3. We are working to improve efficiency.

Slit light 2 and incident light 3 are sequentially irradiated on this,
As shown in FIG. 11, it is also possible to sequentially generate each reflected image by the slit light 2 and incident light 3 using one television camera 27. In this case, two reflected images are generated one after another. Although the inspection efficiency is reduced, since the imaging means 14 can be configured with one television camera 27, the configuration of the device can be simplified and the equipment cost can be reduced.

<Effects of the Invention> As described above, the present invention inspects the misalignment of mounted components using a reflected image using slit light, sets an inspection area for the soldering state based on the inspection results, and then inspects the reflected image using incident light. Since the inspection area set for each image is inspected to determine the quality of soldering, it is possible to reliably detect misalignment of mounted components and perform soldering, regardless of the color or presence of characters on the surface of the mounted components. The attachment condition can be properly inspected.

Furthermore, in the apparatus according to claim 2, the slit light and the incident light are simultaneously irradiated, and the reflected light from each irradiation light is separated and imaged by two imaging devices, so that the efficiency of inspection can be improved. can be measured, reducing inspection time.

Furthermore, in the apparatus according to claim 3, the slit light and the incident light are sequentially irradiated, and the reflected light from each irradiation light is sequentially imaged by one imaging device, so that the configuration of the apparatus can be simplified. This invention achieves the purpose of the invention and has remarkable effects, such as being able to reduce equipment costs.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a schematic configuration of a mounted component inspection device according to an embodiment of the present invention, FIG. 2 is a perspective view showing a situation in which a mounted component is irradiated with slit light, and FIG. 3 is a slit FIG. 4 is an explanatory diagram showing an image of a light cutting line formed by light irradiation, FIG.
The figure is a cross-sectional view showing the situation in which reflected light is irradiated onto the mounted component, Figure 6 is a plan view showing the size of the land with respect to the mounted component, and Figure 7 is the soldering state when the soldering condition is normal and when it is abnormal. 8 is an explanatory diagram showing reflected images of the soldered part by reflected light when the soldering state is normal and abnormal; FIG. 9 is a block diagram showing an example of the configuration of an image processing circuit; FIG. 10 is a flowchart showing the flow of operation in the circuit of FIG. 9;
FIG. 12 is an explanatory diagram showing a schematic configuration of another embodiment of the present invention, FIG. 12 is an explanatory diagram showing an image obtained with a conventional device, and FIG. 13 is an explanatory diagram showing an image obtained by a conventional apparatus. FIG. An explanatory diagram showing the set state, and FIGS. 14 and 15 are explanatory diagrams showing other images obtained with the conventional apparatus. 1... Printed circuit board 2... Slit light 3...
...Reflected light 5...Mounted parts 7...Solder 8a, 8b...Light emitter

Claims (3)

[Claims] 1. A mounted component inspection device that inspects the soldering state of a mounted component on a printed circuit board to determine whether it is good or bad, comprising: a first light projecting means for irradiating the mounted component on the printed circuit board with slit light; and a printed circuit board. a second light projection means for irradiating reflected light onto the mounted component above; an imaging means for capturing each reflected light from the printed circuit board due to the slit light and the reflected light to generate respective reflected images; A positional deviation inspection means for inspecting a positional deviation state of a mounted component from a reflected image by slit light, an inspection area setting means for setting an inspection area for a soldering state based on the inspection result of this positional deviation state, and a reflected image by incident light. 1. A component mounting inspection apparatus comprising: a determining means for inspecting a set inspection area to determine whether the soldering condition is good or bad. 2. Each of the first and second light projecting means is constructed of a light projecting means for simultaneously irradiating slit light and incident light in separable wavelength bands, and the imaging means is configured to print images using the slit light and incident light. Claim 1 comprising two imaging devices for separately imaging each reflected light from the substrate.
The mounted component inspection device described. 3. The imaging means is composed of one imaging device for sequentially imaging each reflected light from the printed circuit board due to the slit light and the incident light, and this imaging device is adapted to the sequential operation of the first and second light projecting means. 2. The mounted component inspection apparatus according to claim 1, wherein the reflected light by the slit light and the reflected light by the incident light are sequentially captured to generate each reflected image individually.