JPH01179449U - - Google Patents

Info

Publication number
JPH01179449U
JPH01179449U JP1988075322U JP7532288U JPH01179449U JP H01179449 U JPH01179449 U JP H01179449U JP 1988075322 U JP1988075322 U JP 1988075322U JP 7532288 U JP7532288 U JP 7532288U JP H01179449 U JPH01179449 U JP H01179449U
Authority
JP
Japan
Prior art keywords
integrated circuit
cold plate
cooling
melting point
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988075322U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988075322U priority Critical patent/JPH01179449U/ja
Publication of JPH01179449U publication Critical patent/JPH01179449U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988075322U 1988-06-08 1988-06-08 Pending JPH01179449U (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988075322U JPH01179449U (https=) 1988-06-08 1988-06-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988075322U JPH01179449U (https=) 1988-06-08 1988-06-08

Publications (1)

Publication Number Publication Date
JPH01179449U true JPH01179449U (https=) 1989-12-22

Family

ID=31300392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988075322U Pending JPH01179449U (https=) 1988-06-08 1988-06-08

Country Status (1)

Country Link
JP (1) JPH01179449U (https=)

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