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Priority to JP7654588UpriorityCriticalpatent/JPH01179436U/ja
Publication of JPH01179436UpublicationCriticalpatent/JPH01179436U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
H01L2224/8319—Arrangement of the layer connectors prior to mounting
H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
Die Bonding
(AREA)
Structures For Mounting Electric Components On Printed Circuit Boards
(AREA)
