JPH01179436U - - Google Patents

Info

Publication number
JPH01179436U
JPH01179436U JP7654588U JP7654588U JPH01179436U JP H01179436 U JPH01179436 U JP H01179436U JP 7654588 U JP7654588 U JP 7654588U JP 7654588 U JP7654588 U JP 7654588U JP H01179436 U JPH01179436 U JP H01179436U
Authority
JP
Japan
Prior art keywords
chip
flexible printed
printed board
positioning
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7654588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7654588U priority Critical patent/JPH01179436U/ja
Publication of JPH01179436U publication Critical patent/JPH01179436U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP7654588U 1988-06-09 1988-06-09 Pending JPH01179436U (US06229276-20010508-P00081.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7654588U JPH01179436U (US06229276-20010508-P00081.png) 1988-06-09 1988-06-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7654588U JPH01179436U (US06229276-20010508-P00081.png) 1988-06-09 1988-06-09

Publications (1)

Publication Number Publication Date
JPH01179436U true JPH01179436U (US06229276-20010508-P00081.png) 1989-12-22

Family

ID=31301566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7654588U Pending JPH01179436U (US06229276-20010508-P00081.png) 1988-06-09 1988-06-09

Country Status (1)

Country Link
JP (1) JPH01179436U (US06229276-20010508-P00081.png)

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