JPH01179412U - - Google Patents
Info
- Publication number
- JPH01179412U JPH01179412U JP7563688U JP7563688U JPH01179412U JP H01179412 U JPH01179412 U JP H01179412U JP 7563688 U JP7563688 U JP 7563688U JP 7563688 U JP7563688 U JP 7563688U JP H01179412 U JPH01179412 U JP H01179412U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- type electronic
- convex portion
- magnetic
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 1
Description
第1図は本考案の実施例になる積層チツプ型電
子部品の断面を含む斜視図、第2図は前記積層チ
ツプ型電子部品のスルーホール部の詳細を示すた
めの一部拡大断面図、第3図は前記第1図に示す
積層チツプ型電子部品の内部構造及びその製造方
法の詳細を示すための積層チツプ型電子部品の展
開斜視図、第4図a及びbは前記積層チツプ型電
子部品のスルーホール部の製造工程を示すための
一部断面図、そして第5図は本考案の他の実施例
になる積層チツプ型電子部品の内部構造及び製造
工程の詳細を示すための展開斜視図である。
11……磁性材、12……導電体層、13……
外部電極、14……スルーホール用貫通孔、15
……凸部、16……端子導電体層、21……磁性
体シート、21′……コイル導体印刷シート、3
1……誘電体シート、31′……電極印刷誘電体
シート、32……矩形電極、33……端子導電体
層。
FIG. 1 is a perspective view including a cross section of a laminated chip type electronic component according to an embodiment of the present invention, FIG. 3 is a developed perspective view of the multilayer chip type electronic component shown in FIG. 1 and details of the manufacturing method thereof, and FIGS. 4a and 4b are the multilayer chip type electronic component shown in FIG. FIG. 5 is a partially sectional view showing the manufacturing process of the through-hole portion of the invention, and FIG. It is. 11...Magnetic material, 12...Conductor layer, 13...
External electrode, 14... Through hole for through hole, 15
... Convex portion, 16 ... Terminal conductor layer, 21 ... Magnetic sheet, 21' ... Coil conductor printed sheet, 3
1... Dielectric sheet, 31'... Electrode printed dielectric sheet, 32... Rectangular electrode, 33... Terminal conductor layer.
Claims (1)
導電体をスルーホールを介してスパイラル状に接
続されて前記磁性積層体の内部にコイルを形成し
、前記印刷導電体コイルの端部にそれぞれ接続す
る一対の外部電極を備えて成る積層チツプ型電子
部品において、前記磁性積層体の一部に、前記ス
ルーホールに対応した位置に予め凸部を設け、前
記凸部に印刷導体を形成して、同凸部上の印刷導
体と前記スルーホールに設けられた導電体とを接
続したことを特徴とする積層チツプ型電子部品。 (2) 実用新案登録請求の範囲第1項に記載した
積層チツプ型電子部品において、スパイラル状の
コイルが形成された磁性積層体上に、さらに、誘
電積層体の層間に、前記誘電体層を介して対向す
る電極層を設け、誘電積層体を積み重ねた端部電
極を一対の外部電極に接続したことを特徴とする
積層チツプ型電子部品。[Claims for Utility Model Registration] (1) Printed conductors provided between layers of a plurality of magnetic laminates are spirally connected via through holes to form a coil inside the magnetic laminate; In a multilayer chip-type electronic component comprising a pair of external electrodes respectively connected to the ends of a printed conductor coil, a portion of the magnetic laminate is provided with a convex portion in advance at a position corresponding to the through hole; A laminated chip-type electronic component characterized in that a printed conductor is formed on a convex portion and the printed conductor on the convex portion is connected to a conductor provided in the through hole. (2) Utility Model Registration In the laminated chip type electronic component described in claim 1, the dielectric layer is further provided between the layers of the dielectric laminate on the magnetic laminate in which the spiral coil is formed. A multilayer chip-type electronic component characterized in that electrode layers facing each other are provided through the dielectric layer, and an end electrode formed by stacking dielectric laminates is connected to a pair of external electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7563688U JPH01179412U (en) | 1988-06-07 | 1988-06-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7563688U JPH01179412U (en) | 1988-06-07 | 1988-06-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01179412U true JPH01179412U (en) | 1989-12-22 |
Family
ID=31300696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7563688U Pending JPH01179412U (en) | 1988-06-07 | 1988-06-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01179412U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0493005A (en) * | 1990-08-09 | 1992-03-25 | Tdk Corp | Chip inductor and its manufacture |
-
1988
- 1988-06-07 JP JP7563688U patent/JPH01179412U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0493005A (en) * | 1990-08-09 | 1992-03-25 | Tdk Corp | Chip inductor and its manufacture |
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