JPH01176969U - - Google Patents
Info
- Publication number
- JPH01176969U JPH01176969U JP7431188U JP7431188U JPH01176969U JP H01176969 U JPH01176969 U JP H01176969U JP 7431188 U JP7431188 U JP 7431188U JP 7431188 U JP7431188 U JP 7431188U JP H01176969 U JPH01176969 U JP H01176969U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- wiring board
- based paste
- palladium
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431188U JPH01176969U (de) | 1988-06-06 | 1988-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431188U JPH01176969U (de) | 1988-06-06 | 1988-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176969U true JPH01176969U (de) | 1989-12-18 |
Family
ID=31299427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7431188U Pending JPH01176969U (de) | 1988-06-06 | 1988-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176969U (de) |
-
1988
- 1988-06-06 JP JP7431188U patent/JPH01176969U/ja active Pending