JPH01176940U - - Google Patents
Info
- Publication number
- JPH01176940U JPH01176940U JP7457788U JP7457788U JPH01176940U JP H01176940 U JPH01176940 U JP H01176940U JP 7457788 U JP7457788 U JP 7457788U JP 7457788 U JP7457788 U JP 7457788U JP H01176940 U JPH01176940 U JP H01176940U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- circuit board
- semiconductor chip
- ultraviolet curing
- preventing leakage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7457788U JPH01176940U (US06633600-20031014-M00021.png) | 1988-06-04 | 1988-06-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7457788U JPH01176940U (US06633600-20031014-M00021.png) | 1988-06-04 | 1988-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01176940U true JPH01176940U (US06633600-20031014-M00021.png) | 1989-12-18 |
Family
ID=31299682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7457788U Pending JPH01176940U (US06633600-20031014-M00021.png) | 1988-06-04 | 1988-06-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01176940U (US06633600-20031014-M00021.png) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893240A (ja) * | 1981-11-30 | 1983-06-02 | Japan Synthetic Rubber Co Ltd | 半導体装置及びその製造方法 |
JPS58127333A (ja) * | 1982-01-11 | 1983-07-29 | クリテイコン・インコ−ポレイテツド | 半導体チップ封止方法 |
JPS61184834A (ja) * | 1985-02-13 | 1986-08-18 | Toshiba Chem Corp | 樹脂封止型半導体装置の製造方法 |
-
1988
- 1988-06-04 JP JP7457788U patent/JPH01176940U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893240A (ja) * | 1981-11-30 | 1983-06-02 | Japan Synthetic Rubber Co Ltd | 半導体装置及びその製造方法 |
JPS58127333A (ja) * | 1982-01-11 | 1983-07-29 | クリテイコン・インコ−ポレイテツド | 半導体チップ封止方法 |
JPS61184834A (ja) * | 1985-02-13 | 1986-08-18 | Toshiba Chem Corp | 樹脂封止型半導体装置の製造方法 |