JPH01176079A - Electroless plating method - Google Patents
Electroless plating methodInfo
- Publication number
- JPH01176079A JPH01176079A JP33421587A JP33421587A JPH01176079A JP H01176079 A JPH01176079 A JP H01176079A JP 33421587 A JP33421587 A JP 33421587A JP 33421587 A JP33421587 A JP 33421587A JP H01176079 A JPH01176079 A JP H01176079A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- contg
- soln
- chloride
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 27
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 239000003513 alkali Substances 0.000 claims abstract description 7
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims abstract description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract description 4
- 235000011150 stannous chloride Nutrition 0.000 claims abstract description 4
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 claims abstract description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 claims abstract description 3
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 6
- 230000001737 promoting effect Effects 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- 239000000835 fiber Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 2
- 238000007654 immersion Methods 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 230000004913 activation Effects 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- 229910052809 inorganic oxide Inorganic materials 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000001099 ammonium carbonate Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 2
- 229910052808 lithium carbonate Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910000032 lithium hydrogen carbonate Inorganic materials 0.000 description 1
- HQRPHMAXFVUBJX-UHFFFAOYSA-M lithium;hydrogen carbonate Chemical compound [Li+].OC([O-])=O HQRPHMAXFVUBJX-UHFFFAOYSA-M 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ZMLDXWLZKKZVSS-UHFFFAOYSA-N palladium tin Chemical compound [Pd].[Sn] ZMLDXWLZKKZVSS-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、無電解めっき法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to an electroless plating method.
（従来の技術）
ガラスやプラスチックなどの絶縁物上への無電解めっき
は一般に無電解めっき用触媒の絶縁物上への吸着を向上
させるためのコンディショニング処理、次に塩化パラジ
ウム及び塩化スズ（ＩＩ）を含む水溶液を使用しためっ
き用触媒の絶縁物上への吸着処理、次にめっき触媒の活
性促進処理を行った後、無電解めっき液に浸漬してめっ
きが行われる。(Prior art) Electroless plating on insulating materials such as glass and plastics is generally performed by conditioning treatment to improve the adsorption of a catalyst for electroless plating onto the insulating material, followed by palladium chloride and tin(II chloride). After adsorption treatment of a plating catalyst onto an insulator using an aqueous solution containing , and then a treatment for promoting the activity of the plating catalyst, plating is performed by immersing the insulator in an electroless plating solution.
従来、この活性促進処理としては、特開昭５０−８１９
２７に示される硫酸及び塩酸の混酸あるいはこれら混酸
に更に酒石酸を添加した密着促進剤を使用する方法、又
、特開昭５１−８１２７に示されるＮａＯＨとエチレン
ジアミン四錯酸の水溶液を使用する方法等が提案されて
いる。Conventionally, as this activity promotion treatment, Japanese Patent Application Laid-Open No. 50-819
A method of using a mixed acid of sulfuric acid and hydrochloric acid or an adhesion promoter prepared by adding tartaric acid to these mixed acids as shown in No. 27, a method of using an aqueous solution of NaOH and ethylenediaminetetracomplex acid shown in JP-A-51-8127, etc. is proposed.
（発明が解決しようとする問題点）
現在、プリント配線板の製造において、無電解めっきは
、スルーホールのめっきを行うために重要な技術である
。(Problems to be Solved by the Invention) Currently, in the production of printed wiring boards, electroless plating is an important technology for plating through holes.
高い信頼性が要求されるプリント配線基板は、ガラス繊
維などの無機酸化物繊維で強化した基板が使用される。Printed wiring boards that require high reliability use boards reinforced with inorganic oxide fibers such as glass fibers.
このような基板のスルーホール壁には、絶縁樹脂と無機
酸化物繊維の２種類の材料が露出する。Two types of materials, an insulating resin and an inorganic oxide fiber, are exposed on the through-hole wall of such a substrate.
上述した従来の技術で、無機酸化物繊維強化基板のスル
ーホールを無電解銅めっきした場合、無機酸化物繊維上
には無電解鋼めっきの析出が不十分である。When the through-holes of an inorganic oxide fiber-reinforced substrate are plated with electroless copper using the conventional technique described above, electroless steel plating is insufficiently deposited on the inorganic oxide fibers.
スルーホール壁面への無電解銅めっきの析出が不十分で
ある場合は、無電解銅めっきの後で行う電気めっきで完
全なめっき皮膜が形成されずピンホールなどができる。If the electroless copper plating is insufficiently deposited on the wall surface of the through hole, a complete plating film will not be formed during electroplating performed after electroless copper plating, resulting in pinholes and the like.
ピンホールのあるスルーホールは、プリント配線板への
部品実装時に使用する溶隔半田が、スルーホールに完全
に入らないので、プリント配線板への部品の装着が不完
全になるという問題がある。Through holes with pinholes have a problem in that the solder used when mounting components on the printed wiring board does not completely enter the through holes, resulting in incomplete mounting of the components on the printed wiring board.
本発明は、めっき析出が良好な無電解めっき法を提供す
るものである。The present invention provides an electroless plating method with good plating deposition.
（問題点を解決するための手段）
本発明は、被めっき体上に、塩化パラジウム及び塩化ス
ズ（ＩＩ）を含む水溶液を使用してめっき触媒を吸着さ
せ、次に炭酸アルカリ、炭酸水素アルカリの中より選ば
れる少なくとも一種を含む活性促進処理液に浸漬等の処
理をした後、無電解めっきを行うものである。(Means for Solving the Problems) The present invention involves adsorbing a plating catalyst onto an object to be plated using an aqueous solution containing palladium chloride and tin(II) chloride, and then adsorbing a plating catalyst onto an object to be plated. After treatment such as immersion in an activity promoting treatment solution containing at least one selected from among them, electroless plating is performed.
本発明において、炭酸アルカリは炭酸リチウム、炭酸ナ
トリウム、炭酸カリウム、炭酸アンモニウム等が使用さ
れる。In the present invention, lithium carbonate, sodium carbonate, potassium carbonate, ammonium carbonate, etc. are used as the alkali carbonate.
又、炭酸水素アルカリは、炭酸水素リチウム、炭酸水素
ナトリウム、炭酸水素カリウム、炭酸水素アンモニウム
等が使用される。Further, as the alkali hydrogen carbonate, lithium hydrogen carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, ammonium hydrogen carbonate, etc. are used.
これらの物質を含む水溶液の濃度は
０．０１Ｍ＃以上であり、一般に０．１Ｍ／１２〜３Ｍ
／１の間に最適濃度がある。The concentration of aqueous solutions containing these substances is 0.01M# or higher, generally 0.1M/12-3M
There is an optimum concentration between /1.
これらの物質は一種類でも良いが、二種類以上を加えて
も構わない、処理は、被めっき体を浸漬するスプレー吹
付等で行われる。無電解めっき法は、プリント配線板の
製造等で使用される通常のものが使用される。One type of these substances may be used, or two or more types may be used. The treatment is carried out by immersing the object to be plated, spraying, or the like. As the electroless plating method, a normal method used in manufacturing printed wiring boards, etc. is used.
実施例１
日立化成工業側型ガラス繊維強化エポキシ銅張積層板（
商品名：ＭＣＬ Ｅ−６７、板厚１．６ｍ）に直径０
．９ ｎのスルーホールをドリルによってあけた。この
テスト基板を日立化成工業■製りリーナーコンディショ
ナーＣＬＣ−２０１（５０℃に保持）に５分間浸漬した
０次に、３分間水洗して、日立化成工業■製Ｈ３−２０
２Ｂに１０分間浸漬し、めっき触媒を吸着処理した０次
に炭酸ナトリウム０．５Ｍ／ｌの水溶液に５分間浸漬し
た０次に３分間水洗し、日立化成工業■製下地用無電解
銅めっき法ＣＵＳＴ−２０１に２０分間浸漬してめっき
を行った。Example 1 Hitachi Chemical side type glass fiber reinforced epoxy copper clad laminate (
Product name: MCL E-67, plate thickness 1.6m) and diameter 0
．． A 9n through hole was drilled. This test board was immersed in Leaner Conditioner CLC-201 (maintained at 50°C) manufactured by Hitachi Chemical Co., Ltd. for 5 minutes.Next, it was washed with water for 3 minutes, and then washed with water for 3 minutes.
2B for 10 minutes to adsorb the plating catalyst, then soaked in an aqueous solution of 0.5 M/l sodium carbonate for 5 minutes, then rinsed with water for 3 minutes, electroless copper plating method for substrates manufactured by Hitachi Chemical Co., Ltd. Plating was performed by immersing it in CUST-201 for 20 minutes.
めっき終了後、スルーホール壁面のめっき状態を光学顕
微鏡で観測した結果、ガラス繊維表面、エポキシ表面の
いずれもめっきが良好に析出していた。After the plating was completed, the state of the plating on the wall surfaces of the through holes was observed using an optical microscope. As a result, the plating was well deposited on both the glass fiber surface and the epoxy surface.
実施例２
実施例１において、炭酸ナトリウムの代わりに炭酸リチ
ウム０．１Ｍ／ｌを使用した。その他の条件は実施例１
と同様に行った。めっき終了後、スルーホール壁面のめ
っき状態を光学顕微鏡で観測した結果、ガラス繊維表面
、エポキシ表面のいずれもめっきが良好に析出していた
。Example 2 In Example 1, 0.1 M/l of lithium carbonate was used instead of sodium carbonate. Other conditions are Example 1
I did the same thing. After the plating was completed, the state of the plating on the wall surfaces of the through holes was observed using an optical microscope. As a result, the plating was well deposited on both the glass fiber surface and the epoxy surface.
（発明の効果ン
本発明の触媒活性促進処理液を使用すれば、無機酸化物
表面にも均一に無電解銅めっきが析出する。(Effects of the Invention) When the catalyst activity promoting treatment liquid of the present invention is used, electroless copper plating is uniformly deposited even on the surface of inorganic oxides.
Claims (1)
を含む水溶液のめっき触媒で処理した後、炭酸アルカリ
、炭酸水素アルカリの中より選ばれる少なくとも一種を
含む水溶液の活性促進処理液で処理、無電解めっきを行
うことを特徴とする無電解めっき法。1. The object to be plated is palladium chloride and tin(II) chloride.
An electroless plating method characterized in that after treatment with an aqueous plating catalyst containing an aqueous solution, treatment is performed with an aqueous activity promoting treatment solution containing at least one selected from alkali carbonate and alkali hydrogen carbonate, and electroless plating is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33421587A JPH01176079A (en) | 1987-12-29 | 1987-12-29 | Electroless plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33421587A JPH01176079A (en) | 1987-12-29 | 1987-12-29 | Electroless plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176079A true JPH01176079A (en) | 1989-07-12 |
Family
ID=18274832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33421587A Pending JPH01176079A (en) | 1987-12-29 | 1987-12-29 | Electroless plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176079A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0658075A1 (en) * | 1993-12-06 | 1995-06-14 | ENTHONE-OMI, Inc. | Method for manufacture of printed circuit boards |
| US7622205B2 (en) | 2004-04-16 | 2009-11-24 | Fuji Electric Device Technology Co. Ltd. | Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate |
| JP2011180364A (en) * | 2010-03-01 | 2011-09-15 | Ricoh Co Ltd | Method for manufacturing developer carrier, developer carrier, developing device, and image forming apparatus |
| US8039045B2 (en) | 2004-07-27 | 2011-10-18 | Fuji Electric Co., Ltd. | Method of manufacturing a disk substrate for a magnetic recording medium |
-
1987
- 1987-12-29 JP JP33421587A patent/JPH01176079A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0658075A1 (en) * | 1993-12-06 | 1995-06-14 | ENTHONE-OMI, Inc. | Method for manufacture of printed circuit boards |
| US7622205B2 (en) | 2004-04-16 | 2009-11-24 | Fuji Electric Device Technology Co. Ltd. | Disk substrate for a perpendicular magnetic recording medium and a perpendicular magnetic recording medium using the substrate |
| US8039045B2 (en) | 2004-07-27 | 2011-10-18 | Fuji Electric Co., Ltd. | Method of manufacturing a disk substrate for a magnetic recording medium |
| JP2011180364A (en) * | 2010-03-01 | 2011-09-15 | Ricoh Co Ltd | Method for manufacturing developer carrier, developer carrier, developing device, and image forming apparatus |
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