JPH01175795A - Method of water-proofing of printed board - Google Patents
Method of water-proofing of printed boardInfo
- Publication number
- JPH01175795A JPH01175795A JP33447287A JP33447287A JPH01175795A JP H01175795 A JPH01175795 A JP H01175795A JP 33447287 A JP33447287 A JP 33447287A JP 33447287 A JP33447287 A JP 33447287A JP H01175795 A JPH01175795 A JP H01175795A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- injection mold
- printed circuit
- circuit board
- slanting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004078 waterproofing Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 title claims description 5
- 238000002347 injection Methods 0.000 claims abstract description 20
- 239000007924 injection Substances 0.000 claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 abstract 1
- 150000003673 urethanes Chemical class 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明はプリント基板の防水処理方法に関する。[Detailed description of the invention] Industrial applications The present invention relates to a waterproofing method for printed circuit boards.
従来の技術
例えば、洗曜機や自動車等に電子制御装置を搭載する場
合、従来では第２図に示す工程によって防水処理がなさ
れていた。Conventional Technology For example, when an electronic control device is installed in a washing machine, an automobile, etc., waterproofing has conventionally been carried out through the steps shown in FIG.
まず第２図ａに示すように、合成ゴム等などからなる注
入型２１内部に液状で未硬化の防水性お２図すに示すよ
うに電装部品を実装したプリント基板２３を配置し、加
熱し硬化し次に注入型２１を取りはずしていた。First, as shown in Figure 2a, a liquid, uncured waterproof printed circuit board 23 with electrical components mounted thereon is placed inside an injection mold 21 made of synthetic rubber, etc., and heated. After curing, the injection mold 21 was removed.
発明が解決しようとする問題点
しかしながら、従来の方法で防水処理をする場合には、
以下のような問題点があった。すなわち、第２図Ｃに示
すように、スイッチ２４等を配設しているプリント基板
２３上に平坦部を有する充填材２２が覆ってしまってい
るため、充填材２２が硬化後、プリント基板２３をたと
えば平面上に取付けてしまえばプリント基板２３上に水
滴等がたまってる可能性があるという問題点を有してい
た。Problems to be solved by the invention However, when waterproofing is done using the conventional method,
There were the following problems. That is, as shown in FIG. 2C, since the filler material 22 having a flat portion covers the printed circuit board 23 on which the switch 24 and the like are disposed, the printed circuit board 23 after the filler 22 hardens. For example, if the printed circuit board 23 is mounted on a flat surface, water droplets or the like may accumulate on the printed circuit board 23, which is a problem.
また、プリント基板２３に充填材２２を硬化後、水抜等
を設けることは困難であるという問題点を有していた。Further, there was a problem in that it was difficult to provide a drainage hole or the like after the filler 22 had hardened on the printed circuit board 23.
本発明は上記問題点に鑑み、プリント基板を平面部に取
付けた場合でも、そのプリント基板上に水がたまること
を防止するのを目的とする〇問題点を解決するための手
段
上記目的を達成するために本発明は、注入型内部のプリ
ント基板、固定部に傾斜をもたせ、未硬化の防水性およ
び電気絶縁性を有する充填材を注入した後、注入型内部
に電装部品を実装したプリント基板を配置して硬化させ
て、充填材の層を傾斜させて形成するプリント基板の防
水処理方法であるＯ
作 用
この処理方法であれば、注入型内部のプリント基板固定
部に傾斜をもたせることによシ、確実にプリント基板の
充填層に傾斜をもたせ、プリント基板を平面部に取付け
てもその上に水がたまることを防止することができる。In view of the above problems, the present invention aims to prevent water from accumulating on a printed circuit board even when the printed circuit board is mounted on a flat surface.Means for solving the problems Achieving the above object In order to do this, the present invention provides a printed circuit board with electrical components mounted inside the injection mold after the fixed part of the printed circuit board inside the injection mold is sloped and an uncured waterproof and electrically insulating filler is injected. This is a waterproofing method for printed circuit boards in which the filler layer is formed by placing and curing the filler layer at an angle.With this treatment method, the printed circuit board fixing part inside the injection mold can be tilted. By making sure that the filling layer of the printed circuit board has an inclination, it is possible to prevent water from accumulating on the printed circuit board even if the printed circuit board is mounted on a flat surface.
実施例 以下、本発明の実施例を第１図を参照して説明する。Example Embodiments of the present invention will be described below with reference to FIG.
すなわち、第１図＆に示すように、合成ゴム等からなる
注入型１に液性で反応硬化型のウレタン系のものを混合
した液状の未硬化の充填材２を一１定量注入する。次い
で第１図Ｃに示すように、スイッチ４やＬＥＤ５等の電
装部品を実装したプリント基板３を液状で未硬化の充填
材２中に没入するように配置する。注入型１は第１図す
に示すように、下面部の部分が傾斜をもつようになって
おシ、平面上に注入型１を置いたときには端面部である
角度をもつことになる。したがって、電装部品を実装し
たプリント基板３の充填層はある程度の傾斜ｔ１とｔ２
をもつことになる＠したがって、製品に水平に取付けら
れていても、水滴等は傾斜ｔ１とｔ２ にそって外部に
流出する。That is, as shown in FIG. 1, one quantity of a liquid uncured filler 2 mixed with a liquid reaction-curing urethane-based filler 2 is injected into an injection mold 1 made of synthetic rubber or the like. Next, as shown in FIG. 1C, the printed circuit board 3 on which electrical components such as the switch 4 and the LED 5 are mounted is placed so as to be immersed in the liquid, uncured filler 2. As shown in FIG. 1, the injection mold 1 has a sloped lower surface, and when the injection mold 1 is placed on a flat surface, the end surfaces have a certain angle. Therefore, the filling layer of the printed circuit board 3 on which electrical components are mounted has certain slopes t1 and t2.
Therefore, even if the product is installed horizontally, water droplets, etc. will flow out along the slopes t1 and t2.
発明の効果
以上の実施例から明らかなように、本発明によれば、注
入型の下面にある程度の傾斜をもたせることによって、
プリント基板に実装さされた電装部品に傾斜を有するプ
リント基板の充填層を作ることができるため、取付が水
平なところにおいても、プリント基板上の水滴等を外部
に流出させることができ、プリント基板の信頼性を高め
ることができる効果を奏する０Effects of the Invention As is clear from the above embodiments, according to the present invention, by providing a certain degree of inclination to the lower surface of the injection mold,
Since it is possible to create a filling layer of the printed circuit board with an inclination for the electrical components mounted on the printed circuit board, water droplets etc. on the printed circuit board can flow out to the outside even when the installation is horizontal, and the printed circuit board 0, which has the effect of increasing the reliability of
第１図は本発明の一実施例におけるプリント基板の防水
処理の製造工程断面図、第２図は従来のプリント基板の
防水処理の製造工程断面図である。
１・・・・・・注入型、２・・・・・・充填材、３・・
・・・・プリント基板。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名１−
注入型
２−−一充倶材
纂１図FIG. 1 is a cross-sectional view of a manufacturing process for waterproofing a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a conventional manufacturing process for waterproofing a printed circuit board. 1...Injection mold, 2...Filling material, 3...
····Printed board. Name of agent: Patent attorney Toshio Nakao and 1 other person1-
Injection mold 2--Ichijuku material sheet 1 diagram
Claims (1)
を有する充填材を注入した後、注入型内部に電装部品を
実装したプリント基板を配置し、前記注入型の下面にあ
る程度の傾斜をもたせ電装部品を実装したプリント基板
に傾斜を有した充填層を形成することを特徴とするプリ
ント基板の防水処理方法。After injecting a liquid, uncured, waterproof and electrically insulating filler into the injection mold, a printed circuit board with electrical components mounted thereon is placed inside the injection mold, and the bottom surface of the injection mold is tilted to some extent. 1. A method for waterproofing a printed circuit board, comprising forming a sloped filling layer on a printed circuit board on which an electrical component is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33447287A JPH01175795A (en) | 1987-12-29 | 1987-12-29 | Method of water-proofing of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33447287A JPH01175795A (en) | 1987-12-29 | 1987-12-29 | Method of water-proofing of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01175795A true JPH01175795A (en) | 1989-07-12 |
Family
ID=18277771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33447287A Pending JPH01175795A (en) | 1987-12-29 | 1987-12-29 | Method of water-proofing of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01175795A (en) |
-
1987
- 1987-12-29 JP JP33447287A patent/JPH01175795A/en active Pending
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