JPH01174939U - - Google Patents
Info
- Publication number
- JPH01174939U JPH01174939U JP1988071963U JP7196388U JPH01174939U JP H01174939 U JPH01174939 U JP H01174939U JP 1988071963 U JP1988071963 U JP 1988071963U JP 7196388 U JP7196388 U JP 7196388U JP H01174939 U JPH01174939 U JP H01174939U
- Authority
- JP
- Japan
- Prior art keywords
- base
- integrated circuit
- upper opening
- package
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071963U JPH01174939U (cs) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988071963U JPH01174939U (cs) | 1988-05-31 | 1988-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174939U true JPH01174939U (cs) | 1989-12-13 |
Family
ID=31297145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988071963U Pending JPH01174939U (cs) | 1988-05-31 | 1988-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174939U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005302990A (ja) * | 2004-04-12 | 2005-10-27 | Miyota Kk | パッケージ用ロー材付き封着板およびその製造方法 |
-
1988
- 1988-05-31 JP JP1988071963U patent/JPH01174939U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005302990A (ja) * | 2004-04-12 | 2005-10-27 | Miyota Kk | パッケージ用ロー材付き封着板およびその製造方法 |
| JP4494849B2 (ja) * | 2004-04-12 | 2010-06-30 | シチズンファインテックミヨタ株式会社 | パッケージ用ロー材付き封着板およびその製造方法 |