JPH01173948U - - Google Patents

Info

Publication number
JPH01173948U
JPH01173948U JP7051888U JP7051888U JPH01173948U JP H01173948 U JPH01173948 U JP H01173948U JP 7051888 U JP7051888 U JP 7051888U JP 7051888 U JP7051888 U JP 7051888U JP H01173948 U JPH01173948 U JP H01173948U
Authority
JP
Japan
Prior art keywords
semiconductor device
utility
scope
registration request
device characterized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7051888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7051888U priority Critical patent/JPH01173948U/ja
Publication of JPH01173948U publication Critical patent/JPH01173948U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案によるＩＣの外形図、第２図は
本考案の他の実施例のＩＣの外形図である。 １……ＩＣ樹脂部、２……リードストツパー部
、３……リード挿入部、４……本考案によるリー
ドの突起部、８……ＩＣ樹脂部、９……リードス
トツパー部、１０……リード挿入部、１１……本
考案によるリード突起部。 FIG. 1 is an external view of an IC according to the present invention, and FIG. 2 is an external view of an IC according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...IC resin part, 2...Lead stopper part, 3...Lead insertion part, 4...Lead protrusion according to the present invention, 8...IC resin part, 9...Lead stopper part, 10... ...Lead insertion portion, 11...Lead protrusion according to the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部リードのプリント板等に挿入する部分に凸
部を設けたことを特徴とする半導体装置。 A semiconductor device characterized in that a convex portion is provided in a portion of an external lead to be inserted into a printed board or the like.
JP7051888U 1988-05-27 1988-05-27 Pending JPH01173948U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7051888U JPH01173948U (en) 1988-05-27 1988-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7051888U JPH01173948U (en) 1988-05-27 1988-05-27

Publications (1)

Publication Number Publication Date
JPH01173948U true JPH01173948U (en) 1989-12-11

Family

ID=31295759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7051888U Pending JPH01173948U (en) 1988-05-27 1988-05-27

Country Status (1)

Country Link
JP (1) JPH01173948U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016715B1 (en) * 2008-04-15 2011-02-25 미쓰비시덴키 가부시키가이샤 Semiconductor device
JP2012089745A (en) * 2010-10-21 2012-05-10 Kyocera Corp Lead terminal and insulating substrate with lead terminal and package for housing element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016715B1 (en) * 2008-04-15 2011-02-25 미쓰비시덴키 가부시키가이샤 Semiconductor device
JP2012089745A (en) * 2010-10-21 2012-05-10 Kyocera Corp Lead terminal and insulating substrate with lead terminal and package for housing element

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