JPH01173937U - - Google Patents

Info

Publication number
JPH01173937U
JPH01173937U JP6986988U JP6986988U JPH01173937U JP H01173937 U JPH01173937 U JP H01173937U JP 6986988 U JP6986988 U JP 6986988U JP 6986988 U JP6986988 U JP 6986988U JP H01173937 U JPH01173937 U JP H01173937U
Authority
JP
Japan
Prior art keywords
resin mold
ultrasonic vibrator
whose
package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6986988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6986988U priority Critical patent/JPH01173937U/ja
Publication of JPH01173937U publication Critical patent/JPH01173937U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6986988U 1988-05-26 1988-05-26 Pending JPH01173937U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6986988U JPH01173937U (enrdf_load_stackoverflow) 1988-05-26 1988-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6986988U JPH01173937U (enrdf_load_stackoverflow) 1988-05-26 1988-05-26

Publications (1)

Publication Number Publication Date
JPH01173937U true JPH01173937U (enrdf_load_stackoverflow) 1989-12-11

Family

ID=31295135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6986988U Pending JPH01173937U (enrdf_load_stackoverflow) 1988-05-26 1988-05-26

Country Status (1)

Country Link
JP (1) JPH01173937U (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118343A (en) * 1980-02-22 1981-09-17 Nec Corp Preparation apparatus for semiconductor device
JPS61192496A (ja) * 1985-02-19 1986-08-27 三菱電機株式会社 プリント基板用打抜加工装置
JPS61255030A (ja) * 1985-05-07 1986-11-12 Fuji Plant Kogyo Kk 半導体樹脂モ−ルドのバリ除去方法および装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118343A (en) * 1980-02-22 1981-09-17 Nec Corp Preparation apparatus for semiconductor device
JPS61192496A (ja) * 1985-02-19 1986-08-27 三菱電機株式会社 プリント基板用打抜加工装置
JPS61255030A (ja) * 1985-05-07 1986-11-12 Fuji Plant Kogyo Kk 半導体樹脂モ−ルドのバリ除去方法および装置

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