JPH01172450U - - Google Patents

Info

Publication number
JPH01172450U
JPH01172450U JP6455188U JP6455188U JPH01172450U JP H01172450 U JPH01172450 U JP H01172450U JP 6455188 U JP6455188 U JP 6455188U JP 6455188 U JP6455188 U JP 6455188U JP H01172450 U JPH01172450 U JP H01172450U
Authority
JP
Japan
Prior art keywords
dip type
support device
leads
preliminary soldering
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6455188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6455188U priority Critical patent/JPH01172450U/ja
Publication of JPH01172450U publication Critical patent/JPH01172450U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6455188U 1988-05-18 1988-05-18 Pending JPH01172450U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6455188U JPH01172450U (enrdf_load_stackoverflow) 1988-05-18 1988-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6455188U JPH01172450U (enrdf_load_stackoverflow) 1988-05-18 1988-05-18

Publications (1)

Publication Number Publication Date
JPH01172450U true JPH01172450U (enrdf_load_stackoverflow) 1989-12-06

Family

ID=31290017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6455188U Pending JPH01172450U (enrdf_load_stackoverflow) 1988-05-18 1988-05-18

Country Status (1)

Country Link
JP (1) JPH01172450U (enrdf_load_stackoverflow)

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