JPH01171624U - - Google Patents
Info
- Publication number
- JPH01171624U JPH01171624U JP6911988U JP6911988U JPH01171624U JP H01171624 U JPH01171624 U JP H01171624U JP 6911988 U JP6911988 U JP 6911988U JP 6911988 U JP6911988 U JP 6911988U JP H01171624 U JPH01171624 U JP H01171624U
- Authority
- JP
- Japan
- Prior art keywords
- ejector pin
- sealing material
- mold
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007599 discharging Methods 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6911988U JPH01171624U (zh) | 1988-05-24 | 1988-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6911988U JPH01171624U (zh) | 1988-05-24 | 1988-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171624U true JPH01171624U (zh) | 1989-12-05 |
Family
ID=31294410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6911988U Pending JPH01171624U (zh) | 1988-05-24 | 1988-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171624U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482236A (ja) * | 1990-07-25 | 1992-03-16 | Toowa Kk | 電子部品の樹脂封止成形方法及び装置 |
-
1988
- 1988-05-24 JP JP6911988U patent/JPH01171624U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482236A (ja) * | 1990-07-25 | 1992-03-16 | Toowa Kk | 電子部品の樹脂封止成形方法及び装置 |