JPH01171168U - - Google Patents
Info
- Publication number
- JPH01171168U JPH01171168U JP1988062281U JP6228188U JPH01171168U JP H01171168 U JPH01171168 U JP H01171168U JP 1988062281 U JP1988062281 U JP 1988062281U JP 6228188 U JP6228188 U JP 6228188U JP H01171168 U JPH01171168 U JP H01171168U
- Authority
- JP
- Japan
- Prior art keywords
- led
- substrate
- attached
- image reading
- illumination device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005286 illumination Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
Description
第１図は本考案による画像読取り用照明装置の
一実施例を示す概略側面図、第２図は第１図の実
施例における基板の拡大断面図である。第３図は
本考案装置の他の実施例の一部省略した外観図、
第４図は第３図の―線断面図である。第５図
は従来の画像読取用照明装置の一例を示す概略側
面図である。 １０……画像読取用照明装置；１１……基板；
１１ａ，１１ｂ……凹型部分；１２……ＬＥＤア
レイ；１３……ガラス板；２１……板材；２２…
…絶縁層；２３……配線パターン。
一実施例を示す概略側面図、第２図は第１図の実
施例における基板の拡大断面図である。第３図は
本考案装置の他の実施例の一部省略した外観図、
第４図は第３図の―線断面図である。第５図
は従来の画像読取用照明装置の一例を示す概略側
面図である。 １０……画像読取用照明装置；１１……基板；
１１ａ，１１ｂ……凹型部分；１２……ＬＥＤア
レイ；１３……ガラス板；２１……板材；２２…
…絶縁層；２３……配線パターン。
Claims (1)
- 【実用新案登録請求の範囲】 相対的に一方向に移動せしめられる原稿に対し
て、その移動方向に直交する長手方向に延びた基
板と、該基板の上面でその一側に沿つて取り付け
られたＬＥＤを含んでおり、該原稿の表面に走査
方向に延びるライン状の照明光を照射する、画像
読取り用照明装置において、 上記基板のＬＥＤを取り付けるべき部分が長手
方向に沿つて凹型に該ＬＥＤを収容し得るように
、他の部分より低く形成されていて、この凹型部
分にＬＥＤを実装し、少なくとも下側が平坦であ
るガラス板またはレンズを基板の他の部分に当接
させることにより該ＬＥＤをカバーするようにし
たことを特徴とする画像読取り用照明装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988062281U JPH089968Y2 (ja) | 1988-05-12 | 1988-05-12 | 画像読取り用照明装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988062281U JPH089968Y2 (ja) | 1988-05-12 | 1988-05-12 | 画像読取り用照明装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01171168U true JPH01171168U (ja) | 1989-12-04 |
| JPH089968Y2 JPH089968Y2 (ja) | 1996-03-21 |
Family
ID=31287905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988062281U Expired - Lifetime JPH089968Y2 (ja) | 1988-05-12 | 1988-05-12 | 画像読取り用照明装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH089968Y2 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083463A (ja) * | 1983-10-13 | 1985-05-11 | Nec Corp | 原稿読み取り用光源 |
-
1988
- 1988-05-12 JP JP1988062281U patent/JPH089968Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083463A (ja) * | 1983-10-13 | 1985-05-11 | Nec Corp | 原稿読み取り用光源 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH089968Y2 (ja) | 1996-03-21 |