JPH01171087U - - Google Patents

Info

Publication number
JPH01171087U
JPH01171087U JP1988067507U JP6750788U JPH01171087U JP H01171087 U JPH01171087 U JP H01171087U JP 1988067507 U JP1988067507 U JP 1988067507U JP 6750788 U JP6750788 U JP 6750788U JP H01171087 U JPH01171087 U JP H01171087U
Authority
JP
Japan
Prior art keywords
heat generating
generating component
heat sink
threaded member
insertion hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988067507U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0611581Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988067507U priority Critical patent/JPH0611581Y2/ja
Publication of JPH01171087U publication Critical patent/JPH01171087U/ja
Application granted granted Critical
Publication of JPH0611581Y2 publication Critical patent/JPH0611581Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988067507U 1988-05-24 1988-05-24 発熱部品取付機構 Expired - Lifetime JPH0611581Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988067507U JPH0611581Y2 (ja) 1988-05-24 1988-05-24 発熱部品取付機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988067507U JPH0611581Y2 (ja) 1988-05-24 1988-05-24 発熱部品取付機構

Publications (2)

Publication Number Publication Date
JPH01171087U true JPH01171087U (cs) 1989-12-04
JPH0611581Y2 JPH0611581Y2 (ja) 1994-03-23

Family

ID=31292879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988067507U Expired - Lifetime JPH0611581Y2 (ja) 1988-05-24 1988-05-24 発熱部品取付機構

Country Status (1)

Country Link
JP (1) JPH0611581Y2 (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007110161A (ja) * 2001-07-30 2007-04-26 Fujitsu Hitachi Plasma Display Ltd Ｉｃチップの実装構造及びディスプレイ装置
JP6650548B1 (ja) * 2018-03-13 2020-02-19 新電元工業株式会社 電源装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007110161A (ja) * 2001-07-30 2007-04-26 Fujitsu Hitachi Plasma Display Ltd Ｉｃチップの実装構造及びディスプレイ装置
JP6650548B1 (ja) * 2018-03-13 2020-02-19 新電元工業株式会社 電源装置

Also Published As

Publication number Publication date
JPH0611581Y2 (ja) 1994-03-23

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