JPH01171087U - - Google Patents
Info
- Publication number
- JPH01171087U JPH01171087U JP1988067507U JP6750788U JPH01171087U JP H01171087 U JPH01171087 U JP H01171087U JP 1988067507 U JP1988067507 U JP 1988067507U JP 6750788 U JP6750788 U JP 6750788U JP H01171087 U JPH01171087 U JP H01171087U
- Authority
- JP
- Japan
- Prior art keywords
- heat generating
- generating component
- heat sink
- threaded member
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Resistance Heating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988067507U JPH0611581Y2 (ja) | 1988-05-24 | 1988-05-24 | 発熱部品取付機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988067507U JPH0611581Y2 (ja) | 1988-05-24 | 1988-05-24 | 発熱部品取付機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01171087U true JPH01171087U (cg-RX-API-DMAC7.html) | 1989-12-04 |
| JPH0611581Y2 JPH0611581Y2 (ja) | 1994-03-23 |
Family
ID=31292879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988067507U Expired - Lifetime JPH0611581Y2 (ja) | 1988-05-24 | 1988-05-24 | 発熱部品取付機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611581Y2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007110161A (ja) * | 2001-07-30 | 2007-04-26 | Fujitsu Hitachi Plasma Display Ltd | Ｉｃチップの実装構造及びディスプレイ装置 |
| JP6650548B1 (ja) * | 2018-03-13 | 2020-02-19 | 新電元工業株式会社 | 電源装置 |
-
1988
- 1988-05-24 JP JP1988067507U patent/JPH0611581Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007110161A (ja) * | 2001-07-30 | 2007-04-26 | Fujitsu Hitachi Plasma Display Ltd | Ｉｃチップの実装構造及びディスプレイ装置 |
| JP6650548B1 (ja) * | 2018-03-13 | 2020-02-19 | 新電元工業株式会社 | 電源装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611581Y2 (ja) | 1994-03-23 |