JPH01166565U - - Google Patents

Info

Publication number
JPH01166565U
JPH01166565U JP6477588U JP6477588U JPH01166565U JP H01166565 U JPH01166565 U JP H01166565U JP 6477588 U JP6477588 U JP 6477588U JP 6477588 U JP6477588 U JP 6477588U JP H01166565 U JPH01166565 U JP H01166565U
Authority
JP
Japan
Prior art keywords
pattern
outer periphery
circuit board
printed circuit
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6477588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6477588U priority Critical patent/JPH01166565U/ja
Publication of JPH01166565U publication Critical patent/JPH01166565U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
JP6477588U 1988-05-17 1988-05-17 Pending JPH01166565U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6477588U JPH01166565U (fr) 1988-05-17 1988-05-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6477588U JPH01166565U (fr) 1988-05-17 1988-05-17

Publications (1)

Publication Number Publication Date
JPH01166565U true JPH01166565U (fr) 1989-11-22

Family

ID=31290236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6477588U Pending JPH01166565U (fr) 1988-05-17 1988-05-17

Country Status (1)

Country Link
JP (1) JPH01166565U (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222871B2 (fr) * 1978-04-17 1987-05-20 Tetra Pak Dev
JPS62135393A (ja) * 1985-12-10 1987-06-18 共同印刷株式会社 Ｉｃモジユ−ル

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6222871B2 (fr) * 1978-04-17 1987-05-20 Tetra Pak Dev
JPS62135393A (ja) * 1985-12-10 1987-06-18 共同印刷株式会社 Ｉｃモジユ−ル

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