JPH01165672U - - Google Patents
Info
- Publication number
- JPH01165672U JPH01165672U JP6311988U JP6311988U JPH01165672U JP H01165672 U JPH01165672 U JP H01165672U JP 6311988 U JP6311988 U JP 6311988U JP 6311988 U JP6311988 U JP 6311988U JP H01165672 U JPH01165672 U JP H01165672U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- metal core
- copper plating
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6311988U JPH01165672U (US20020051482A1-20020502-M00012.png) | 1988-05-12 | 1988-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6311988U JPH01165672U (US20020051482A1-20020502-M00012.png) | 1988-05-12 | 1988-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165672U true JPH01165672U (US20020051482A1-20020502-M00012.png) | 1989-11-20 |
Family
ID=31288639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6311988U Pending JPH01165672U (US20020051482A1-20020502-M00012.png) | 1988-05-12 | 1988-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165672U (US20020051482A1-20020502-M00012.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06152089A (ja) * | 1992-10-09 | 1994-05-31 | Internatl Business Mach Corp <Ibm> | 印刷配線板及びその製造方法 |
| JPH1035164A (ja) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ｉｃカード及びその製造方法 |
| JP2006222216A (ja) * | 2005-02-09 | 2006-08-24 | Fujitsu Ltd | 配線基板及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787190A (en) * | 1980-11-19 | 1982-05-31 | Sumitomo Electric Industries | Metallic core printed circuit board |
| JPS61148899A (ja) * | 1984-12-22 | 1986-07-07 | 三菱電線工業株式会社 | 回路用基板の製造法 |
-
1988
- 1988-05-12 JP JP6311988U patent/JPH01165672U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5787190A (en) * | 1980-11-19 | 1982-05-31 | Sumitomo Electric Industries | Metallic core printed circuit board |
| JPS61148899A (ja) * | 1984-12-22 | 1986-07-07 | 三菱電線工業株式会社 | 回路用基板の製造法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06152089A (ja) * | 1992-10-09 | 1994-05-31 | Internatl Business Mach Corp <Ibm> | 印刷配線板及びその製造方法 |
| JPH1035164A (ja) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ｉｃカード及びその製造方法 |
| JP2006222216A (ja) * | 2005-02-09 | 2006-08-24 | Fujitsu Ltd | 配線基板及びその製造方法 |
