JPH01165648A - Composition for electrical or electronic component material and electrical or electronic component material - Google Patents

Abstract

PURPOSE:To obtain a composition which possesses excellent electrical properties and can be cured rapidly with atmospheric moisture or the like even at room temperature to give a rubberlike cured product, containing a saturated hydrocarbon polymer having an Si-bonded OH or hydrolyzable group and a crosslinkable silicon-containing group. CONSTITUTION:This composition for electrical or electronic component material comprises a saturated hydrocarbon polymer having a hydroxyl group or a hydrolyzable group each of which is bonded to a silicon atom and at least one silicon-containing group which can be crosslinked by forming a siloxane bond. Examples of said reactive silicon groups include groups of formula I (wherein R<1> and R<2> are each a triorganosiloxy group represented by a 1-20C alkyl, a 7-20C aralkyl or the like, X is OH or a hydrolyzable group, a is 0,1,2 or 3, b is 01 or 2, a+mb>=1, b's in m groups of formula II need not be the same, and m is 0 or 1-19).

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to silicon-containing groups (hereinafter referred to as reactive (also called silicon group)
The present invention relates to an electric/electronic component material composition containing a saturated hydrocarbon polymer having at least one saturated hydrocarbon polymer, and an electric/electronic component material obtained by curing the composition.

[Prior art/'Points to be solved by the invention] Resin for semiconductor encapsulation, impregnated resin for rotors, insulating face, insulating material for printed wiring boards, impregnated resin for printed wiring boards, coating for electronic parts Epoxy resins, imide resins, amide-imide resins, unsaturated polyester resins, and phenol have traditionally been used as materials for electrical and electronic components, such as adhesives, botting agents for electronic components, adhesives for electrical and electronic components, and compounds for heat dissipation of electronic components. A curable resin such as resin is used.

However, in order to apply conventionally used resins such as those mentioned above, it is generally necessary to heat and process them, which complicates the process and may not be able to be used for parts that are sensitive to high temperatures. There are problems such as. In particular, when it is necessary to cure a rubber-like cured product, the number of curable resins that do not have the above problems is very small and limited.

[Means for Solving the Problems] The present invention solves the problems of the conventional soil-retaining resins, impregnating resins, festivals, insulating materials for electric wires, etc. for electrical and electronic parts, and makes them resistant to air even at room temperature. Electrical/electronic products that quickly harden due to moisture in the product and provide a rubber-like cured product with excellent electrical properties, heat resistance, water resistance, weather resistance, and barrier properties against moisture and gases such as air. It was made for the purpose of scaling compositions for parts materials and electrical/electronic parts materials obtained by curing the compositions,
For electrical/electronic component materials containing a saturated hydrocarbon polymer that has a hydroxyl group or a hydrolyzable group bonded to a silicon atom and has at least one silicon-containing group that can be crosslinked by forming a siloxane bond. The present invention relates to a composition and an electric/electronic component material obtained by curing the composition.

[Example] In the present invention, a saturated silicon-containing group having a hydroxyl group or a hydrolyzable group bonded to a silicon atom and having at least one silicon-containing group that can be crosslinked by forming a siloxane bond, that is, a reactive silicon group, is used. Hydrocarbon polymers are used.

Typical examples of the reactive silicon group include the general formula (1): (wherein R1 and R2 are both alkyl groups having 1 to 20 carbon atoms, ary-/l having 6 to 20 carbon atoms, [, carbon number 7
~20 aralkyl groups or (R-)35iO-(R''
is a monovalent hydrocarbon group having 1 to 20 carbon atoms, and 3 R
゛ may be the same or different), and when two or more R1 or R2 are present, they may be the same,
X is a hydroxyl group or a hydrolyzable group; when two or more are present, they may be the same or different; a is 011, 2 or 3;
, b is 0, ■ or 2, provided that a0mb≧1. Also, b in - does not need to be the same, excellent is 0 or 1 ~
Examples include groups represented by (integer 19).

Specific examples of the hydrolyzable group include a hydrogen atom, an alkoxy group, an acyloxy group, a ketoximate group,
Amino group, amide group, aminooxy group, mercapto group;
Examples include commonly used groups such as alkenyloxy groups.

Among these, alkoxy groups are particularly preferred because they are mildly hydrolyzable and easy to handle.

The hydrolyzable group or hydroxyl group can be bonded to one silicon atom in a range of 1 to 3, and (a+1b) is preferably in a range of 1 to 5. When two or more hydrolyzable groups or hydroxyl groups are bonded to the reactive silicon group, they may be the same or different.

The number of silicon atoms forming the reactive silicon group may be one or two or more, but in the case of silicon atoms connected by siloxane bonds etc., up to 20 silicon atoms may be used. preferable. In particular, a reactive silicon group represented by the formula: (wherein R2 and X%a are the same as above) is preferred because it is easily available.

At least one reactive silicon group, preferably 1.1 to 5 reactive silicon groups, is present in one molecule of the saturated hydrocarbon polymer. When the number of reactive silicon groups contained in the molecule is less than 1, curability becomes insufficient and it becomes difficult to exhibit good rubber elastic behavior.

The reactive silicon group may be present at the end of the saturated hydrocarbon polymer molecular chain, or may be present within the molecular chain,
May exist in both. In particular, when a reactive silicon group is present at the end of the molecular chain, the amount of effective network chains of the saturated hydrocarbon polymer component contained in the final aqueous product increases, resulting in high strength and high elongation. This is preferable because the rubber-like cured product can be easily replaced. Further, these saturated hydrocarbon polymers having reactive silicon groups may be used alone or in combination of two or more.

The polymer forming the skeleton of the saturated hydrocarbon polymer having a reactive silicon group used in the present invention has a carbon number of 1, such as (1) ethylene, propylene, 1-butene, isobutylene, etc.
Polymerizing the olefin compound of ~6 as a raw monomer (2) Homopolymerizing a diene compound such as butadiene, isoprene, etc., or copolymerizing the above olefin compound and diene compound, and then hydrogenating it. However, isobutylene-based polymers and hydrogenated polybutadiene-based Preferably it is a polymer.

Note that the saturated hydrocarbon polymer as used herein is a concept that means a polymer that does not substantially contain carbon-carbon unsaturated bonds other than aromatic rings.

In the inbutylene polymer, all of the monomer units may be formed from isobutylene units, and preferably 50% (by weight %) of the monomer units copolymerizable with isobutylene in the isobutylene polymer. , hereinafter the same) below, it may be contained in a range of preferably 30% or less, particularly preferably 10% or less.

Such monomer components include, for example, carbon atoms with 4 to 1 carbon atoms.
Examples include olefins of No. 2, vinyl ethers, aromatic vinyl compounds, vinylsilanes, and allylsilanes.

Specific examples of such copolymer components include, for example, 1
-butene, 2-butene, 2-methyl-1-butene, 3-
Methyl-1-butene, pentene, 4-methyl-1-pentene, hexene, vinylcyclohexane, methyl vinyl ether, ethyl vinyl ether, isobutyl bicamenyl ether, styrene, α-methylstyrene, dimethylstyrene, monochlorostyrene, dichlorostyrene,
β-pinene, indene, vinyltrichlorosilane, vinylmethyldichlorosilane, vinyldimethylchlorosilane, vinyldimethylmethoxysilane, vinyltrimethylsilane, divinyldichlorosilane, divinyldimethoxysilane, divinyldimethylsilane, 1,3-divinyl-1
,1,3,3,-tetramethyldisiloxane, trivinylmethylsilane, tetravinylsilane, allyltrichlorosilane, allylmethyldichlorosilane, allyldimethylchlorosilane, allyldimethylmethoxysilane, allyltrimethylsilane, diallyldichlorosilane, diallyldimethoxysilane , diallyldimethylsilane, γ-methacryloyloxypropyltrimethoxysilane, γ-
Examples include methacryloyloxypropylmethyldimethoxysilane.

Note that when vinylsilanes or allylsilanes are used as monomers copolymerizable with isobutylene, adhesiveness with other electrical/electronic component materials is improved.

The hydrogenated polybutadiene polymer and other saturated hydrocarbon polymers also contain other monomer units in addition to the main monomer unit, as in the case of the inbutylene polymer. It may be included.

In addition, the saturated hydrocarbon polymer used in the present invention may contain a small amount of monomer units that leave double bonds after polymerization, such as polyene compounds such as butadiene and isoprene, as long as the purpose of the present invention is achieved. It may be contained preferably in an amount of 10% or less, further 5% or less, particularly 1% or less.

The number average molecular weight of the saturated hydrocarbon polymer, preferably the isobutylene polymer or hydrogenated polybutadiene polymer, is preferably about 500 to 30,000, particularly about 1.000 to 15,000 in liquid form. - It is preferable that the material has fluidity because it is easy to handle.

Next, a method for producing a saturated hydrocarbon polymer having reactive silicon groups will be explained.

Among the above-mentioned isobutylene-based polymers having reactive silicon groups, isobutylene-based polymers having a reactive silicon group at the end of the molecular chain are produced by a polymerization method called the Yeffer method (a specific method using a polymerization method called Yeffer method that uses both an initiator and a chain transfer agent). It can be produced using a terminally functional type, preferably all terminally functional type isobutylene polymer obtained by a cationic polymerization method using a compound of Such manufacturing methods are described, for example, in Japanese Patent Application No. 61-148895, Japanese Patent Application No. 61-150088,
It is described in the specifications of No. 82-90078, No. 62-179733, and No. 82-1948H.

Isobutylene polymers having reactive silicon groups within their molecular chains are produced by adding vinylsilanes or allylsilanes having reactive silicon groups to monomers mainly composed of isobutylene and copolymerizing them.

Furthermore, during polymerization to produce inbutylene-based polymers that have reactive silicon groups at the molecular chain ends, vinylsilanes and allylsilanes that have reactive silicon groups are copolymerized in addition to the main component, the inbutylene monomer. By later introducing reactive silicon groups at the ends, an isobutylene polymer having reactive silicon groups at the ends and inside the molecular chains is produced.

Specific examples of the vinylsilanes and allylsilanes having the reactive silicon group include vinyltrichlorosilane, vinylmethyldichlorosilane, vinyldimethylchlorosilane, vinyldimethylmethoxysilane, divinyldichlorosilane, divinyldimethoxysilane, allyltrichlorosilane, Examples include allylmethyldichlorosilane, allyldimethylchlorosilane, allyldimethylmethoxysilane, diallyldichlorosilane, diallyldimethoxysilane, γ-methacryloyloxypropyltrimethoxysilane, and γ-methacryloyloxypropylmethyldimethoxysilane.

The hydrogenated polybutadiene polymer is prepared by, for example, first removing 10 hydroxyl groups from the terminal hydroxy-hydrogenated polybutadiene polymer.
After converting it into an oxymetal group such as Na or -OK, the general formula (
2): %Formula %(2) (In the formula, Y is a halogen atom such as a chlorine atom or an iodine atom, R3 is -R4+, a divalent hydrocarbon group, and preferred specific examples include an alkylene group, a cycloalkylene group, Particularly preferred are divalent groups selected from arylene groups and aralkylene groups (R″ is a hydrocarbon group having 1 to 10 carbon atoms).
A hydrogenated polybutadiene polymer having a terminal olefin group (hereinafter also referred to as a terminal olefin hydrogenated polybutadiene polymer) is produced by reacting the organic halogen compound represented by the formula.

As a method for converting the terminal hydroxyl group of the terminal hydroxy-hydrogenated polybutadiene-based polymer into an oxymetal group, an alkali metal such as HaSK; a metal hydride such as NaH:
Metal alkoxides such as Na0CHs; caustic soda;
An example is a method of reacting with a caustic alkali such as caustic potash.

In the above method, a terminal olefin-hydrogenated polybutadiene polymer having approximately the same molecular weight as the terminal hydroxy-hydrogenated polybutadiene polymer used as a starting material can be obtained, but if a polymer with a higher molecular weight is to be obtained, the general formula (
2) Before reacting the organic halogen compound, use a polyvalent organic compound containing two or more halogen atoms in one molecule, such as methylene chloride, bis(chloromethyl)benzene, bis(chloromethyl)ether, etc. The molecular weight can be increased by reacting with a compound, and then the general formula (
By reacting with an organic) compound represented by the following formula, a hydrogenated polybutadiene polymer having a higher molecular weight and having an olefin group at the terminal can be obtained.

Specific examples of the organic/percent chloride compound represented by the general formula (2) include allyl chloride, allyl bromide, vinyl (chloromethyl) benzene, allyl (chloromethyl) benzene, allyl (bromomethyl) benzene, allyl (chloro methyl) ether, allyl (chloromethoxy) benzene, l-butenyl (chloromethyl) ether, l-hexenyl (chloromethoxy) benzene,
Examples include, but are not limited to, allyloxy(chloromethyl)benzene. Among these, allyl chloride is preferred because it is inexpensive and reacts easily.

The introduction of a reactive silicon group into the terminal olefin-hydrogenated polybutadiene polymer is similar to the case of isobutylene polymers having a reactive silicon group at the end of the molecular chain, such as the group represented by the general formula (1). A hydrosilane compound having a hydrogen atom bonded thereto, preferably a compound represented by the general formula: % formula % (wherein R2 and xSa are the same as above), is produced by addition reaction using a platinum-based catalyst.

Specific examples of hydrosilane compounds in which a hydrogen atom is bonded to a group represented by the general formula (1) include halogenated silanes such as trichlorosilane, methyldichlorosilane, dimethylchlorosilane, and phenyldichlorosilane; trimethoxysilane; Alkoxysilanes such as triethoxysilane, methyljethoxysilane, methyldimethoxysilane and phenyldimethoxysilane; acyloxysilanes such as methyldiacetoxysilane and phenyldiacetoxysilane; bis(dimethylketoximate)methylsilane, bis Examples include, but are not limited to, ketoximate silanes such as (cyclohexylketoximate) methylsilane. Among these, halogenated silanes and alkoxysilanes are particularly preferred.

The composition for electrical/electronic component materials of the present invention is a composition containing a saturated hydrocarbon polymer having a reactive silicon group as a curable polymer. The proportion of the saturated hydrocarbon polymer having reactive silicon groups in the composition is preferably 10% or more, more preferably 30% or more, particularly 50% or more, and various components may be added as necessary.

Examples of the components to be added include, for example, a known curing catalyst that promotes the silanol condensation reaction, a physical property modifier that adjusts the tensile properties of the resulting cured product, and a composition for electrical/electronic component materials of the present invention that is being stored. storage improvers, plasticizers, fillers, adhesion improvers, ultraviolet absorbers,
Examples include lubricants and pigments.

A curing catalyst accelerates the curing reaction of the polymer, and is often preferably added. Specific examples of curing catalysts include titanate esters such as tetrabutyl titanate and tetrapropyl titanate; tin carboxylates such as dibutyltin dilaurate, dibutyltin maleate, dibutyltin diacetate, tin octylate, and tin naphthenate; dibutyltin oxide; Reactant with phthalate ester; dibutyltyltin diacetylacetonate; aluminum trisacetylacetonate,
Organoaluminum compounds such as aluminum trisethyl acetoacetate and diisopropoquine aluminum ethyl acetoacetate; chelate compounds such as zirconium tetraacetylacetonate and titanium tetraacetylacetonate; lead octylate; butylamine, octylamine, dibutylamine, mono Ethanolamine, jetanolamine, triethanolamine, diethylenetriamine, triethylenetetramine, oleylamine, cyclohexylamine, benzylamine, diethylaminoprobylamine, xylylenediamine, triethylenediamine, guanidine, diphenylguanidine,
2-ethyl-4-methylimidazole, 2.4.8-
Tris(dimethylaminomethyl)phenol, morpholine, N-methylmorpholine, 1,8-diazabicyclo(
5,4,0) Amine compounds such as undecene-7 (DBU) or their salts with carboxylic acids; low molecular weight polyamide resins obtained from excess polyamines and polybasic acids; The reaction product of silane coupling agents having a nia-amino group, such as γ-aminopropyltrimethoxysilane, N-(β
Silanol condensation catalysts such as -aminoethyl)aminopropylmethyldimethoxysilane; and other known silal catalysts such as acidic catalysts and basic catalysts.

These catalysts may be used alone or in combination of two or more.

When using a curing catalyst, the amount used is preferably 0.01 to 50 parts, and 0.1 to 50 parts per 100 parts (parts by weight, the same applies hereinafter) of the saturated hydrocarbon polymer having a reactive silicon group.
Part is more preferable.

Specific examples of the physical property modifier include (C) 13
)381011. (C2Hs) 3SIOH, (C
3H7) 35IOH.

(C6)+5)35IOH, (CIINS)25i(O
H)2, (C6H5)25i(CH3)OB, C5
Hs! 31 (CH3) (0) 1) 2, Cs Is 81
(CH2CH3) (OH)2 , Co Hs St
(CH3) 20H.

110-(S 1 (CH3) 20 + “;T”R.

RCx'+y' -1~19), HO+S i (CsHS) 207 T seal R1HO
-G-8i (CeH5) 20÷-→S i (CH
3) 20←--Rq (p+q -2~20), CH3CH3 \/ Drama C @ Hs Cs Hs \ / Sl lo-G-S l (CH ri 20 → D; 7i H.

HO-(-S i (CH3) (C6Hs) O+T
:1 piece H1HO-+81 (Cs Is) 20 inch τT
H-HO-8l(CsI5)2→081(CH3
) 2 inches-lower O8i (Cs Is )20H.

lo-8l(Cs)(s)z-4081(CH3)2←
−→081 (CsH5) 2←y −os 1 (CsHS) 20 H(x+ , , o
~t a >, HO-GSi (C6Hs) (C)
13)0←fl(81(CHJ) 20÷r=go""
'CH30÷81 (C)Is) (CsOs)
CH2:20 CH3, CHsO+ 81 (CaHS
) 20 + “;T”C4bCh081 (CsHS)
2-→osI(CH3) 2h-; J-081(Cs
)l S) 20 CH3, CHao 81 (CsH
5) 2→031(CH3)2←-6O8l (CsH
5) 2toy -031 (C6) 45) 20CH3 (x +y -
0-18) , CH35l(OCHs) s , (
CI43 ) 25l (OCH3) 2 , (CHs
CH2) 2 81 (OCH3) 2 , (C)I
s ) 281 (OCH2CI3 )2, (CH3CH2
)2 5l(OCH2CH3)2.81(QC2I5
)4, C@H5Sl(OCH3)3, (C6)15
) 2 91 (OCHs) 2 , (CsHS) 2 81
(OCH2CI3)2, (CH3-1□)25I(O
CRl) 2, (CH3)25l(OCH2CI2 Q
C) IJ )2, (CH3CH2)281(OCH2C
H20CH3)2, (CH3) (CH3CI2)
S i (OCH3)2, Cs Hs S l (CH
s) (OCMs)2, C@Hs 81 (C)12
CH3) (OCH3) 2 , CH2= CH31
(OCOCHs) 3, CH3Sl (ON -C(
CH3) (C2Hs) )3, CHI Sl (N(
CH3)2”)s, CH3S i (ON (CH
3) (C2Hs) )3, CHISi(N(C)Is
)(OCCH3))3,C)+3Si(QC(CH
3) -CH2) s, 82 NC)+2 CH2
NHCH2CI2 CH281(OCHi)s,
C) 12- C(CH3) COOCH2CH2CI2
81 (OCHs) s, H8C)! 2c)+2
CH291(OCH3)s, (CH3)35IN
H91(C)+3)3,(CH3)35IN(CHs
) 2 , Cs Hs N-Co-NHCa) I s5
l(CH3)3 (CH3)33l-NH-CO-NH-3l(C)Is
)s, silicon compounds containing one or more hydrolyzable groups or silanol groups, and partially hydrolyzed condensates of these silicon compounds, but are not limited thereto. In addition, R in the formula is a hydrogen atom or a carbon number of 1 to 20
is a hydrocarbon group.

When using a physical property modifier, the amount used is 0.0 parts per 100 parts of the saturated hydrocarbon polymer having reactive silicon groups.
1 to 50 parts is preferable, and 0.1 to 5 parts is more preferable.

Examples of the storage improver include compounds in which a hydrolyzable group is bonded to a silicon atom and ortho-organic acid esters. Specific examples of such compounds include compounds in which a hydrolyzable group is bonded to a silicon atom, methyl orthoformate, and the like among the above-mentioned physical property modifiers. When using a storage stability improver, the amount used is preferably 0.01 to 50 parts, more preferably 0.1 to 5 parts, based on 100 parts of the saturated hydrocarbon polymer having a reactive silicon group.

As the plasticizer, commonly used plasticizers can be used, but those having good compatibility with the saturated hydrocarbon polymer used in the present invention are preferred.

Specific examples of the plasticizer include polybutene, hydrogenated polybutene, α-methylstyrene oligomer, biphenyl, triphenyl, triaryl dimethane, alkylene triphenyl, liquid polybutadiene, hydrogenated liquid polybutadiene, alkyl A/') phenyl, Hydrogenated polybutene, hydrogenated liquid polybutadiene, paraffin oil, preferably containing no unsaturated bonds, such as partially hydrogenated terphenyl, paraffin oil, naphthenic oil, and acidic polypropylene.
Hydrocarbon compounds such as naphthenic oil and atactic polypropylene; Chlorinated paraffins; Phthalate esters such as dibutyl phthalate, dibutyl phthalate, di(2-ethylhexyl) phthalate, butyl benzyl phthalate, butyl phthalyl butyl glycolate; dioctyl Non-aromatics 2 such as adipate and dioctyl sebacate
Basic acid esters; polyalkylene glycol esters such as diethylene glycol benzoate and triethylene glycol dibenzoate; phosphoric acid esters such as tricresyl phosphate and tributyl phosphate; and the like. These may be used alone, or 2
More than one species may be used in combination. Among these, hydrocarbon compounds that do not have carbon-carbon unsaturated bonds have good weather resistance and compatibility with saturated hydrocarbon polymers that have reactive silicon groups, and are used as materials for electrical and electronic parts. This is preferable because it has little effect on the curing speed of the composition and is inexpensive. These plasticizers may be used in place of a solvent for the purpose of adjusting the reaction temperature, adjusting the viscosity of the reaction system, etc. when introducing reactive silicon groups into a saturated hydrocarbon polymer.

When using a plasticizer, the amount used is 0.1 to 5 parts per 100 parts of saturated hydrocarbon polymer having reactive silicon groups.
00 parts is preferable, and 10 to 100 parts is more preferable.

Specific examples of fillers include wood flour, bulbs, cotton chips, asbestos, glass fiber, mica, walnut flour, rice flour, diatomaceous earth, white clay, hume silica, precipitated silica, silicic anhydride, calcium carbonate, clay, Insulating fillers such as talc, titanium oxide, magnesium carbonate, quartz, and flint powder, carbon fiber, graphite,
Examples include conductive fillers such as carbon black, fine aluminum powder, zinc powder, and silver powder. Among these fillers, fillers with thixotropic properties such as precipitated silica, humic silica, and carbon black,
Calcium carbonate, titanium oxide, talc, etc. are preferred.

When a filler is used, the amount used is 1 to 100 parts per 100 parts of the saturated hydrocarbon polymer having reactive silicon groups.
0 parts is preferable, and 50 to 200 parts are more preferable.

As the adhesion improver, commonly used adhesives, silane coupling agents, and other compounds can be used. Specific examples of such compounds include phenolic resins, epoxy resins, aminosilane compounds such as γ-aminopropyltrimethoxysilane and N-(β-aminoethyl)aminopropylmethyldimethoxysilane, epoxysilane compounds, and coumaron-indene resins. , rosin ester resin, terpene-phenol resin, α-methylstyrene-vinyltoluene copolymer, polyethylmethylstyrene, alkyl titanates, aromatic polyisocyanates, and the like.

When using an adhesion improver, the amount used is 0.00 parts per 100 parts of the saturated hydrocarbon polymer having reactive silicon groups.
01 to 50 parts is preferable, and 0.1 to 5 parts is more preferable.

Since the composition of the present invention contains a saturated hydrocarbon polymer having a reactive silicon group, it is rapidly cured by moisture in the air even at room temperature. Of course, other than these conditions,
Curing may be performed by adding water, curing in a steam atmosphere, or the like.

The cured product of the composition for electrical/electronic component materials of the present invention has excellent heat resistance, water resistance, weather resistance, barrier properties against moisture and gases such as air, has a low dielectric constant and dielectric loss tangent, and has a volume resistivity. The result is a rubber-like elastic body with excellent electrical properties such as high conductivity and surface resistivity. In particular, cured products from compositions containing inbutylene-based polymers or hydrogenated polybutadiene-based polymers that have reactive silicon groups that do not substantially contain carbon-carbon unsaturated bonds that are not aromatic rings in their molecules. In this case, heat resistance, water resistance, weather resistance, etc. are significantly better than cured products made of rubber-based polymers such as polymers having carbon-carbon unsaturated bonds or oxyalkylene-based polymers.

Next, the case where the composition of the present invention is used as a sealing resin, an insulating board, a printed circuit board, and a solder resist will be explained.

When the composition of the present invention is used as a sealing resin, the cured product becomes a rubber-like elastic body. Highly reliable semiconductor components are manufactured without problems such as cracks in the chip and breakage of rebonding lines due to thermal stress. Additionally, since no heat curing is required during manufacturing, the semiconductor will not be damaged. Furthermore, its sealing performance is such that, for example, the moisture permeability coefficient is I x 10-
It has excellent moisture barrier properties of about 11g-cm/cj-cm/1g, and has excellent adhesion to aluminum substrates of about 11kg/25mm in single-character peeling, and can be used under severe conditions such as 300 days at 130℃. Excellent heat resistance with no melting observed on the surface and 2.4
As is clear from the excellent electrical properties represented by the excellent dielectric constant of about 4, it is extremely excellent.

In addition, when the composition of the present invention is applied as a sealing resin, it may be potted in the same manner as the conventionally commonly used epoxy resin sealing resin, but heating for curing is not required. It is.

When the composition of the present invention is used in an insulating panel, the cured product becomes a rubber-like elastic body with good adhesion to conductors and electrical insulation, and forms a three-dimensional network structure just by curing at room temperature, resulting in heat-resistant properties. Since it becomes a good cured product, it can be used as an insulated face-treated conductor with good windability, electrical insulation, flexibility, heat resistance, etc.

When the composition of the present invention is used in a printed circuit board, the cured product exhibits a small dielectric constant, resulting in an excellent material with good heat resistance and weather resistance.

When the composition of the present invention is used in a solder resist, the resist has a low dielectric constant. For example, ordinary computer parts may have a high dielectric constant, but components such as supercomputers are required to have a low dielectric constant, and the composition of the present invention is effective.

Further, the composition of the present invention is an excellent material as a conductive paste, a coating agent, and the like.

Next, the present invention will be explained based on examples.

Production Example 1 Polymerization of isobutylene to p-dicumyl chloride using boron trichloride as a catalyst, followed by dehydrochlorination, produced a polymer with a molecular weight of about 5.000 having impropenyl groups at both ends at a ratio of about 92%. 200 g of isobutylene polymer and 10 g of toluene were weighed into a 500 ml four-bottle flask and degassed under reduced pressure at 90° C. for 2 hours. Next, under a nitrogen atmosphere, dry at room temperature 120 ml of hebutane, 11.5 g of methyldichlorosilane and 0.1 ml of a chloroplatinic acid catalyst solution.
ml (a solution of H2PtC16.6H20Ig dissolved in 9 g of 1.2-dimethoxyethane and 1 g of ethanol)
was added, and then reacted at 90°C for 12 hours.

When the amount of residual isopropenyl groups in the isobutylene polymer in the reaction solution was quantified by IR spectrometry, it was found that almost none remained.

Next, 21.2 g of methyl orthoformate, 6.0 g of methanol.
4 g was added and reacted at 70°C for 3 hours. At this point, all of the reaction system became approximately 7, and became neutral.

After distilling off the volatile components under reduced pressure, 50% hexane was added to the remaining components.
After adding m1 and stirring well, insoluble components were removed by filtration. Distill hexane from the purified liquid and add -81 to both ends.
An inbutylene polymer having two (CH3) (OCH3) groups was obtained.

As a result of NMR analysis of the obtained polymer, it was found that -81(C)lx ) (OCH3)2 groups were introduced at about 80% of the molecular ends.

Production Example 2 Terminal hydroxy hydrogenated polybutadiene (polyether HA
, manufactured by Mitsubishi Chemical Industries, Ltd.) 800g, NaOCH
178 g of a MeOH solution (concentration 28%) of No. 3 was added and devolatilized at 130° C. for about 5 hours, followed by an oxymetalation reaction. Thereafter, 99.1 g of 3-chloro-2-methyl-1-propene was added, and the mixture was reacted at 90° C. for 3 hours, and then purified.

When the obtained liquid polymer was analyzed by NMR method and GPC method, it was found to be a polymer having an average molecular weight ff of 13,500, with impropenyl groups introduced at 7B% of all terminals.

40 g of the polymer with an average molecular ffi of 3500 and a chloroplatinic acid catalyst solution of 13.5 μN (H2Ptcfs
81120) 0.2s+ol/II isopropyl alcohol solution) and methyldichlorosilane4.
Using 0 g, the reaction was carried out at 85°C for 8 hours in the same manner as in Production Example 1, and then 8.7 ml of methyl orthoformate and 3.2 ml of methanol were added, and the reaction was carried out at 70°C for 3 hours.

When the amount of remaining isopropenyl groups in the reaction solution was quantified by IR spectroscopy, it was found that there were almost no isopropenyl groups remaining. In addition, when we quantified the reactive silicon groups by NMR method, we found that almost 100% of the isopropenyl groups at the end of the molecule
is (CH30)2 Sl (C)+3 )CH2ell(
It was found that C) lx ) CH20- group.

Examples 1 to 5 and Comparative Examples 1 to 2 Each component was blended to have the composition shown in Table 1 and kneaded using three rolls to prepare a homogeneous composition. The electrical properties of the cured product of the obtained composition were evaluated. The results are shown in Table 1.

In Table 1, the tetravalent tin curing agent is No. 918 manufactured by Sankyo Seisei ■, and the epoxy resin and amine curing agent are Epicoat 828 and Epicure Z1 acid anhydride curing agent manufactured by Yuka Shell Epoxy ■. is methyltetrahydrophthalic anhydride. Further, the electrical properties were measured according to the method described in JIS K 8911.

[Left below] As shown in Table 1, by using the composition of the present invention, a material with extremely excellent electrical properties can be obtained.

[Effects of the Invention] Since the composition of the present invention contains a polymer having a reactive silicon group, it can be rapidly cured even under conditions that would normally be cured by moisture in the air, resulting in improved workability. It has characteristics such as good adhesion to the substrate, and does not damage the substrate due to heating during curing.

Because cured materials are rubber-like elastic bodies, almost no thermal stress occurs, and they have excellent electrical properties, heat resistance, water resistance, weather resistance, and barrier properties against moisture and air. It is something.

Patent applicant Kanebuchi Chemical Industry Co., Ltd.

Claims (1)

[Scope of Claims] A saturated hydrocarbon polymer having a hydroxyl group or a hydrolyzable group bonded to one silicon atom and having at least one silicon-containing group that can be crosslinked by forming a siloxane bond. A composition for electrical and electronic component materials. 2 The silicon-containing group is the general formula (1): ▲There are mathematical formulas, chemical formulas, tables, etc.▼...(1) (In the formula, R^1 and R^2 both have 1 to 20 carbon atoms.
Alkyl group, aryl group having 6 to 20 carbon atoms, 7 carbon atoms
~20 aralkyl group or (R')_3SiO- (R' is a monovalent hydrocarbon group having 1 to 20 carbon atoms, and the three R's may be the same,
is a triorganosiloxy group represented by (which may be different), and when two or more R^1 or R^2 are present, they may be the same or different,
X is a hydroxyl group or a hydrolyzable group, and when two or more are present, they may be the same or different, a is 0, 1, 2 or 3, b is 0, 1 or 2 ,
However, a+mb≧1, and there are m ▲mathematical formulas, chemical formulas, tables, etc.▼The bs in ▼ do not have to be the same, m is 0 or 1~
The composition for electrical/electronic component materials according to claim 1, which is represented by an integer of 19). 3 In general formula (1), X is a hydrogen atom, a hydroxyl group, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an aminooxy group, a mercapto group, or an alkenyloxy group, and two or more Xs are present. The composition for electrical/electronic component materials according to claim 2, wherein the compositions may be the same or different. 4. The composition for electrical/electronic component materials according to claim 2, wherein X in general formula (1) is an alkoxy group. 5. The composition for electrical/electronic component materials according to claim 1, wherein the saturated hydrocarbon polymer is an isobutylene polymer or a hydrogenated polybutadiene polymer. 6 A composition containing a saturated hydrocarbon polymer having a hydroxyl group or a hydrolyzable group bonded to silicon atoms and having at least one silicon-containing group that can be crosslinked by forming a siloxane bond is cured. Electrical and electronic component materials. 7. The electrical/electronic component material according to claim 6, wherein the saturated hydrocarbon polymer is an isobutylene polymer or a hydrogenated polybutadiene polymer.