JPH01165496A - Manufacture of file - Google Patents

Abstract

PURPOSE: To enhance production efficiency by high frequency bonding the overlapped faces of bags while applying a pressure to produce a half-finished intermediate bag and a bag group thereby eliminating the adhesion flaw from the surface of a cover. CONSTITUTION: A cover A comprises a core material and a plastic sheet 2 and a pocket 3 is provided on the rear side. Stacked bags B are set between the surface plate 11 of one electrode in a high frequency welder and the pressure plate 12 of the other electrode. When the pressure plate 12 is lowered and the bags B are pressed against the surface plate 11, the overlapped faces of the bags B corresponding to the projecting rod 10 of a conductive plate 5 is thermally fused by high frequency induction heating and a halt-finished intermediate bag C' is produced. When the half-finished products C' are stacked and pressed between the surface plate 11 and the pressure plate 12, the overlapped faces of the opposite bags B are bonded to produce a bag group C". The bag group C" is then sandwiched by covers A and pressed between the surface plate 11 and the pressure plate 12. Consequently, the covers A are bonded to the bag group C" and a file C is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a file in which a cover made of a synthetic resin sheet and a plurality of bags are bonded together by high frequency.

[Conventional technology]

Conventionally, when manufacturing a file by high-frequency bonding by combining a cover made of a synthetic resin sheet and multiple bag bodies, the bag bodies are high-frequency bonded to the back side of one cover, and then the next bag body is bonded to the above-mentioned cover. The required number of bags are laminated while sequentially bonding the bag and the next bag one by one using high frequency, and then the other cover is bonded to the final layer of the bag by high frequency.

[Problem that the invention seeks to solve]

The bag body is attached to one cover, the bags are added to this bag one by one, and the other cover is sequentially bonded to the final bag by high frequency bonding, which is extremely time-consuming and inefficient, making large-scale production impossible. was there.

Also, when the bag body is high-frequency bonded to the back side of the cover, the adhesive part of the heat bond appears on the surface of the cover, making it unsightly and
There was a problem with quality deterioration.

Means for Solving Problem C] In order to solve the above problem, this invention interposes a bag body made of a plurality of stacked plastic sheets between the facing surface plate and the pressure plate. At the same time, a non-conductive sheet that inhibits adhesion between the conductive plate alone or the conductive plate and the opposing surfaces inside the bag is inserted into the bag, and the predetermined conductive plate has at least one side of the plate surface. A protruding dyeing system is used to heat-weld the bonding area using high-frequency induction heating, and after producing an intermediate bag semi-finished product by high-frequency bonding the overlapping surfaces of the bags by applying pressure, conductive plates and sheets are used. After that, the required number of semi-finished intermediate bags are stacked and overlapped, and a conductive plate is inserted into the bags on both sides sandwiching the non-adhesive surface, and a protruding strip is provided on one side of at least one of the four electric conductors. is positioned in the direction of the overlapping surfaces to be bonded, and the overlapping surfaces of the intermediate bag semi-finished products are high-frequency bonded by applying pressure to produce a bag group. After that, the conductive plate or sheet is removed, and then the bag is A plastic sheet cover with a pocket on the back is superimposed on the bags on both sides of the body group, and a conductive plate is inserted into the pocket and the bag on both sides, and at least one side of the conductive plate is A method for manufacturing a file, characterized in that the provided protruding stripes are positioned in the direction of the overlapping surfaces to be bonded, and a cover is high-frequency bonded to a group of bags by applying pressure, and a surface plate and a pressure plate facing each other. A bag made of multiple stacked plastic sheets is interposed between the bag and the bag, and the bag has a non-conductive material that inhibits adhesion between the conductive plate and the opposing surfaces inside the bag. The sheet is inserted, and the predetermined conductive plate is provided with a protruding dye that is designed to be thermally welded by high-frequency induction heating at the adhesive site on at least one side of the plate surface, and the bag body is The required number of bag groups manufactured by high-frequency bonding the overlapping surfaces of the comrades and removing the inserted conductive plates and sheets is stacked, and a pair of plastic sheets having pockets on the back side are made to sandwich the stacked bag groups and face each other. Overlap the covers of , insert a conductive plate into each of the overlapping pockets and the bag body sandwiching the non-adhesive surfaces, and insert a conductive plate into both bags, and adhere the protruding strips provided on one side of at least one conductive plate. A method for manufacturing a file, in which the pocket, the bag, and the overlapping bags of the group of bags are bonded to each other by high frequency by placing the bag in the direction of the surface and applying pressure.

[Example] Next, a method for manufacturing a file according to the present invention will be explained based on the accompanying drawings.

The cover A and the bag body B used for manufacturing the file are made of plastic sheets, and the above-mentioned cover A consists of a core material 1 such as cardboard, and a plastic sheet 2 that wraps the core material 1, as shown in FIG. A pocket 3 made of a plastic sheet is provided on the back side of the cover A for bonding the bag B by high frequency bonding.

In addition, in the case shown in the figure, the above-mentioned pocket 3 was provided by overlapping a plastic sheet over the entire back surface of the cover A and heat-sealing the remaining three edges to the sheet 2 so as to form an opening on the - side. The sheet is not limited to the pocket, but may be one in which the sheet is positioned only in the part where the bag body B is bonded by high frequency.

Bag B was formed by overlapping two plastic sheets 4.4 and heat-sealing the edges of the remaining three sides to form an opening on the - side, as shown in Figure 1. It may be formed by other methods.

5 is a conductive plate inserted into the pocket 3.

Reference numeral 6 denotes a sheet that is inserted into the bag body B to inhibit adhesion of the opposing surfaces within the bag body B.

As the sheet 6, cardboard, an epoxy resin board, or the like is used.

The above-mentioned conductive plate 5 is either flat or has protruding bundles 10 that are heat-sealed by high-frequency induction heating at bonding sites on both sides and one side of the plate, protruding from the edges. Grip the grip part 8 and insert/remove it.

Next, a method of manufacturing a file combining a cover and a bag body will be explained.

As shown in FIG. 5, a surface plate 11 is one electrode of the high-frequency welder, and a pressure plate 12 is the other electrode.
A required number of stacked bags B are interposed between the bag body B and the bag body B.

At this time, the sheets 6 are each previously inserted into the bag bodies B in which the conductive plates 5 with the protruding bundles 10 remain in the desired bag bodies B.

When inserting the conductive plate 5 with the protruding bundles 10 into one bag B in the middle as shown in FIG. When using a bag provided with protruding bundles 10, it is preferable to insert the protruding bundles 10 into the bags B on both sides so that they face each other.

Then, when pressing the bag B against the surface plate 11 while lowering the pressure plate 12 (by extending the cylinder, etc.) and applying pressure (bringing the contact piece 13 of the pressure plate 12 into contact with the conductive plate 5), , a bag body B corresponding to the protruding bundle 10 of the conductive plates 5
The overlapping surfaces of the two are thermally welded by high frequency induction heating to produce an intermediate bag semi-finished product C'.

Next, the above-manufactured (conductive plate 5 and sheet I/6 are
The required number of intermediate bag semi-finished products C' (which have been extracted) are piled up, and as shown in FIG.
It is interposed between 2 and 2.

At this time, a conductive plate 5 is inserted into both bag bodies B which face each other with the non-adhesive surfaces of the stacked intermediate bag body semi-finished products C' sandwiched in between (in the case shown in the figure, a conductive plate 5 with a protruding bundle 10 is inserted into both bag bodies B). (using plate 5) is inserted.

Further, the protruding bundle 10 is positioned on the non-adhesive surface side.

When pressure is applied, the overlapping surfaces of both opposing bags B of the intermediate bag half-finished product C' are bonded by high frequency, and the eighth
A bag group c'' as shown in the figure is manufactured.

In the manufacturing method of the bag group C'', two intermediate bag semi-finished products C' are connected in the illustrated case, but three or three or more intermediate bags may be connected.

Note that the conductive plate 5 inserted into the bag B of the manufactured bag group C'' is removed.

Thereafter, covers A and A are stacked on both sides of the bag group Crt and interposed between the surface plate 11 and the pressure plate 12.

At this time, pocket 3 and bag body B that overlaps this pocket 3
The conductive plate 5 is inserted in the same manner as described above (under the same conditions as the connection of the intermediate bag semi-finished product C').

After that, when pressure is applied, the cover A is applied to the bag group C''.
, A are high-frequency bonded, and a file C as shown in FIG. 3 is manufactured.

Note that, as shown in the figure, both sides of the cover were bonded by high frequency at the same time, but one side may be bonded, and then the other side may be bonded.

Further, as shown in FIG. 10, two or more intermediate bag semi-finished products C' are stacked, and the lowest part of the stacked intermediate bag semi-finished products C' (with the bag B on the surface plate 11 side) , Covers A and A are stacked on top of the bag body B (on the pressure plate 12 side).

At this time, the overlapping pocket 3 and intermediate bag half-finished product C'
The conductive plate 5 is inserted into the bag bodies B and B, which face each other with the non-adhesive surfaces of the bag body B and the stacked intermediate bag semi-finished products C' in between.

Further, the conductive plate 5 has a protruding strip 10 on one side, and the protruding strip 1
0 means that it is located on the non-adhesive side.

Note that when only the conductive plate 5 is used, there is a protruding strip 1 on one side.
Those without 0 may also be used.

When pressure is applied, the pocket 3 is thermally welded to the bag body B of the intermediate bag semi-finished product C', and the overlapping bags BSB of the intermediate bag semi-finished product C' are thermally welded, as shown in FIG. A file C like this is produced.

〔effect〕

As described above, according to the file manufacturing method of the present invention, the inefficient work of bonding the bag to the cover, each bag to the bag, and finally the cover to the bag by high frequency bonding can be eliminated. Been,
Manufacturing efficiency can be significantly improved.

In addition, when bonding the bag to the cover using high frequency, a pocket is provided on the back side of the cover and a conductive plate is inserted into this pocket, so the part that is thermally fused by high frequency induction heating is the overlap between the pocket and the bag. Only the surface (only the part corresponding to the protruding stripes of the adhesive template) is included.

Therefore, no adhesive traces due to heat sealing appear on the surface of the cover.

Also, by using the sheet, it is possible to eliminate adhesion between opposing surfaces within the bag.

Furthermore, the number of bags in the file can be decreased or increased depending on the number of semi-finished intermediate bags used.

[Brief explanation of the drawing]

The drawings show an embodiment of the file manufacturing method according to the present invention, and FIG. 1 is a perspective view of the bag, FIG. 2 is a perspective view of the cover, and FIG. 3 is a perspective view of the manufactured file. Figure 4 is a perspective view of the conductive plate, sheet, and adhesive template; Figure 5 is a vertical cross-sectional side view of high-frequency bonding of multiple bags; Figure 6 is a vertical cross-sectional side view of the intermediate bag semi-finished product manufactured in the above manner. , Fig. 7 is a vertical cross-sectional side view of the high-frequency bonding of intermediate bag semi-finished products, Fig. 8 is a longitudinal cross-sectional side view of the bag group manufactured in the same way, and Fig. 9 is a longitudinal cross-sectional view of the high-frequency bonding of the cover to the bag group. The side view, FIG. 10, is a longitudinal cross-sectional side view of high-frequency bonding between a plurality of intermediate bag semi-finished products and a cover. A: Cover, B: Bag, C
...File, C'...Intermediate bag semi-finished product c''...Bag group, 1...Core material,
2.4...Plastic sheet, 3...
・Pocket, 5... Conductive plate, 6...
...Sheet, 10...Protruding strip, 11.
... Surface plate, 12 ... Pressure plate, 13
・・・・・・Contact piece. Patent applicant: Masu Mitsuyama, Butsuma, agent: Kama 1) Text: Nifue 5, 7, 8, 7σ'

Claims (2)

[Claims] (1) A bag body made of a plurality of stacked plastic sheets is interposed between the facing surface plate and the pressure plate, and
A non-conductive sheet that inhibits adhesion of only the conductive plate or the conductive plate and the opposing surfaces inside the bag is inserted into the bag, and the predetermined conductive plate has an adhesive portion on at least one side of the plate surface. A protruding striation is used to heat-weld the bags by high-frequency induction heating, and after producing an intermediate bag semi-finished product by high-frequency bonding the overlapping surfaces of the bags by applying pressure, the conductive plate or sheet is extracted. After that, the required number of semi-finished intermediate bags are stacked and overlapped, and conductive plates are inserted into the bags on both sides sandwiching the non-adhesive surface, and the protruding strips provided on one side of at least one of the conductive plates are adhered. After producing a bag group by high-frequency bonding the overlapping surfaces of the intermediate bag semi-finished products by applying pressure,
The conductive plate or sheet is removed, and then a plastic sheet cover having a pocket on the back is superimposed on the bags on both sides of the bag group, and the conductive plates are inserted into the pockets and the bags on both sides, A method for manufacturing a file, characterized in that a protruding strip provided on one side of at least one conductive plate is positioned in the direction of an overlapping surface to be bonded, and a cover is bonded to a bag group by high frequency by applying pressure. (2) A bag made of a plurality of stacked plastic sheets is interposed between the facing surface plate and the pressure plate, and this bag includes only a conductive plate or a conductive plate and the opposing surface inside the bag. A non-conductive sheet that inhibits adhesion is inserted, and the predetermined conductive plate has protruding striations provided on at least one side of the plate surface to be thermally welded by high-frequency induction heating, The overlapping surfaces of the bags are bonded by high frequency by applying pressure, the inserted conductive plates and sheets are removed, the required number of bags are stacked up, and pockets are placed on the back side so as to sandwich the stacked bags and face each other. A pair of covers made of plastic sheets having the same structure are overlapped, and a conductive plate is inserted into each of the overlapping pockets and the bag bodies with the non-adhesive surfaces sandwiched between them, and both bag bodies, and a protrusion provided on one side of at least one of the conductive plates. A method for producing a file, characterized in that the strips are positioned in the direction of the overlapping surfaces to be bonded, and the pocket, the bag, and the overlapping bags of the group of bags are bonded together by high frequency by applying pressure.