JPH01164037A - Temperature control apparatus of rotary stage - Google Patents
Temperature control apparatus of rotary stageInfo
- Publication number
- JPH01164037A JPH01164037A JP32122887A JP32122887A JPH01164037A JP H01164037 A JPH01164037 A JP H01164037A JP 32122887 A JP32122887 A JP 32122887A JP 32122887 A JP32122887 A JP 32122887A JP H01164037 A JPH01164037 A JP H01164037A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- pivot
- rotary stage
- rotary
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract 3
- 230000007423 decrease Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 208000010201 Exanthema Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 201000005884 exanthem Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 206010037844 rash Diseases 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、回転ステージの温度制御機構に係り、特に発
しんを嫌う半導体製造装置などに好適な温度制御機構に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a temperature control mechanism for a rotary stage, and particularly to a temperature control mechanism suitable for semiconductor manufacturing equipment and the like where emission is averse.
従来は、特開昭５５−１６２２２１号に記載されている
ように１回転ステージには温度制御用熱電対は設けられ
ていない。Conventionally, as described in Japanese Patent Laid-Open No. 55-162221, a one-rotation stage is not provided with a temperature control thermocouple.
このように従来は、回転ステージの温度を直接測定せず
１間接的測定であったために実際のステージとの温度差
が大きく、正確な温度制御が困難であった。As described above, in the past, since the temperature of the rotating stage was not directly measured but measured indirectly, there was a large temperature difference with the actual stage, making accurate temperature control difficult.
たとえば１回転ステージを間接的に加熱するヒーター側
に設けた温度センサーによって間接的にセンシング制御
していたために、特に間接的配置のセツティングや、周
囲の条件、熱容量等によって、実際のステージの温度が
変化する欠点があった。For example, since indirect sensing control was performed using a temperature sensor installed on the heater side that indirectly heats the one-rotation stage, the actual temperature of the stage may vary depending on the indirect arrangement settings, surrounding conditions, heat capacity, etc. It had the disadvantage that it changed.
従来のように間接的に測定した理由の最も大きなものは
、回転体に温度センサーを設けたときにその出力を固定
系へ伝達する方法として摺動接触による方法では、摺動
部での接点の摩耗による発しんを嫌ったためである、
本発明の目的は、回転ステージの温度を直接測定するこ
とのできる温度制御装置を提供することにある。The biggest reason for indirect measurement as in the past is that when a temperature sensor is installed on a rotating body, the output is transmitted to a fixed system using sliding contact, but the contact point at the sliding part is This is because generation due to wear is avoided.An object of the present invention is to provide a temperature control device that can directly measure the temperature of a rotating stage.
上記目的は、回転体に設けた温度センサーからの出力を
、固定系に伝達する際に、回転軸の軸中心近くに摺動部
を設けて、軸の周速の遅い部分で出力の伝達をすること
によって、実質的に発しんの極めて少ない状態で、達成
することができる。The above purpose is to transmit the output from the temperature sensor installed on the rotating body to the fixed system by providing a sliding part near the center of the rotating shaft to transmit the output at the part of the shaft where the circumferential speed is slow. By doing so, it is possible to achieve this with virtually no rash.
温度センサーの出力を回転軸内を通して常温部に導き１
回転中心の近くの周速の遅い部分で摺動伝達すると、摺
動部での接点の摩耗が少ないので発しんを極めて少なく
して、出力を固定系に伝達できるので、実質的に発しん
による素子へのダメージをなくすことができる。The output of the temperature sensor is guided through the rotating shaft to the room temperature section 1
If the sliding transmission is carried out at a part near the center of rotation where the circumferential speed is low, there will be less wear on the contacts at the sliding part, so the output can be transmitted to the stationary system with extremely little generation, so the output can be transmitted to the fixed system, which is essentially due to generation. damage can be eliminated.
以下本発明の一実施例を第１，２図により説明する。ケ
ーシング３内に収納された半径１２５ｍの回転ステージ
１内に温度センサー８をうめ込み、回転ステージ１の下
にヒータ用パワーレギュレータ９に接続されたヒーター
２を設ける０回転ステージ１は直径２０ｍの回転軸４に
よって回転させ、その軸４は常温部にて、回転モータ６
によって駆動させる。温度センサ８からの出力は、回転
軸４内を通して常温部に引き出され１回転中心の直径２
１ｍの回転電極５に接続される０回転電極５に摺動する
ように固定電極を設置し、固定電極は温度調節計７に接
続する。この温度調節計７はレギュレータ９に接続され
ている。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. A temperature sensor 8 is embedded in a rotating stage 1 with a radius of 125 m housed in a casing 3, and a heater 2 connected to a heater power regulator 9 is provided below the rotating stage 1. The zero-rotating stage 1 has a rotating diameter of 20 m. The shaft 4 is rotated by a rotary motor 6 at room temperature.
Driven by. The output from the temperature sensor 8 is passed through the rotating shaft 4 and drawn out to the room temperature section, and the diameter 2 at the center of one rotation is
A fixed electrode is installed so as to slide on the 0-rotation electrode 5 connected to the 1 m long rotating electrode 5, and the fixed electrode is connected to the temperature controller 7. This temperature controller 7 is connected to a regulator 9.
本発明によれば１回転ステージ１の回転軸２０■の部分
での摺動に比して直径２ｍｎの摺動部では。According to the present invention, the sliding portion has a diameter of 2 mm compared to the sliding portion at the rotating shaft 20 of the one-rotation stage 1.
周速が１０分の１になり、摺動による接点の摩耗も十分
の−に減少する効果がある。The circumferential speed is reduced to one-tenth, and the wear of the contacts due to sliding is also sufficiently reduced.
本発明によれば１周速の遅い部分の摺動部にて温度セン
サーの信号が伝達できるので、摺動部の摩耗も少なく低
発しんである効果があり、また機構も簡単であるので、
廉価となる。According to the present invention, the signal of the temperature sensor can be transmitted at the sliding part where the circumferential speed is slow, so there is less wear on the sliding part and less heat is generated, and the mechanism is simple.
Becomes inexpensive.
第１図は本発明の一実施例を説明するための概念図、第
２図は摺動部の詳細説明図である。
１・・・回転ステージ、２・・・ヒーター、３・・・ケ
ーシング、４・・・回転軸、５・・・摺動部、６・・・
モーター、７・・・温度調節計、８・・・温度センサー
、９・・・ヒータ用パワレギュレータ。
−２【
′ｌ
第 ２１！１FIG. 1 is a conceptual diagram for explaining one embodiment of the present invention, and FIG. 2 is a detailed explanatory diagram of a sliding part. DESCRIPTION OF SYMBOLS 1... Rotating stage, 2... Heater, 3... Casing, 4... Rotating shaft, 5... Sliding part, 6...
Motor, 7... Temperature controller, 8... Temperature sensor, 9... Power regulator for heater. -2 [ 'l No. 21!1
Claims (1)
ーの出力を回転軸内を通して常温部に導き、回転周速が
小さくなる軸中心近くに摺動部を設けて摺動により固定
系ヘセンサー出力を伝達するようにしてなることを特徴
とする回転ステージの温度制御装置。1. Embed a temperature sensor in the rotating stage, guide the output of the sensor to the room temperature area through the rotating shaft, and provide a sliding part near the center of the shaft where the peripheral speed of rotation decreases to transmit the sensor output to the fixed system by sliding. A temperature control device for a rotary stage, characterized in that the temperature control device
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32122887A JPH01164037A (en) | 1987-12-21 | 1987-12-21 | Temperature control apparatus of rotary stage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32122887A JPH01164037A (en) | 1987-12-21 | 1987-12-21 | Temperature control apparatus of rotary stage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01164037A true JPH01164037A (en) | 1989-06-28 |
Family
ID=18130240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32122887A Pending JPH01164037A (en) | 1987-12-21 | 1987-12-21 | Temperature control apparatus of rotary stage |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01164037A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196397A (en) * | 1992-08-27 | 1994-07-15 | Nec Corp | Method and apparatus for developing resist |
| US5888048A (en) * | 1995-07-10 | 1999-03-30 | Amtech Systems, Inc. | Automatic wafer boat loading |
| JP2008112980A (en) * | 2006-09-21 | 2008-05-15 | Toshiba Corp | Device and method of heating semiconductor wafer with improved temperature uniformity |
| KR20200111105A (en) | 2019-03-18 | 2020-09-28 | 도쿄엘렉트론가부시키가이샤 | Temperature measuring mechanism, temperature measuring method, and stage device |
-
1987
- 1987-12-21 JP JP32122887A patent/JPH01164037A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196397A (en) * | 1992-08-27 | 1994-07-15 | Nec Corp | Method and apparatus for developing resist |
| US5888048A (en) * | 1995-07-10 | 1999-03-30 | Amtech Systems, Inc. | Automatic wafer boat loading |
| JP2008112980A (en) * | 2006-09-21 | 2008-05-15 | Toshiba Corp | Device and method of heating semiconductor wafer with improved temperature uniformity |
| KR20200111105A (en) | 2019-03-18 | 2020-09-28 | 도쿄엘렉트론가부시키가이샤 | Temperature measuring mechanism, temperature measuring method, and stage device |
| US11605547B2 (en) | 2019-03-18 | 2023-03-14 | Tokyo Electron Limited | Temperature measuring mechanism, temperature measuring method, and stage device |
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