JPH01163343U - - Google Patents

Info

Publication number
JPH01163343U
JPH01163343U JP5901888U JP5901888U JPH01163343U JP H01163343 U JPH01163343 U JP H01163343U JP 5901888 U JP5901888 U JP 5901888U JP 5901888 U JP5901888 U JP 5901888U JP H01163343 U JPH01163343 U JP H01163343U
Authority
JP
Japan
Prior art keywords
lead terminal
tip
electrical component
lead
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5901888U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5901888U priority Critical patent/JPH01163343U/ja
Publication of JPH01163343U publication Critical patent/JPH01163343U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5901888U 1988-04-30 1988-04-30 Pending JPH01163343U (US07696358-20100413-C00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5901888U JPH01163343U (US07696358-20100413-C00002.png) 1988-04-30 1988-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5901888U JPH01163343U (US07696358-20100413-C00002.png) 1988-04-30 1988-04-30

Publications (1)

Publication Number Publication Date
JPH01163343U true JPH01163343U (US07696358-20100413-C00002.png) 1989-11-14

Family

ID=31284805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5901888U Pending JPH01163343U (US07696358-20100413-C00002.png) 1988-04-30 1988-04-30

Country Status (1)

Country Link
JP (1) JPH01163343U (US07696358-20100413-C00002.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020050325A1 (ja) * 2018-09-06 2020-03-12 三菱電機株式会社 パワー半導体装置およびその製造方法、ならびに電力変換装置
JP2021114513A (ja) * 2020-01-17 2021-08-05 富士電機株式会社 多層基板回路構造

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020050325A1 (ja) * 2018-09-06 2020-03-12 三菱電機株式会社 パワー半導体装置およびその製造方法、ならびに電力変換装置
CN112655087A (zh) * 2018-09-06 2021-04-13 三菱电机株式会社 功率半导体装置及其制造方法以及电力变换装置
JPWO2020050325A1 (ja) * 2018-09-06 2021-08-30 三菱電機株式会社 パワー半導体装置およびその製造方法、ならびに電力変換装置
US11631623B2 (en) 2018-09-06 2023-04-18 Mitsubishi Electric Corporation Power semiconductor device and method of manufacturing the same, and power conversion device
CN112655087B (zh) * 2018-09-06 2024-08-13 三菱电机株式会社 功率半导体装置及其制造方法以及电力变换装置
JP2021114513A (ja) * 2020-01-17 2021-08-05 富士電機株式会社 多層基板回路構造

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