JPH01163339U - - Google Patents
Info
- Publication number
- JPH01163339U JPH01163339U JP1988059136U JP5913688U JPH01163339U JP H01163339 U JPH01163339 U JP H01163339U JP 1988059136 U JP1988059136 U JP 1988059136U JP 5913688 U JP5913688 U JP 5913688U JP H01163339 U JPH01163339 U JP H01163339U
- Authority
- JP
- Japan
- Prior art keywords
- filler
- integrated circuit
- net
- cooling structure
- mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000011231 conductive filler Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059136U JPH0621250Y2 (ja) | 1988-04-30 | 1988-04-30 | 集積回路素子の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988059136U JPH0621250Y2 (ja) | 1988-04-30 | 1988-04-30 | 集積回路素子の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01163339U true JPH01163339U (is) | 1989-11-14 |
| JPH0621250Y2 JPH0621250Y2 (ja) | 1994-06-01 |
Family
ID=31284922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988059136U Expired - Lifetime JPH0621250Y2 (ja) | 1988-04-30 | 1988-04-30 | 集積回路素子の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621250Y2 (is) |
-
1988
- 1988-04-30 JP JP1988059136U patent/JPH0621250Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0621250Y2 (ja) | 1994-06-01 |