JPH01162280U - - Google Patents
Info
- Publication number
- JPH01162280U JPH01162280U JP5569988U JP5569988U JPH01162280U JP H01162280 U JPH01162280 U JP H01162280U JP 5569988 U JP5569988 U JP 5569988U JP 5569988 U JP5569988 U JP 5569988U JP H01162280 U JPH01162280 U JP H01162280U
- Authority
- JP
- Japan
- Prior art keywords
- insulating material
- copper foil
- adhesive layer
- material board
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569988U JPH01162280U (fi) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569988U JPH01162280U (fi) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162280U true JPH01162280U (fi) | 1989-11-10 |
Family
ID=31281603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5569988U Pending JPH01162280U (fi) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162280U (fi) |
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1988
- 1988-04-25 JP JP5569988U patent/JPH01162280U/ja active Pending