JPH01162274U - - Google Patents

Info

Publication number

JPH01162274U

JPH01162274U JP5515888U JP5515888U JPH01162274U JP H01162274 U JPH01162274 U JP H01162274U JP 5515888 U JP5515888 U JP 5515888U JP 5515888 U JP5515888 U JP 5515888U JP H01162274 U JPH01162274 U JP H01162274U

Authority

JP

Japan

Prior art keywords

circuit board

mounted component

mounting

view

sheet

Prior art date

1988-04-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims 1
• 238000005476 soldering Methods 0.000 claims 1
• 238000000034 method Methods 0.000 description 3
• 230000004907 flux Effects 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000017525 heat dissipation Effects 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1