JPH01162236U - - Google Patents

Info

Publication number
JPH01162236U
JPH01162236U JP1988055487U JP5548788U JPH01162236U JP H01162236 U JPH01162236 U JP H01162236U JP 1988055487 U JP1988055487 U JP 1988055487U JP 5548788 U JP5548788 U JP 5548788U JP H01162236 U JPH01162236 U JP H01162236U
Authority
JP
Japan
Prior art keywords
recess
semiconductor component
semiconductor
metallized layer
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988055487U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988055487U priority Critical patent/JPH01162236U/ja
Publication of JPH01162236U publication Critical patent/JPH01162236U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W70/682—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1988055487U 1988-04-25 1988-04-25 Pending JPH01162236U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988055487U JPH01162236U (cg-RX-API-DMAC10.html) 1988-04-25 1988-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988055487U JPH01162236U (cg-RX-API-DMAC10.html) 1988-04-25 1988-04-25

Publications (1)

Publication Number Publication Date
JPH01162236U true JPH01162236U (cg-RX-API-DMAC10.html) 1989-11-10

Family

ID=31281389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988055487U Pending JPH01162236U (cg-RX-API-DMAC10.html) 1988-04-25 1988-04-25

Country Status (1)

Country Link
JP (1) JPH01162236U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023843A1 (fr) * 2001-09-05 2003-03-20 Renesas Thechnology Corp. Dispositif a semi-conducteur, son procede de fabrication et dispositif de communication radio

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023843A1 (fr) * 2001-09-05 2003-03-20 Renesas Thechnology Corp. Dispositif a semi-conducteur, son procede de fabrication et dispositif de communication radio

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