JPH044767U - - Google Patents

Info

Publication number
JPH044767U
JPH044767U JP1990044402U JP4440290U JPH044767U JP H044767 U JPH044767 U JP H044767U JP 1990044402 U JP1990044402 U JP 1990044402U JP 4440290 U JP4440290 U JP 4440290U JP H044767 U JPH044767 U JP H044767U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
die pad
electrodes
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990044402U
Other languages
English (en)
Japanese (ja)
Other versions
JP2520612Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990044402U priority Critical patent/JP2520612Y2/ja
Publication of JPH044767U publication Critical patent/JPH044767U/ja
Application granted granted Critical
Publication of JP2520612Y2 publication Critical patent/JP2520612Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP1990044402U 1990-04-24 1990-04-24 樹脂封止型半導体装置 Expired - Fee Related JP2520612Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990044402U JP2520612Y2 (ja) 1990-04-24 1990-04-24 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990044402U JP2520612Y2 (ja) 1990-04-24 1990-04-24 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPH044767U true JPH044767U (cg-RX-API-DMAC10.html) 1992-01-16
JP2520612Y2 JP2520612Y2 (ja) 1996-12-18

Family

ID=31557672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990044402U Expired - Fee Related JP2520612Y2 (ja) 1990-04-24 1990-04-24 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JP2520612Y2 (cg-RX-API-DMAC10.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01286342A (ja) * 1988-05-12 1989-11-17 Hitachi Ltd 面実装超薄形半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01286342A (ja) * 1988-05-12 1989-11-17 Hitachi Ltd 面実装超薄形半導体装置

Also Published As

Publication number Publication date
JP2520612Y2 (ja) 1996-12-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees