JPH01161844A - Probe device - Google Patents

Abstract

PURPOSE:To make the conventional anexed space suffice for the title probe device with a larger-sized semiconductor by a method wherein, when a semicon ductor wafer is mounted on a supporting body 5, a stretching mechanism stretching and retracting rail members corresponding to the movement of supporting body 5 is provided. CONSTITUTION:A Y axis table 8 is composed of a stretching mechanism 21, (12) filling the role of a guide shifting both side ends of an X-axis base 16 of X-axis table 7 in the Y-axis direction and a Y driving part 22 driving both side ends along the stretching mechanism 21. On the other hand, the stretching mechanism 21 is composed of the X axis base 16, e.g., an aluminum member of W400mmXL300mmXt20mm and rail members 23, e.g., aluminum angle mem ber of W50mmXH60mmXL300mm with recessed groove parts of W15mmXH20 mmXL300mm notched into the X axis base 16 to make both side ends 16a of the base 10 slide along the groove parts.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe device.

(Prior art) To test the electrical characteristics of a chip formed on a semiconductor wafer, a probe needle of a probe card is pressed into contact with an electrode pad on the chip, and the test is performed with an external tester connected to the probe needle. Ru.

Then, based on the judgment of the inspection, a defective mark is made by a mechanism called an input force of the probe device.

A probe device is well known as such a device.

For example, JP-A-59-117229 and JP-A-62-
No. 25889.

Since the above-mentioned publication describes only the operation, only the structure of the support of this probe device will be schematically described.

A support for supporting a semiconductor wafer, and an X-Y
Consisting of a constant linear rail on the X axis and a constant linear rail on the Y axis, which are laid so as to move in the axial direction,
In boat fishing, a support moves along these rails and probe needles are pressed into contact with electrode pads of chips formed on a semiconductor wafer for inspection.

As a technology for moving this x-y axis, JP-A-61-209
No. 831, JP-A-61-209833 and JP-A-61
There is one described in No.-209835.

(Problems to be Solved by the Invention) In such a conventional probe device, when placing a semiconductor wafer on a support, an -The area of the base that transmits the Y table increases, resulting in an increase in the size of the entire probe device.

(Object of the invention) It is an object of the present invention to provide a probe device that satisfies the above-mentioned conventional requirements and has the same attached area as the conventional probe device even if the semiconductor shape is enlarged.

[Structure of the invention]

(Means for Solving the Problems) The present invention transmits a support body on which a semiconductor wafer is attracted and supported to a moving member, and is moved in the x-y direction to determine the electrical characteristics of chips formed on the semiconductor wafer. The probe apparatus for inspecting the apparatus is characterized in that the movable member is provided with an expansion and contraction mechanism so that the moving member expands and contracts in accordance with an increase or decrease in the moving distance of the support.

(Function) In the present invention, when the X-Y stage on which the support is erected moves along the rail member, as the X-Y stage moves, the X-Y stage extends so as to protrude from the rail member,
In addition, since it is equipped with an extension mechanism that contracts and moves as if withdrawing, the semiconductor wafer can be moved to the operation side using the conventional base area of the probe device without increasing the size of the entire probe device. A semiconductor wafer loading mechanism may be provided to place a semiconductor wafer.

(Embodiment) An embodiment in which the probe device of the present invention is applied to a wafer prober will be specifically described below with reference to the drawings.

First, the structure of the wafer prober of this embodiment will be explained. As shown in FIG. 4, this wafer prober is roughly divided into a loader section (1) and an inspection section (3).

As shown in FIG. 3, the loader section (2) takes out a large number of 4-inch diameter wafers from the cassette (2) which accommodates them in parallel at intervals, and pre-aligns the wafers. By the rotation of (a), the support is transferred to the support body 0, and this support body (■) is moved to the center position of the inspection part (■).The wafer is inspected for continuity with a tester (not shown) installed outside the wafer and a chip on the wafer. It is configured to be transported back into the cassette.

A keyboard 8 is disposed on the top surface of the loader section (2) for inputting information for operating this device.

The inspection section (2) sucks and fixes the wafer transported through the loader section (1) onto the support 0, and drives and controls the support 0 in the X-Y direction, the Z direction, and the rotating circumferential direction. After the wafer is aligned, the wafer is inspected by pressing probe needles of a probe card (not shown) into contact with the wafer.

Regarding the above inspection part (2), as shown in FIG.
An elevating section 0 that moves the support body 0 up and down in the elevating direction is arranged on a concentric axis under the bottom surface of the support body 0.

A uniaxial X-axis table (2) that moves in the X-axis direction is arranged below the elevating section 0, and since the support body 0 can be driven in the X-axis direction, the wafer can be freely moved in the X-axis direction.

A similar single-axis Y-axis table (8) that is moved in the Y-axis direction is arranged below the X-axis table ■, and the support
can be driven in the Y-axis direction, so the wafer can be freely moved in the Y-axis direction.

The Y-axis table (c) allows the X-axis base (16) to move in the Y-axis direction and fixedly supports the rail member (23). The X-axis base (16) is provided to be driven in the Y-axis direction by a pulse motor (27) provided on the base (9).

Here, suction holes (10a) for suctioning and fixing a wafer are evenly arranged on the surface (10) of the support (1), and when a wafer is placed on this surface (10), it is suctioned and fixed by vacuum pressure. It has become so.

Next, the characteristic structure of the wafer prober of this embodiment will be explained. As shown in FIGS. 1 and 2, the elevating section 0
A movable member (11) fixedly supported is configured to contract by a mechanism that moves forward and backward so as to protrude outward from a rail member (15) that serves as a guide.

The telescopic machine W (12) having the above configuration includes a rail member (15) that functions as a guide that moves in one direction, and a movable member (2) having a support body (2) fixedly supported in the groove of the rail member (15).
11) and sliding movement of both side ends (14).

The moving member (11) is, for example, W300III! IxL2
The rail member (15) is fixedly supported on the X-axis base (16) so that both ends of an aluminum plate material of 50 Wrn x 15 mm in thickness are slid smoothly or held between rollers. Furthermore, a nut member (not shown) is provided near the center of the bottom surface of the moving member (11) so as to be driven along the rail member (15).

After the pole screw (17) is screwed into the nut member, both ends of the pole screw (17) are pivotally attached to the support base (18), and this support base (18) is fixedly supported on the X-axis base (16). has been done.

Further, one end of the pole screw (17) is connected to a pulse motor (19). This pulse motor (1
9) is provided movably in the X-axis direction based on a drive command signal from the CPU of the wafer prober.

Therefore, due to the length of the rail member (15), even if the movable member (11) on which the support body (1) is fixedly supported protrudes outward and is moved without being engaged with the groove of the rail member (15), the groove will be recessed. Since it is configured so that it is pivoted to the shape, the heavy view of support body
) The material composition is such that it will not deform even if it is protruded from the surface.

Therefore, the moving distance is extended by the distance that extends beyond the length of the rail member (15).

For example, if the length of the rail member (15) is L, -LL is removed from the groove of the rail member (15) and the moving member (11)
When only the protruding portion is moved, this movement causes the rail member (15
) If the movable member (11) is protruded from side to side centering on the length, it can be moved 2L times the distance.

The above explained the configuration in which it is moved in the X-axis direction,
Next, a configuration that is moved in the Y-axis direction in the same manner as above will be described.

The Y-axis table (2) is moved in the Y-axis direction on both ends of the X-axis base (16) of the X-axis table (2), and has a telescoping mechanism (21) that serves as a guide.
).

The telescopic mechanism (21) has an X-axis base (16), for example, W40.
0mm X L 300nm X t 20+m+ aluminum member and both ends (16a) of this X-axis base (16)
A rail member (23) in which the X-axis base (16) is cut out with a concave groove so that it slides on the rail member (23), for example, H50wm
W 1 on aluminum square material of H60wm x L300+nm
It is composed of a rail member with a notch of 5 am x H 20 mm x L 300 mm.

Both ends (16a) of the X-axis base (16) are pivotally connected to the grooves of the rail member (23) and are configured to be smoothly moved by bearings (not shown).

Further, a nut member (not shown) is provided near the center of the bottom surface of the X-axis base (16), and by moving this nut member in the Y-axis direction, the X-axis base (16) is attached to the rail member. (23) in the Y-axis direction.

Next, the configuration of the Y-axis drive section (24) will be explained.

A pole screw (25) is screwed into the nut member, and both ends of the pole screw (25) are pivotally connected to a support stand (26) erected from the base (2).

Further, one end of the shaft-mounted pole screw (25) is connected to a pulse motor (27), and is configured to be driven in the Y-axis direction based on a drive command signal from the CPU of the wafer prober.

Next, the effect will be explained.

As shown in Figure 3, the loader section () takes out one wafer (from the cassette), transports it, pre-aligns the wafer (), and then transfers it to the rotating arm (28) provided in the inspection section (2). Pass the uke. This rotating arm (28) causes the wafer to be supported by the support body (2).

This wafer ■ is fixed by suction through the suction hole provided in the support 0, and then placed on the X-axis table ■, the Y-axis table ■, and the periphery (
θ) Align the wafer (A) using a rotation mechanism, bring the probe needles arranged and fixed in large numbers on the probe card into contact with the electrode butts of the wafer, and inspect the electrical characteristics of the wafer by applying electricity. become.

Further, the chips of the wafer are scan-driven in the vertical and horizontal directions, and the positions of the electrode pads of the chips and the probe needles are confirmed using a microscope (2a).

Here, by rotation of said rotating arm (28).

When placing the wafer (A) on the support body (2), the pulse motor (1) moves the support body (0) to the position where it is passed by the rotary arm (28) based on the command signal from the CPU of the wafer prober.
9, 27) to the home position (29)
The receiver called ``transfer'' is moved to the transfer position.

Then, the support body ■ can be moved from the home position (z9) to the center position (30) of the inspection part ■ according to a pre-stored program, but the support body 0 can be moved in the X direction and the Y direction. When moving, the distance to be moved is determined by the length of the rail member. For example, if the length of the rail member is Lm, the distance (S) that the support body (2) moves is L>S.

Therefore, in order to increase the moving distance of the support body (2), there is a problem in that the length of the rail member (23) has to be increased and the size of the rail member (23) has to be increased.

Therefore, in this embodiment, the rail member (23) has a structure of a telescoping mechanism that expands and contracts according to the moving distance of the support body 0, thereby increasing the size of the sea urchin and reducing its weight. As a result, there is no need for a large space for movement in the X-axis and Y-axis directions as in the past, and the thick base of the wafer prober can be placed to the minimum size, reducing the weight of the wafer prober. It is possible to do so.

Note that the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the gist of the present invention.

In the above embodiment, the moving part layer is moved in the groove of the rail member (15, 23), but the explanation is not limited thereto. Any material that can expand and contract in one direction is fine.

Further, a telescopic guide member provided with stacking bearings such as a two-stage or three-stage type in which the guide member is provided on the side of the drawer of the office storage box may be used.

〔Effect of the invention〕

As explained above, since the extension and contraction mechanism is used to extend and contract the rail member, which requires a certain length, the semiconductor wafer can be moved to the operation side of the probe device, and the semiconductor wafer can be easily placed on the support. can do.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram for explaining the X-axis table and Y-axis table of the probe device of the present invention, FIG. 2 is a cross-sectional explanatory diagram for explaining the X-axis table and Y-axis table of FIG. 1, FIG. 3 is a top view for explaining the wafer flow method of an embodiment of a wafer prober to which the present invention is applied, and FIG. 4 is a plan view showing the external configuration of an embodiment of the wafer probe to which the present invention is applied. be. 1...Loader, 2...Inspection section, 2a...
Micro arm, 3... cassette, 4... wafer,
5...Support body, 6...Elevating part, 7
... X-axis table, 8... Y-axis table, 9... Base (wafer prober base), 11... Moving member, 13... X drive section, 14... Side end , 15.23...Rail member, 16...
X-axis base, 17, 25...Pole screw, 1
8... Support stand, 19.27... Pulse motor, 28... Rotating arm. Patent applicant: Tokyo Electron Ltd. Figure 2 Figure 3 Figure 4 Figure 4 6a Kukoa

Claims (3)

[Claims] (1) In a probe device that inspects the electrical characteristics of chips formed on a semiconductor wafer by installing a support on a rail member to which a semiconductor wafer is suction-supported and moving in the X-Y direction, the semiconductor wafer is attached to the support. A probe device characterized in that the probe device is equipped with an expansion and contraction mechanism so that the rail member expands and contracts with the movement of the support body when placed on the probe device. (2) The probe device according to claim 1, wherein the expansion and contraction mechanism is used only in the X-axis direction to move in the X direction. (3) The probe device according to claim 1, wherein the expansion and contraction mechanism is used only in the Y-axis direction to move in the Y direction.