JPH01161331U - - Google Patents
Info
- Publication number
- JPH01161331U JPH01161331U JP1988057545U JP5754588U JPH01161331U JP H01161331 U JPH01161331 U JP H01161331U JP 1988057545 U JP1988057545 U JP 1988057545U JP 5754588 U JP5754588 U JP 5754588U JP H01161331 U JPH01161331 U JP H01161331U
- Authority
- JP
- Japan
- Prior art keywords
- bump electrodes
- chip
- circuit device
- semiconductor circuit
- long side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057545U JPH01161331U (enExample) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057545U JPH01161331U (enExample) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161331U true JPH01161331U (enExample) | 1989-11-09 |
Family
ID=31283395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988057545U Pending JPH01161331U (enExample) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161331U (enExample) |
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1988
- 1988-04-28 JP JP1988057545U patent/JPH01161331U/ja active Pending