JPH01160852U - - Google Patents
Info
- Publication number
- JPH01160852U JPH01160852U JP4966588U JP4966588U JPH01160852U JP H01160852 U JPH01160852 U JP H01160852U JP 4966588 U JP4966588 U JP 4966588U JP 4966588 U JP4966588 U JP 4966588U JP H01160852 U JPH01160852 U JP H01160852U
- Authority
- JP
- Japan
- Prior art keywords
- internal lead
- lead
- semiconductor element
- grooves
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4966588U JPH01160852U (bg) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4966588U JPH01160852U (bg) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160852U true JPH01160852U (bg) | 1989-11-08 |
Family
ID=31275752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4966588U Pending JPH01160852U (bg) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160852U (bg) |
-
1988
- 1988-04-13 JP JP4966588U patent/JPH01160852U/ja active Pending
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