JPH01160842U - - Google Patents
Info
- Publication number
- JPH01160842U JPH01160842U JP4967388U JP4967388U JPH01160842U JP H01160842 U JPH01160842 U JP H01160842U JP 4967388 U JP4967388 U JP 4967388U JP 4967388 U JP4967388 U JP 4967388U JP H01160842 U JPH01160842 U JP H01160842U
- Authority
- JP
- Japan
- Prior art keywords
- metal package
- board
- thickness
- integrated circuit
- end edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4967388U JPH01160842U (lm) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4967388U JPH01160842U (lm) | 1988-04-13 | 1988-04-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01160842U true JPH01160842U (lm) | 1989-11-08 |
Family
ID=31275760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4967388U Pending JPH01160842U (lm) | 1988-04-13 | 1988-04-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01160842U (lm) |
-
1988
- 1988-04-13 JP JP4967388U patent/JPH01160842U/ja active Pending