JPH01157790A - Working table for laser beam machine - Google Patents

Abstract

PURPOSE:To convey even a large product by allowing other part than a product of a work, leaving only a worked product on a table, carrying this product and carrying it out to the outside of the working table. CONSTITUTION:A large product 16 is moved to the left side of a laser beam machine together with a working material 4 which has been held by a holding device 3. Subsequently, when a cylinder 13 provided on a table 1 and the holding device 3 are allowed to ascend in a state that the working material 4 has been held by the holding device 3, and the working material 4 is allowed to ascend, the product 16 which has been cut by a laser becomes a state it has been left on the table 1. Thereafter, a conveyor 8 is allowed to ascend by a cylinder 10 and a link mechanism 11, the product 16 is floated from a free bare 2, and thereafter, by operating the conveyor 8, the product 16 can be taken out.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to laser processing that performs cutting, etc. using a laser beam with extremely high energy density that is focused by a condensing lens or the like. This relates to the processing table of the machine.

(Prior art) In a laser processing machine that processes a workpiece such as a steel plate (hereinafter referred to as a workpiece) using a laser beam with high energy density, one end of the workpiece is gripped by a gripping device, and the above-mentioned A so-called turret pan type laser processing machine, which cuts into a predetermined shape by moving a gripping device, is well known as a typical example of a laser processing machine.

In this type of laser processing machine, small cut products and scraps are dropped to the bottom of the machine by opening and closing a chute installed on the processing table near the processing point, and then transferred to a conveyor or other transport device. I use it and take it out.

However, the size of the product take-out device such as the shooter described above is limited due to the configuration of the laser processing machine, and it is impossible to take out products of all sizes. Also, even if you could make the chute opening larger by combining complicated machines,
As the kinetic energy of the falling product increases,
There were problems such as the product being damaged when dropped. Further, when the shape is complicated, there is a problem that the protrusion or the like gets caught. In order to solve this problem, for products that cannot be taken out by the shooter 6 described above, a so-called micro-joint section is provided in which a part of the cutting section is left with a guard, and the workpiece 4 is After the entire process is completed, the guard is cut by cutting the micro-joint part with scissors or by bending it.

As another example, a method has been used in which laser cutting is performed without providing a micro joint, and after the laser processing is completed, the cut product is taken out using a separately provided automatic delivery device such as a robot.

(Problem to be Solved by the Invention) However, although the method of providing a micro joint is effective in terms of protecting the product, it requires the operator to process the material to be cut, so it is difficult to use the automatic laser cutting system. It had the disadvantage that it could not be driven or operated unmanned.

In addition, when automatic unloading equipment such as robots is used, the equipment is expensive and the structure of the gripping part of the unloading equipment becomes complicated in order to unload products with a wide variety of shapes. .

Therefore, an object of the present invention is to provide a processing table for a laser processing machine that is suitable for cutting large products or transporting products with protrusions.

[Structure of the Invention] (Means for Solving the Problems) That is, the present invention transmits a laser beam emitted from a laser oscillator by an optical means, guides it to a focusing bed, and focuses the laser beam by this focusing head. In a processing table on which a workpiece is placed when laser processing is performed, a support means for movably supporting the workpiece on the processing table, a gripping means for gripping and moving the workpiece; The present invention is characterized by a structure that includes a lifting means for lifting a workpiece, and a conveyance means for conveying a product cut out from the workpiece.

(Operation) With the above-described configuration, the workpiece supported by the support means on the processing table is gripped by the gripping means to perform laser processing, and after the machining is completed, the workpiece is moved to the elevating means by the gripping means. The lifting means raises the parts of the workpiece other than the product, leaving only the processed product on the table. By transporting this product using the transport means and taking it out of the processing table, even large products can be carried out. In addition, there is no risk of damage to products with protrusions.

(Example) The present invention will be described below with reference to a first example shown in FIGS. 1 to 5. FIG. 4 is a perspective view of a laser processing machine generally called a turret pan type, and FIG. 5 is a front view of FIG. 4. Further, FIG. 1 is a cross-sectional view of a main part of the laser processing machine shown in FIGS. 4 and 5 at the left end in the direction of arrow I, and FIG. 3 is a cross-sectional view of FIG. 2. This turret pan type laser processing machine (hereinafter referred to as a laser processing machine) usually has a processing table 1 equipped with a bearing (hereinafter referred to as a freebear) 2 having steel balls, etc., and a clamp device 3 that grips a workpiece 4. and move it.

On the other hand, a laser beam oscillated by a laser oscillator (not shown) is focused by a condenser housed in the processing head 5 and irradiated onto the workpiece to perform laser processing. 6 is a shooter for taking out products 16, scraps, etc. A freebearer 2 is disposed on a table 1 provided in a laser processing machine 7 by welding or screwing, and grooves 9 are provided at a plurality of locations in which a conveyor 8 serving as a conveying means is disposed. In this groove 9, a conveyor device 8 fixed on a slider 12 that can be moved up and down by an air cylinder 10 and a link mechanism 11 is disposed. Also, processing table 1
A plurality of air cylinders 13 serving as elevating means are arranged above. Reference numeral 14 denotes an electric motor for driving the conveyor 8, and the operation of the present invention in which the pulley 17 is rotated by a chain 15 or the like will be described below based on an embodiment.

A laser beam emitted from a laser oscillator (not shown) is focused by a processing head 5 to cut the material 4 to be cut. By opening the chute 6, the cut small products 16 and scraps are dropped to the lower part of the machine and taken out.

On the other hand, the large product 6 is moved to the left side of the laser processing machine 7 together with the workpiece 4 gripped by the gripping device 3.

Next, while the workpiece 4 is gripped by the gripping device, the cylinder 13 disposed on the table 1 and the gripping device 3 are raised to raise the workpiece 4, and the product 16 cut by the laser is placed on the table 1. It will remain on top. Thereafter, the conveyor 8 is raised by the cylinder 10 and the link mechanism 11 to float the product 16 above the free bearer 2, and then the product 16 can be taken out by operating the conveyor 8.

As described above, according to the first embodiment of the present invention, among laser cut products, large products that cannot be carried out of the machine by a chute or the like can be removed by a robot or the like. It is possible to carry out the work out of the machine inexpensively, reliably, and automatically without using a large-scale carrying out device. Furthermore, since the micro-joint method is not adopted, in which a guard is left in a part of the laser machine and carried out of the machine, it is possible to automatically take out the processed products, sort them, etc.

Therefore, when operating the laser processing machine, automatic operation, unmanned operation, etc. can be implemented by interlocking with a separate workpiece loading device.

It should be noted that the present invention is not limited to the embodiments described above, and the operation and effect will not change even if the lifting device for the workpiece, the conveyor device, etc. is not limited to a cylinder, but is driven by an electric motor. Further, the device for carrying out the product is not limited to a conveyor device, and a transfer device or the like, a gravity chute, or the like may be used.

Next, a second embodiment of the present invention will be explained based on FIG. 6. FIG. 6 is a perspective view of the entire laser processing machine. The laser processing apparatus has a freebear 2 disposed on a processing table 1, and a gripping device 3 grips and moves a workpiece 4. On the other hand, a laser beam oscillated by a laser oscillator (not shown) is guided, focused by a condensing device housed in the processing head 5, and irradiated onto the material to be cut, thereby performing laser processing.

A lifting device 21 is mounted on the processing table so as to be movable by a moving mechanism (not shown) along the direction in which the workpiece 4 flows.
A pair of lifting devices 4 are attached one behind the other, and a gripping device 3 for gripping one end of the workpiece 4 is attached to the lifting device 4 so as to be movable up and down by a cylinder, electric motor, etc. (not shown).

On the other hand, an unloading device 8 having a configuration similar to that of the first embodiment is provided on the unloading side for unloading the workpiece from the table 1 of the laser processing machine. In addition, on the unloading side of the laser processing machine described above, there is a material 4 to be cut that has been laser processed.
A set of gripping devices 20 for gripping the other end are arranged on the lifting device 22.

The operation of the second embodiment will be explained below with reference to FIG. Small products and scraps cut by a laser beam taken in from a laser oscillator (not shown) are dropped to the lower part of the machine and taken out by opening the chute 6, as in the first embodiment. On the other hand, the large product 16 is moved together with the workpiece 4 gripped by the gripping device 3 to the unloading side of the laser processing device. In this state, when the other end of the workpiece 4 is gripped by the gripping device 20 and the lifting devices 21 and 22 are simultaneously driven to raise the workpiece 4 together with the gripping devices 3 and 20, the laser-processed product 16 is lifted. It falls from the workpiece 4. Then, by driving the carry-out device 8 such as a conveyor, it becomes possible to automatically carry out products larger than the opening of the chute 6 out of the machine.

Also in this embodiment, the unloading device 8 is not limited to a conveyor device, and it is also possible to unload by a transfer device or the like, or to use a gravity chute or the like.

[Effects of the Invention] As explained above, according to the processing table of the present invention, large products can be carried out, and products having protrusions can also be carried out easily without damage.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of essential parts of the first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line ■-■ in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line ■-■ in FIG.
Fig. 4 is a perspective view of the laser processing machine, Fig. 5 is a front view of Fig. 4, Fig. 6 is an overall perspective view of the second embodiment of the present invention, and Fig. 7 is an explanatory diagram of the operation of the second embodiment. It is. 2... Freebear, 3... Gripping device, 6... Shooter, 7... Laser processing machine, 8... Conveyor,
10.13... Cylinder, 11... Link device, 14... Electric motor. Agent Patent Attorney Nori Ken Yudo Chika Ken Maru Figure 2 Figure J Figure 4-1ll Figure 5゛ 1

Claims (1)

[Claims] A laser beam emitted from a laser oscillator is transmitted by an optical means to a focusing head, and a workpiece is placed thereon when the laser beam is focused by the focusing head and laser processing is performed. At the processing table, a support means for movably supporting the workpiece on the processing table, a gripping means for grasping and moving the workpiece,
A processing table for a laser processing machine, characterized in that it is equipped with an elevating means for lifting the workpiece, and a transport means for transporting a product cut out from the workpiece.