JPH01157498U - - Google Patents
Info
- Publication number
- JPH01157498U JPH01157498U JP4725388U JP4725388U JPH01157498U JP H01157498 U JPH01157498 U JP H01157498U JP 4725388 U JP4725388 U JP 4725388U JP 4725388 U JP4725388 U JP 4725388U JP H01157498 U JPH01157498 U JP H01157498U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat
- main body
- conductive film
- shrinkable tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047253U JPH066559Y2 (ja) | 1988-04-06 | 1988-04-06 | 電子部品のシールド構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047253U JPH066559Y2 (ja) | 1988-04-06 | 1988-04-06 | 電子部品のシールド構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157498U true JPH01157498U (el) | 1989-10-30 |
| JPH066559Y2 JPH066559Y2 (ja) | 1994-02-16 |
Family
ID=31273476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988047253U Expired - Lifetime JPH066559Y2 (ja) | 1988-04-06 | 1988-04-06 | 電子部品のシールド構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066559Y2 (el) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170099A (ja) * | 1990-09-27 | 1992-06-17 | Mitsubishi Electric Corp | 電子部品のシールド構造 |
| JPH07202466A (ja) * | 1993-12-16 | 1995-08-04 | Schlegel Corp | シールド包被及び、シールド電子機器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014949U (el) * | 1973-06-05 | 1975-02-17 | ||
| JPS5858342U (ja) * | 1981-10-14 | 1983-04-20 | 株式会社リコー | 混成集積回路 |
| JPS6219746U (el) * | 1985-07-18 | 1987-02-05 | ||
| JPS6350199U (el) * | 1986-09-19 | 1988-04-05 |
-
1988
- 1988-04-06 JP JP1988047253U patent/JPH066559Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014949U (el) * | 1973-06-05 | 1975-02-17 | ||
| JPS5858342U (ja) * | 1981-10-14 | 1983-04-20 | 株式会社リコー | 混成集積回路 |
| JPS6219746U (el) * | 1985-07-18 | 1987-02-05 | ||
| JPS6350199U (el) * | 1986-09-19 | 1988-04-05 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170099A (ja) * | 1990-09-27 | 1992-06-17 | Mitsubishi Electric Corp | 電子部品のシールド構造 |
| JPH07202466A (ja) * | 1993-12-16 | 1995-08-04 | Schlegel Corp | シールド包被及び、シールド電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH066559Y2 (ja) | 1994-02-16 |