JPH01157468U - - Google Patents
Info
- Publication number
- JPH01157468U JPH01157468U JP15185788U JP15185788U JPH01157468U JP H01157468 U JPH01157468 U JP H01157468U JP 15185788 U JP15185788 U JP 15185788U JP 15185788 U JP15185788 U JP 15185788U JP H01157468 U JPH01157468 U JP H01157468U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- circuit board
- break groove
- break
- wall surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988151857U JPH0346518Y2 (US08177716-20120515-C00003.png) | 1988-11-24 | 1988-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988151857U JPH0346518Y2 (US08177716-20120515-C00003.png) | 1988-11-24 | 1988-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157468U true JPH01157468U (US08177716-20120515-C00003.png) | 1989-10-30 |
| JPH0346518Y2 JPH0346518Y2 (US08177716-20120515-C00003.png) | 1991-10-01 |
Family
ID=31426270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988151857U Expired JPH0346518Y2 (US08177716-20120515-C00003.png) | 1988-11-24 | 1988-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346518Y2 (US08177716-20120515-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327222A (ja) * | 1992-05-25 | 1993-12-10 | Kokusai Electric Co Ltd | セラミック多層配線基板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5123429A (ja) * | 1974-08-21 | 1976-02-25 | Matsushita Electric Ind Co Ltd | Nitsukeruchitangokinno seizokakohoho |
| JPS5197768A (US08177716-20120515-C00003.png) * | 1975-02-26 | 1976-08-27 | ||
| JPS51125865A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Method of manufacturing ceramic wiring substrate |
-
1988
- 1988-11-24 JP JP1988151857U patent/JPH0346518Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5123429A (ja) * | 1974-08-21 | 1976-02-25 | Matsushita Electric Ind Co Ltd | Nitsukeruchitangokinno seizokakohoho |
| JPS5197768A (US08177716-20120515-C00003.png) * | 1975-02-26 | 1976-08-27 | ||
| JPS51125865A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Method of manufacturing ceramic wiring substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327222A (ja) * | 1992-05-25 | 1993-12-10 | Kokusai Electric Co Ltd | セラミック多層配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346518Y2 (US08177716-20120515-C00003.png) | 1991-10-01 |
