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Filing date
Publication date
Application filedfiledCritical
Priority to JP1988046333UpriorityCriticalpatent/JPH0416425Y2/ja
Publication of JPH01157433UpublicationCriticalpatent/JPH01157433U/ja
Application grantedgrantedCritical
Publication of JPH0416425Y2publicationCriticalpatent/JPH0416425Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/11—Manufacturing methods
Landscapes
Testing Or Measuring Of Semiconductors Or The Like
(AREA)
